JPH04113629A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH04113629A
JPH04113629A JP23306590A JP23306590A JPH04113629A JP H04113629 A JPH04113629 A JP H04113629A JP 23306590 A JP23306590 A JP 23306590A JP 23306590 A JP23306590 A JP 23306590A JP H04113629 A JPH04113629 A JP H04113629A
Authority
JP
Japan
Prior art keywords
diffusion layer
type diffusion
region
electrode
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23306590A
Other languages
Japanese (ja)
Inventor
Takahiro Koyama
小山 隆弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC IC Microcomputer Systems Co Ltd
Original Assignee
NEC IC Microcomputer Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC IC Microcomputer Systems Co Ltd filed Critical NEC IC Microcomputer Systems Co Ltd
Priority to JP23306590A priority Critical patent/JPH04113629A/en
Publication of JPH04113629A publication Critical patent/JPH04113629A/en
Pending legal-status Critical Current

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  • Bipolar Transistors (AREA)
  • Element Separation (AREA)

Abstract

PURPOSE:To prevent an electric current from flowing to a semiconductor substrate and to prevent a parasitic PNP transistor from being generated by a method wherein an equivalent circuit is realized also in a saturation region. CONSTITUTION:An N-type diffusion layer 3 which is biased to an N-type diffusion layer 1 is formed in the diffusion layer 1 ; an electrode 7 is formed in an opening 12 in an insulating layer 8 on it; a P-type diffusion layer 2 is formed in a P-type diffusion layer 2 is formed in a biased region inside a chip. An electrode 6 is formed in an opening 11 in the insulating layer 8 on it; it is used as a base. An N-type diffusion layer 3'' to be used as an emitter is formed inside the P-type diffusion layer 2; an N-type diffusion layer 3'' to be used as a collector is formed so as to surround the diffusion layer 3''. Electrodes 5, 6 are formed in openings 10, 11 in the insulating layer 8; a metal electrode 4 which has been connected to the diffusion layer 2 and which is used as a base is formed in an opening 9. Since the N-type diffusion layer 1 is biased at a maximum potential by means of the electrode 7, a parasitic PNP transistor with reference to a substrate 40 is not generated in a saturation region.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置に関し、特にバイポーラNPN)ラ
ンジスタ構造をもった集積回路基板に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and more particularly to an integrated circuit board having a bipolar NPN (NPN) transistor structure.

〔従来の技術〕[Conventional technology]

従来この種の半導体装置は、第3図、第4図に示す構造
を有し、その等価回路は活性領域の場合第5図、飽和領
域の場合第6図に示すようになっていた。即ち、第3図
乃至第6図において、N型拡散層1上にコレクタの電極
となるN型拡散層3とベースとなるP型拡散層2とを設
け、前記P型拡散層2内にエミッタとなるN型拡散層3
′を有し、基板40と接続されているP形波散層20で
他の領域と絶縁していた。尚、N型拡散層lは、P型半
導体基板40内に形成され、その低部はN型埋込層30
が形成されている。
Conventionally, this type of semiconductor device has the structure shown in FIGS. 3 and 4, and its equivalent circuit is shown in FIG. 5 for the active region and FIG. 6 for the saturated region. That is, in FIGS. 3 to 6, an N-type diffusion layer 3 serving as a collector electrode and a P-type diffusion layer 2 serving as a base are provided on an N-type diffusion layer 1, and an emitter is formed in the P-type diffusion layer 2. N-type diffusion layer 3
', and was insulated from other regions by the P-type wave diffusion layer 20 connected to the substrate 40. Note that the N-type diffusion layer l is formed in the P-type semiconductor substrate 40, and its lower part is the N-type buried layer 30.
is formed.

さらに、表面に絶縁層8が形成され、その開口部12;
  10,9に、それぞれコレクタの金属電極7、ベー
スの金属電極4、エミッタの金属電極5が形成される。
Further, an insulating layer 8 is formed on the surface, and an opening 12 thereof;
A collector metal electrode 7, a base metal electrode 4, and an emitter metal electrode 5 are formed at 10 and 9, respectively.

