JPH04111966A - Method for joining metallic member and ceramic member - Google Patents
Method for joining metallic member and ceramic memberInfo
- Publication number
- JPH04111966A JPH04111966A JP23086790A JP23086790A JPH04111966A JP H04111966 A JPH04111966 A JP H04111966A JP 23086790 A JP23086790 A JP 23086790A JP 23086790 A JP23086790 A JP 23086790A JP H04111966 A JPH04111966 A JP H04111966A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramic
- chip
- oxygen
- ceramic member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 39
- 238000005304 joining Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 73
- 239000002184 metal Substances 0.000 claims abstract description 73
- 238000005219 brazing Methods 0.000 claims abstract description 44
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 11
- 230000006698 induction Effects 0.000 claims abstract description 7
- 239000000945 filler Substances 0.000 claims description 28
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 25
- 229910052760 oxygen Inorganic materials 0.000 claims description 25
- 239000001301 oxygen Substances 0.000 claims description 25
- 230000003796 beauty Effects 0.000 abstract 1
- 230000000593 degrading effect Effects 0.000 abstract 1
- 238000006722 reduction reaction Methods 0.000 description 9
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 229910052726 zirconium Inorganic materials 0.000 description 6
- 238000002845 discoloration Methods 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005338 heat storage Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910017945 Cu—Ti Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野）
本発明は、金属部材とセラミックス部材との接合方法に
係り、特に、ＩＣチップ、ＬＳＩチップ等を搭載するチ
ップマウンタにおける把持装置等に適用するのに好適な
金属部材とセラミックス部材との接合方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for joining metal members and ceramic members, and is particularly applicable to a gripping device in a chip mounter on which IC chips, LSI chips, etc. are mounted. The present invention relates to a method of joining a metal member and a ceramic member suitable for.
従来から、チップマウンタ等の把持装置においては、耐
摩耗性を向上させるために、金属相別からなる把持部材
の先端部に、補強用としてセラミック製のチップを接合
することが行なわれており、このチップの材料としては
、耐食性が大きく融点が高くしかも熱膨張率が小さい、
ＺｎＯ２（ジルコニア）が用いられることがある。Conventionally, in gripping devices such as chip mounters, in order to improve wear resistance, a ceramic chip has been bonded to the tip of a gripping member made of a metal phase for reinforcement. The material for this chip is highly corrosion resistant, has a high melting point, and has a low coefficient of thermal expansion.
ZnO2 (zirconia) may be used.
このような金属部材にジルコニアからなるセラミックス
部材を接合するためには、金属部材の先端部にＴｉ等の
活性金属を含むろう材を介してセラミックス部材を組付
けた後、炉中で前記ろう材を溶融することにより、前記
金属部材とセラミックス部材とを接合するようになって
いる。In order to join a ceramic member made of zirconia to such a metal member, the ceramic member is assembled to the tip of the metal member via a brazing filler metal containing an active metal such as Ti, and then the brazing filler metal is heated in a furnace. By melting the metal member and the ceramic member, the metal member and the ceramic member are joined.
この場合、前記ろう材中のＴｉ等の活性金属は、酸素と
の親和力が強いことから、ジルコニア中の酸素と反応す
るのみならず、炉内雰囲気中の酸素とも反応してしまい
、これにより、ろうＨの活性が失われてしまうため、金
属部材とセラミックス部材との適正な接合を行なうこと
ができないという問題点があった。In this case, the active metal such as Ti in the brazing filler metal has a strong affinity for oxygen, so it not only reacts with the oxygen in the zirconia but also reacts with the oxygen in the furnace atmosphere. Since the activity of the wax H is lost, there is a problem in that the metal member and the ceramic member cannot be properly joined.
このため、従来から、真空中あるいは不活性ガス雰囲気
中で、前記ろう材を溶融することにより、前記金属部材
どセラミックス部材とを接合することが行なわれていた
。For this reason, conventionally, the metal member and the ceramic member have been joined by melting the brazing filler metal in a vacuum or an inert gas atmosphere.
