JPH0413096B2 - - Google Patents
Info
- Publication number
- JPH0413096B2 JPH0413096B2 JP58063445A JP6344583A JPH0413096B2 JP H0413096 B2 JPH0413096 B2 JP H0413096B2 JP 58063445 A JP58063445 A JP 58063445A JP 6344583 A JP6344583 A JP 6344583A JP H0413096 B2 JPH0413096 B2 JP H0413096B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- thin piece
- pressurizing
- polished
- shafts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58063445A JPS59192452A (ja) | 1983-04-11 | 1983-04-11 | 薄片研磨方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58063445A JPS59192452A (ja) | 1983-04-11 | 1983-04-11 | 薄片研磨方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59192452A JPS59192452A (ja) | 1984-10-31 |
| JPH0413096B2 true JPH0413096B2 (enrdf_load_stackoverflow) | 1992-03-06 |
Family
ID=13229451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58063445A Granted JPS59192452A (ja) | 1983-04-11 | 1983-04-11 | 薄片研磨方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59192452A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2580169B2 (ja) * | 1987-05-27 | 1997-02-12 | スピ−ドファム株式会社 | 加工圧制御機構付き平面研磨装置 |
| JPH0624475U (ja) * | 1992-08-31 | 1994-04-05 | 千寿製薬株式会社 | 釣用仕掛具 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5932349U (ja) * | 1982-08-23 | 1984-02-28 | スピ−ドフアム株式会社 | 平面研削装置におけるワ−クの装脱機構 |
-
1983
- 1983-04-11 JP JP58063445A patent/JPS59192452A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59192452A (ja) | 1984-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3841031A (en) | Process for polishing thin elements | |
| US3857123A (en) | Apparatus for waxless polishing of thin wafers | |
| JP3329288B2 (ja) | 半導体ウエーハおよびその製造方法 | |
| JP3605927B2 (ja) | ウエハーまたは基板材料の再生方法 | |
| US20100009605A1 (en) | Method of manufacturing semiconductor wafer | |
| TW201127553A (en) | Method and apparatus for conformable polishing | |
| JPH044744B2 (enrdf_load_stackoverflow) | ||
| WO2023116555A1 (zh) | 一种大面积石英晶片研磨装置及其研磨方法 | |
| JPS58184727A (ja) | シリコンウェ−ハの面を研削する方法 | |
| US20040038544A1 (en) | Method for processing a semiconductor wafer using double-side polishing | |
| JPH10166259A (ja) | サファイア基板研削研磨方法および装置 | |
| JPH0413096B2 (enrdf_load_stackoverflow) | ||
| US20100112905A1 (en) | Wafer head template for chemical mechanical polishing and a method for its use | |
| CN114932500B (zh) | 一种研抛一体装置及其运行方法 | |
| CN212240559U (zh) | 一种斜面研磨抛光用工装夹具及系统 | |
| JPS60118467A (ja) | 半導体ウエハ−の取付方法 | |
| JPS61241059A (ja) | 研磨装置 | |
| JPS6190868A (ja) | 研磨装置 | |
| JPS61117064A (ja) | 両面ポリシング装置 | |
| JPH08267358A (ja) | 半導体基板の同時鏡面研磨装置 | |
| JP2558864Y2 (ja) | ラッピング砥石定盤 | |
| JP2002127000A (ja) | ワーク研磨方法、ワーク研磨装置及び電子デバイス用基板 | |
| JPH11156708A (ja) | バッキングパッド貼付形成装置 | |
| JP2556605B2 (ja) | 研磨装置 | |
| JP3115213B2 (ja) | 両面研磨装置 |