第5図では、非飽和領域での第3図、第4図のトランジ
スタ100が示されており、飽和すると第6図に示すよ
うに、トランジスタ100のベースをエミッタ、コレク
タをベース、接地ヲコレクタとする寄生pnP)ランジ
スタ200が生じる。
In FIG. 5, the transistor 100 of FIGS. 3 and 4 is shown in the non-saturation region, and when saturated, the base of the transistor 100 becomes the emitter, the collector becomes the base, and the ground becomes the collector. A parasitic pnP) transistor 200 is generated.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

前述した従来の半導体装置は、飽和領域で使用すると、
等価回路は第6図に示すように、P型半導体基板40と
接続されているP型拡散層20に対し、寄生PNP )
ランジスタ200が生じ、電流が基板(SUB)に流れ
出してしまうという欠点がある。
When the conventional semiconductor device mentioned above is used in the saturation region,
As shown in FIG. 6, the equivalent circuit is as follows:
There is a drawback that the transistor 200 is generated and current flows to the substrate (SUB).

本発明の目的は、このような欠点を除き、寄生PNP 
)ランジスタが生じないようにした半導体装置を提供す
ることにある。
The purpose of the present invention is to eliminate such drawbacks and to eliminate parasitic PNPs.
) An object of the present invention is to provide a semiconductor device in which transistors are not generated.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の半導体装置の構成は、半導体基板上の第1の導
電型の拡散層内に、バックゲートの電極となる第2の導
電型の第1領域とベースとなる第2領域とを設け、この
第2領域内に、エミッタとなる第3領域とコレクタとな
る第4領域とを設け、前記第3領域は第4領域でドーナ
ツ状に囲まれていることを特徴とする。
The structure of the semiconductor device of the present invention is such that a first region of a second conductivity type serving as a back gate electrode and a second region serving as a base are provided in a diffusion layer of a first conductivity type on a semiconductor substrate; A third region serving as an emitter and a fourth region serving as a collector are provided within the second region, and the third region is surrounded by the fourth region in a donut shape.

〔実施例〕〔Example〕

次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図、第2図は本発明の一実施例の半導体装置の平面
図、断面図である。第1図において、本実施例は、N型
拡散層1に、この拡散層lをバイアスする為のN型拡散
層3を設け、その上の絶縁層8に開口12を設けて電極
7を設け、チップ内の最高電位でバイアスした領域を設
け、P型拡散層2を形成し、その上の絶縁層8に開口1
1を設け、これを介して電極6を設けてベースとし、P
型拡散層2内にエミッタとなるN型拡散層3″と、前記
拡散層3″をドーナツ状に囲むコレクタとなるN型拡散
層3″とを形成し、絶縁層8にそれぞれ開口10.11
と電極5,6とを設けている。開口9を介して拡散層2
と接続されたベースの金属電極4を形成する。ベースと
なる拡散層2内に、エミッタとなるN型拡散層3″とエ
ミッタをドーナツ状に囲むコレクタとなるN型拡散層3
″を有しており、N型拡散層lは、電極7により最高電
位でバイアスされているので、飽和領域において、第6
図に示すような基板40に対する寄生PNPトランジス
タが発生しない。また、エミッタをコレクタによりドー
ナツ状に囲んでいるので、エミッタに対するコレクタの
対向面が4方向と十分な為、電流増幅率hFEが大きく
なる。
1 and 2 are a plan view and a sectional view of a semiconductor device according to an embodiment of the present invention. In FIG. 1, in this embodiment, an N-type diffusion layer 3 is provided in an N-type diffusion layer 1 for biasing this diffusion layer 1, an opening 12 is provided in an insulating layer 8 thereon, and an electrode 7 is provided. , a region biased at the highest potential within the chip is provided, a P-type diffusion layer 2 is formed, and an opening 1 is formed in the insulating layer 8 above it.
1 is provided, an electrode 6 is provided through this as a base, and P
An N-type diffusion layer 3'' serving as an emitter and an N-type diffusion layer 3'' serving as a collector surrounding the diffusion layer 3'' in a donut shape are formed in the type diffusion layer 2, and openings 10 and 11 are formed in the insulating layer 8, respectively.
and electrodes 5 and 6 are provided. Diffusion layer 2 through opening 9
A base metal electrode 4 connected to the base metal electrode 4 is formed. In the diffusion layer 2 which is the base, there is an N-type diffusion layer 3'' which is the emitter and an N-type diffusion layer 3 which is the collector and surrounds the emitter in a donut shape.
'', and the N-type diffusion layer l is biased at the highest potential by the electrode 7, so in the saturation region, the sixth
A parasitic PNP transistor to the substrate 40 as shown in the figure does not occur. Furthermore, since the emitter is surrounded by the collector in a donut shape, the number of opposing surfaces of the collector and the emitter in four directions is sufficient, so that the current amplification factor hFE becomes large.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明は、特に第5図に示す等価
回路を飽和領域においても実現することができ、電流を
半導体基板に流さないという効果がある。また、従来の
バーチカル型NPN トランジスタに対し、本発明は、
ラテラル型NPN)ランジスタなので、トランジスタを
順方向、逆方向で使用しても、寄生PNP )ランジス
タが生じないので、双方向スイッチ回路に最適となると
いう効果もあり、さらにhFHの大きさはエミッタに対
するコレクタの対向面で決定される為、本発明は、エミ
ッタをコレクタでドーナツ状に囲んでいるため、十分大
きなhytを提供できるという効果もある。
As explained above, the present invention is particularly effective in realizing the equivalent circuit shown in FIG. 5 even in the saturation region, and in preventing current from flowing through the semiconductor substrate. Furthermore, compared to the conventional vertical type NPN transistor, the present invention
Since it is a lateral type NPN) transistor, no parasitic PNP) transistor is generated even if the transistor is used in the forward or reverse direction, making it ideal for bidirectional switch circuits. Since the hyt is determined by the facing surface of the collector, the present invention has the effect that a sufficiently large hyt can be provided because the emitter is surrounded by the collector in a donut shape.