（発明が解決しようとげる課題〕
しかしながら、航速した従来の接合方法におけるように
、真空中あるいは不活性ガス雰囲気中でろう材を溶融す
ることにより、金属部材とセラミックス部材との接合を
行なうと、前記ろう材中のＴｉ等の活性金属がジルコニ
ア中の酸素ど反応して下記の化学式に基づく還元作用が
発生ずることになる。(Problems to be Solved by the Invention) However, when joining a metal member and a ceramic member by melting a brazing filler metal in a vacuum or an inert gas atmosphere, as in the conventional joining method, the above-mentioned Active metals such as Ti in the brazing filler metal react with oxygen in zirconia, resulting in a reduction action based on the following chemical formula.
Ｚ ｒ Ｏ２ｅ−２Ｔ ｉ →Ｚ ｒ ＋ ２ Ｔ ｉ
○・−・−・（１）そして、この還元反応により、セラ
ミックス部材が黒色に変色してしまい、美感８１ｆｆｉ
、うという問題点を有している。このセラミックス部材
の黒変の原因はまだ明らかにはされていないが、単体の
ジルコニウムが生じるためであると１１１定されている
。しかも、前記ジルコニアの）Ｗ元反応に、ノ：す、変
色部分の強度および硬度等の機械的性質の低下を招来し
てしまい、チップマウンタ宿に適した接合を行なうこと
ができないという問題点を有していた。Z r O2e-2T i →Z r + 2 T i
○・−・−・(1) Due to this reduction reaction, the ceramic member changes color to black, and the aesthetic appearance is 81ffi.
, it has the following problems. Although the cause of this blackening of ceramic members has not yet been clarified, it has been determined that it is due to the formation of a single element of zirconium. In addition, the W-based reaction of the zirconia causes a decrease in mechanical properties such as strength and hardness of the discolored portion, making it impossible to perform a bond suitable for chip mounters. had.
本発明は、前述した点に鑑みてなされたもので、ジルコ
ニアの還元反応による変色および機械的性質の低下を防
止して適正な接合を行なうことのできる金属部材とセラ
ミックス部材との接合１ノ法を提供することを目的とす
る。The present invention has been made in view of the above-mentioned points, and is a first method for joining metal members and ceramic members that can prevent discoloration and deterioration of mechanical properties due to the reduction reaction of zirconia and perform proper joining. The purpose is to provide
前記目的を達成するため本発明に係る金属部材とセラミ
ックス部材との接合方法は、金属部材にジルコニアから
なるセラミックス部イオをろう拐を介して組付けた後、
前記ろう材を溶融して前記金属部材とセラミックス部材
とを接合する金属部材とセラミックス部材どの接合方法
において、前記金属部材と前記セラミックス部材どの間
に活性金属からなるろう材を配設し、酸素含有雰囲気中
で、前記金属部材とセラミックス部材とを前記ろう材を
介して加圧しながら、高周波誘導加熱により前記ろう材
を溶融して前記金属部材とセラミックス部材どを接合さ
せるようにしたことを特徴としている。In order to achieve the above object, the method for joining a metal member and a ceramic member according to the present invention includes: after assembling a ceramic part made of zirconia to a metal member via soldering,
In any method for joining metal members and ceramic members in which the metal member and the ceramic member are joined by melting the brazing filler metal, a brazing filler metal made of an active metal is disposed between the metal member and the ceramic member, and an oxygen-containing brazing filler metal is disposed between the metal member and the ceramic member. The metal member and the ceramic member are bonded by melting the brazing material by high-frequency induction heating while pressurizing the metal member and the ceramic member through the brazing material in an atmosphere. There is.
前述した構成からなる本発明によれば、酸素含有雰囲気
中で、金属部材とジルコニアからなるセラミックス部材
とをろう材を介して加圧しながら、高周波誘導加熱によ
りろう材を溶融して金属部材とセラミックス部材とを接
合させるようにしているので、前記ろう材を極めて短時
間で溶融することにより、ろう材中の活性金属と雰囲気
中の酸素との反応が最小限とされ、還元作用としては、
ジルコニア中の酸素とろう材中の活性金属どの還元くし
な（プればならないという不都合を生じる。According to the present invention having the above-described configuration, the metal member and the ceramic member made of zirconia are pressurized through the brazing material in an oxygen-containing atmosphere, and the brazing material is melted by high-frequency induction heating to bond the metal member and the ceramic member together. By melting the brazing filler metal in an extremely short time, the reaction between the active metal in the brazing filler metal and oxygen in the atmosphere is minimized, and the reduction effect is as follows:
This creates the inconvenience of having to reduce the oxygen in the zirconia and the active metal in the brazing filler metal.
また、各発熱部３ａのそれぞれの熱履歴に対応して供給
電力を詳細に補正・制御することにより、ある程度各発
熱部３ａの下方のグレーズ層２の蓄熱間に対応覆る温度
制御がなされ、適切な印字温度が得られるが、補正デー
タを記憶したり、通電履歴を記憶するための集積回路素
子容量が増大し、著しいコストアップになるという欠点
があった。In addition, by correcting and controlling the supplied power in detail in accordance with the respective thermal history of each heat generating part 3a, temperature control that covers the heat storage in the glaze layer 2 below each heat generating part 3a can be performed to a certain extent, and the temperature can be appropriately controlled. However, the disadvantage is that the integrated circuit element capacity for storing correction data and energization history increases, resulting in a significant increase in cost.
本発明は、このような点に鑑１）、安価に製造できるば
かりでなく、高速化に対応でき、しか０宥命を長くする
ことのできるサーマルヘッドを提供することを目的とし
ている。In view of the above points, (1) an object of the present invention is to provide a thermal head that can not only be manufactured at low cost, but also be able to cope with high speeds and has a long zero-end life.
〔課題を解決するための手段）
前述した目的を達成するため本発明の請求項第１項のり
一−マルヘッドは、基板」二に蓄熱層を形成し、この蓄
熱層上に複数個の発熱素子を形成する発熱抵抗体層を積
層するとともに、前記各発熱素子に選択的に通電するた
めの共通給電体層および個別給電体層を形成し、さらに
これらの上に保護層を積層してなるサーマルヘッドにお
いて、前記把持部材１の中央部には、前記把持装置に把
持部材１をねじ止めするための孔部３が穿設されている
。また、前記把持装置の把持側端面には、下方に延在す
る把持片４が突出形成されており、この把持片４の前面
には、断面形状はぼ１−字状を有するジルコニアからな
るゼラミックス部材たる補強用のデツプ５が、活性金属
からなりチップ５の接合面と同じ大きさを有するろう材
６を介して固着されている。[Means for Solving the Problems] In order to achieve the above-mentioned object, the glue head of claim 1 of the present invention includes a heat storage layer formed on a substrate 2, and a plurality of heating elements on the heat storage layer. In addition to laminating heat generating resistor layers to form a heating element, a common power supply layer and an individual power supply layer for selectively energizing each of the heat generating elements are formed, and a protective layer is further laminated thereon. In the head, a hole 3 is bored in the center of the gripping member 1 for screwing the gripping member 1 to the gripping device. Further, a gripping piece 4 extending downward is formed protrudingly on the gripping side end surface of the gripping device, and a zirconia gel having a cross-sectional shape of a square shape is provided on the front surface of the gripping piece 4. A reinforcing depth 5, which is a mix member, is fixed via a brazing material 6 made of active metal and having the same size as the bonding surface of the chip 5.
そして、前記把持部材１の係合片２を把持装置の取（＝
１位置に装着した状態で、前記孔部３を貝通ずる図示し
ないねじにより締付けることにより、前記把持部材１を
把持装置に固定し、前記デツプ５の先端部でＩＣチップ
、ＬＳＩチップ秀の所定の加工部材を把持するようにな
されている。Then, the engaging piece 2 of the gripping member 1 is attached to the gripping device (=
With the holding member 1 mounted in one position, the holding member 1 is fixed to the holding device by tightening the hole 3 with a screw (not shown) that passes through the shell, and the tip of the depth 5 is used to hold the IC chip or LSI chip in a predetermined position. It is designed to grip the workpiece.