図、第2図は第1蚕のx−x’線に沿った断面図、第3
図、第4図は従来の半導体装置のそれぞれ平面図および
断面図、第5図は第3図の活性状態の等価回路図、第6
図は第3図の飽和状態の等価回路図である。
Figure 2 is a cross-sectional view of the first silkworm along the line x-x';
4 are a plan view and a sectional view, respectively, of a conventional semiconductor device, FIG. 5 is an equivalent circuit diagram of the active state of FIG. 3, and FIG.
The figure is an equivalent circuit diagram of the saturated state shown in FIG.

■・・・・・・N型拡散層、2・・・・P型拡散層、3
・・N型拡散層、4,5,6.7・・・・・・金属電極
、8・・・・・・絶縁層、9,10,11.12・・印
・開口、100・・・・・・NPN)ランジスタ、20
0・旧・・寄生PNP)ランジスタ、20・川・・P型
拡散層、3o・・・・・N型埋込層、40・・・・・・
P型半導体基板。
■...N-type diffusion layer, 2...P-type diffusion layer, 3
...N-type diffusion layer, 4,5,6.7...Metal electrode, 8...Insulating layer, 9,10,11.12...Mark/opening, 100... ...NPN) transistor, 20
0. Old... Parasitic PNP) transistor, 20. River... P-type diffused layer, 3o... N-type buried layer, 40...
P-type semiconductor substrate.

代理人 弁理士  内 原   晋Agent: Patent Attorney Susumu Uchihara

【図面の簡単な説明】[Brief explanation of drawings]

Claims (1)

【特許請求の範囲】[Claims] 半導体基板上の第1の導電型の拡散層内に、バックゲー
トの電極となる第2の導電型の第1領域とベースとなる
第2領域とを設け、この第2領域内に、エミッタとなる
第3領域とコレクタとなる第4領域とを設け、前記第3
領域は第4領域でドーナツ状に囲まれていることを特徴
とする半導体装置。
A first region of a second conductivity type that becomes an electrode of a back gate and a second region that becomes a base are provided in a diffusion layer of a first conductivity type on a semiconductor substrate, and an emitter and an emitter are provided in this second region. a third region that is a collector and a fourth region that is a collector;
A semiconductor device characterized in that the region is surrounded by a fourth region in a donut shape.
JP23306590A 1990-09-03 1990-09-03 Semiconductor device Pending JPH04113629A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23306590A JPH04113629A (en) 1990-09-03 1990-09-03 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23306590A JPH04113629A (en) 1990-09-03 1990-09-03 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH04113629A true JPH04113629A (en) 1992-04-15

Family

ID=16949253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23306590A Pending JPH04113629A (en) 1990-09-03 1990-09-03 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH04113629A (en)

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