つぎに、本実施例において把持部材１にチップ５を接合
する方法について説明する。Next, a method for joining the chip 5 to the gripping member 1 in this embodiment will be explained.
まず、金属からなる前記把持部材１おＪ：びジルコニア
からなるデツプ５を所定形状に形成するとともに、Ａｃ
ｔ−Ｃｕ−Ｔｉ系の活性金属からなり箔状、粉末あるい
はベース１〜状を有するろう材６を用意する。その後、
把持部材１、チップ５およびろう材６を１〜リクレン洗
浄あるいは超音波洗浄等の手段により洗浄する。First, the gripping member 1 made of metal and the depth 5 made of zirconia are formed into a predetermined shape, and
A brazing filler metal 6 made of a t-Cu-Ti based active metal and having a foil shape, a powder shape, or a base shape is prepared. after that,
The gripping member 1, the chip 5, and the brazing material 6 are cleaned by means such as 1~reclean cleaning or ultrasonic cleaning.
そして、前記把持部々Ａ１の把持片４の前面に、ろう材
６を介してデツプ５を組（＝ｌける。この状態で、前記
把持部材１を図示しない所定の治具に装着し、この治具
により前記把持部材１とチップ５との接合方向（第１図
中矢印方向）にＩ Ｋｇｆ ／ ｃＭ以上の圧力で加圧
しながら、大気中あるいは活性雰囲気中という酸素を含
有する雰囲気中において、治具の外周にコイルを巻回す
るなどして高周波誘導加熱装置によりろう材６の融点く
約８５０ ’Ｃ）以上に加熱して前記ろう材６を溶融さ
せることにより、前記把持部４Ｊ−１にチップ５を接合
さけるようになっている。Then, a depth 5 is assembled (=l) on the front surface of the gripping piece 4 of the gripping portion A1 via the brazing material 6. In this state, the gripping member 1 is mounted on a predetermined jig (not shown), and this While pressurizing the gripping member 1 and the chip 5 in the joining direction (arrow direction in FIG. 1) with a pressure of I Kgf/cM or more using a jig, in an atmosphere containing oxygen such as air or an active atmosphere, The holding portion 4J-1 is heated by winding a coil around the outer periphery of the jig and heating the brazing material 6 to a temperature above the melting point of the brazing material 6 (approximately 850'C) or higher using a high-frequency induction heating device. The chip 5 is avoided from being bonded to the tip.
この場合に、前記ろう材６が前記チップ５の接合面と同
じ大きさを有するとともに、前記治具によりチップ５と
ろう材６とを加圧密着させながら、接合を行なうように
しているので、デツプ５どろう材６との接触面積が増大
し、ろう材６と周囲雰囲気中の酸素どの接触が極めて少
なくなり、ろう材６中の丁１は雰囲気中の酸素とはほと
／υど反応せず、この結果、デツプ５のジルコニア（Ｚ
ｒ０２）中の酸素とろう材６中のＴ１どの前記（１）式
に塁づく還元反応が行なわれる。In this case, the brazing filler metal 6 has the same size as the bonding surface of the chip 5, and the bonding is performed while the chip 5 and the brazing filler metal 6 are brought into close contact with each other under pressure using the jig. The contact area of the depth 5 with the brazing filler metal 6 increases, and the contact between the filler filler metal 6 and oxygen in the surrounding atmosphere becomes extremely small, and the depth 1 in the filler filler metal 6 hardly reacts with the oxygen in the atmosphere. As a result, the depth 5 zirconia (Z
A reduction reaction between the oxygen in r02) and T1 in the brazing filler metal 6 is carried out based on the formula (1).
また、前記ろう利６の溶融を高周波誘導＋ＩＱ熱装置に
より行なうＪ：うにしているので、前記ろう祠６を極め
て短時間で溶融することができ、この結果、ろう材６中
のＴｉとジルコニア中の酸素との反応を、把持部材１と
チップ５との接合に必要な最小限に」トめ単体のジルコ
ニウムの生成を抑止している。Furthermore, since the solder metal 6 is melted using a high-frequency induction + IQ heating device, the solder metal 6 can be melted in an extremely short time, and as a result, the Ti and zirconia in the solder metal 6 can be melted. The reaction with the oxygen contained therein is reduced to the minimum necessary for bonding the gripping member 1 and the chip 5, thereby suppressing the formation of individual zirconium.
さらに、前記チップ５のジルコニア中の酸素どＴｉとの
還元反応により生成された単体のシルコウム（７ｒ）は
、前述したようにろう材６の溶融１時の雰囲気が人気ま
たは活性雰囲気という酸素を含有Ｊる雰囲気であるため
、ジルコニア外周部の雰囲気と反応し、下記の（２）式
に基づく酸化反応により、侵入した酸素と結合して再度
ジルコニアとなり、これにより、チップ５の変色あるい
は材質の変化等の発生を防止することができる。Furthermore, the simple substance silium (7r) produced by the reduction reaction with oxygen and Ti in the zirconia of the chip 5 contains oxygen, which is known as the popular or active atmosphere at the time of melting the brazing filler metal 6, as described above. Since the atmosphere is turbulent, it reacts with the atmosphere around the zirconia, and through an oxidation reaction based on the following equation (2), it combines with the oxygen that has entered and becomes zirconia again, resulting in discoloration of the chip 5 or a change in the material. etc. can be prevented from occurring.
Ｚ ｒ＋０２−＋Ｚ ｒ０２ ・−・−（
２）したがって、本実施例においては、デツプ５のジル
コニア中の酸素とろう材６中のｌｉとの還元反応、なら
びに、大気あるいは活性雰囲気中の酸素とジルコニウム
との酸化反応が行なわれるので、単体のジルコニウムが
存在Ｊ−ることか４ｒ＜、デツプ５の変色あるいは利賀
の変化等の発生を防止することができる。この結果、美
感を損うことがなく、しかも、チップ５の強度および硬
度等の機械的性質の低下を防止することができ、チップ
マウンタ等に適した接合を行なうことができる。Z r+02-+Z r02 ・-・-(
2) Therefore, in this example, a reduction reaction between oxygen in the zirconia in the depth 5 and li in the brazing filler metal 6, and an oxidation reaction between oxygen in the air or active atmosphere and zirconium are carried out, so that the simple substance The presence of zirconium can prevent the occurrence of discoloration of the depth 5 or change of the thickness. As a result, it is possible to prevent the mechanical properties of the chip 5 from deteriorating, such as strength and hardness, without impairing the aesthetic appearance, and to perform bonding suitable for a chip mounter or the like.
第２図は本発明の接合方法を適用する把持装置の把持部
材の他の実施例を示すものであり、金属部材たる把持部
材１の把持側端面には、下方に延在する把持片４が突出
形成されており、この把持片４の中央部には、下方に延
在づる保持溝７が形成されている。そして、この保持溝
７には、平板状のチップ５が前記保持溝７の上端面に配
置されたろう材６を介して固着されている。FIG. 2 shows another embodiment of the gripping member of the gripping device to which the joining method of the present invention is applied, in which a gripping piece 4 extending downward is provided on the gripping side end surface of the gripping member 1, which is a metal member. A holding groove 7 is formed in the center of the gripping piece 4 so as to extend downward. A flat chip 5 is fixed to the holding groove 7 via a brazing material 6 disposed on the upper end surface of the holding groove 7 .
本実施例においては、前記把持部材１、チップ５および
ろう材６を所定形状に作成して洗浄した後、前記把持部
材１の把持片４の保持溝７に、ろう材６を介してチップ
５を組付ける。この状態で、本実施例においては、治具
により前記把持片４の保持溝７の上端面とデツプ５との
接合方向く第２図（ａ）中矢印方向）に１Ｋｇ ｆ ／
ｃｉ以上の圧力で加圧しながら、大気中あるいは活性
雰囲気という酸素を含有する雰囲気中において、高周波
誘導加熱装置により加熱して前記ろう材６を溶融さゼる
ことにより、前記把持部材１にデツプ５を接合させるよ
うになっている。In this embodiment, after the gripping member 1, the chip 5, and the brazing material 6 are formed into predetermined shapes and cleaned, the chip 5 is inserted into the holding groove 7 of the gripping piece 4 of the gripping member 1 through the brazing material 6. Assemble. In this state, in this embodiment, 1 kg f /
A depth 5 is formed on the gripping member 1 by heating the brazing material 6 with a high-frequency induction heating device in the atmosphere or an active atmosphere containing oxygen while applying a pressure of ci or more. It is designed to join.
したがって、本実施例においても前記実施例と同様に、
チップ５のジルコニア中の酸素とろう月６中のＴ１との
還元反応、ならびに、ジルコニウムと雰囲気中の酸素と
の酸化反応が行なわれるので、チップ５の変色あるいは
材質の変化等の発生を防止することができ、この結果、
美感を損うことがなく、しかも、チップ５の強度および
硬度等の機械的性質の低下を防止することができ、チッ
プマウンタ等に適した接合を行なうことができる。Therefore, in this example as well, as in the previous example,
A reduction reaction between the oxygen in the zirconia of the chip 5 and T1 in the wax 6 and an oxidation reaction between the zirconium and the oxygen in the atmosphere are performed, so that discoloration of the chip 5 or change in material is prevented. As a result of this, you can
The aesthetic appearance is not impaired, and furthermore, it is possible to prevent deterioration of the mechanical properties such as strength and hardness of the chip 5, and it is possible to perform bonding suitable for chip mounters and the like.
なお、本発明は、前述した両実施例に限定されるもので
はなく、必要に応じて種々の変更が可能である。Note that the present invention is not limited to the two embodiments described above, and various changes can be made as necessary.
以上説明したように本発明に係る金属部材とセラミック
ス部材との接合方法においては、ジルコニア中の酸素と
ろう材中の活性金属との還元反応、ならびにジルコニウ
ムと酸素含有雰囲気中の酸素との酸化反応が行なわれる
ので、セラミックス部材の変色あるいは材質の変化等の
発生を確実に防止することができる。この結果、美感を
損うことがなく、しかも、セラミックス部材の強度およ
び硬度等の機械的性質の低下を防止することができ、工
作機械に適した接合を行なうことができる。As explained above, in the method of joining a metal member and a ceramic member according to the present invention, there is a reduction reaction between oxygen in zirconia and an active metal in a brazing filler metal, and an oxidation reaction between zirconium and oxygen in an oxygen-containing atmosphere. Therefore, it is possible to reliably prevent the ceramic member from discoloring or changing its material quality. As a result, it is possible to prevent the mechanical properties of the ceramic member from deteriorating, such as strength and hardness, without impairing the aesthetic appearance, and to perform joining suitable for machine tools.
第１図は本発明に係る金属部材とセラミックス部材との
接合方法を適用する把持装置の把持部材の実施例を示す
側面図、第２図（ａ）、（ｂ）は他の実施例を示す側面
図と正面図である。
１・・・把持部材、４・・・把持片、５・・・チップ、
６・・・ろう材。
第１図FIG. 1 is a side view showing an embodiment of a gripping member of a gripping device to which the method of joining a metal member and a ceramic member according to the present invention is applied, and FIGS. 2(a) and (b) show other embodiments. They are a side view and a front view. 1... Gripping member, 4... Gripping piece, 5... Chip,
6... Brazing material. Figure 1
Claims (1)
う材を介して組付けた後、前記ろう材を溶融して前記金
属部材とセラミックス部材とを接合する金属部材とセラ
ミックス部材との接合方法において、前記金属部材と前
記セラミックス部材との間に活性金属からなるろう材を
配設し、酸素含有雰囲気中で、前記金属部材とセラミッ
クス部材とを前記ろう材を介して加圧しながら、高周波
誘導加熱により前記ろう材を溶融して前記金属部材とセ
ラミックス部材とを接合させるようにしたことを特徴と
する金属部材とセラミックス部材との接合方法。A method for joining a metal member and a ceramic member, in which a ceramic member made of zirconia is assembled to a metal member via a brazing material, and then the brazing material is melted to join the metal member and the ceramic member. A brazing filler metal made of an active metal is disposed between the brazing filler metal and the ceramic member, and the brazing filler metal is heated by high-frequency induction heating while pressurizing the metal member and the ceramic member through the brazing filler metal in an oxygen-containing atmosphere. A method for joining a metal member and a ceramic member, characterized in that the metal member and the ceramic member are joined by melting the metal member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2230867A JPH0783935B2 (en) | 1990-08-31 | 1990-08-31 | Method for joining metal member and ceramic member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2230867A JPH0783935B2 (en) | 1990-08-31 | 1990-08-31 | Method for joining metal member and ceramic member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04111966A true JPH04111966A (en) | 1992-04-13 |
| JPH0783935B2 JPH0783935B2 (en) | 1995-09-13 |
Family
ID=16914552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2230867A Expired - Lifetime JPH0783935B2 (en) | 1990-08-31 | 1990-08-31 | Method for joining metal member and ceramic member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0783935B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007331026A (en) * | 2006-06-19 | 2007-12-27 | Nhk Spring Co Ltd | Joined body, and joining brazing filler metal |
| US7537194B2 (en) | 2006-06-29 | 2009-05-26 | Ckd Corporation | Flow control valve |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60122776A (en) * | 1983-12-07 | 1985-07-01 | 日本特殊陶業株式会社 | Cera mic and metal bonded body and manufacture |
| JPH0280381A (en) * | 1988-09-16 | 1990-03-20 | Toshio Narita | Method for bonding metal to zirconium oxide-based ceramic |
| JPH02196072A (en) * | 1989-01-23 | 1990-08-02 | Mazda Motor Corp | Method for joining silicon nitride-based ceramics |
-
1990
- 1990-08-31 JP JP2230867A patent/JPH0783935B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60122776A (en) * | 1983-12-07 | 1985-07-01 | 日本特殊陶業株式会社 | Cera mic and metal bonded body and manufacture |
| JPH0280381A (en) * | 1988-09-16 | 1990-03-20 | Toshio Narita | Method for bonding metal to zirconium oxide-based ceramic |
| JPH02196072A (en) * | 1989-01-23 | 1990-08-02 | Mazda Motor Corp | Method for joining silicon nitride-based ceramics |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007331026A (en) * | 2006-06-19 | 2007-12-27 | Nhk Spring Co Ltd | Joined body, and joining brazing filler metal |
| US7537194B2 (en) | 2006-06-29 | 2009-05-26 | Ckd Corporation | Flow control valve |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0783935B2 (en) | 1995-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2002066200A8 (en) | Reducing metals as a brazing flux | |
| EP0515078A3 (en) | Bonding to nickel-titanium alloy | |
| JPH0367986B2 (en) | ||
| JPH04111966A (en) | Method for joining metallic member and ceramic member | |
| JPH02124778A (en) | Joined body of two pieces of aln ceramics and heat radiating device using same | |
| JPS59232692A (en) | Brazing filler metal for joining ceramics and metal or the like and composite body composed of ceramics and metal or the like using said brazing filler metal | |
| JPH08274423A (en) | Ceramic circuit board | |
| JPS60141681A (en) | Ceramic member for adhesion and method therefor | |
| JPH01181988A (en) | Manufacture of rocker arm | |
| JPS61169190A (en) | Composite brazing filler metal | |
| JP3352823B2 (en) | Joining method between silicon carbide ceramics and silicon | |
| JP2003048785A (en) | Joined structure of metallic member and ceramic member and method of joining metallic member and ceramic member | |
| JPH01270574A (en) | Ceramics-joining component and joining method thereof | |
| JPS5913676A (en) | Bonded body of ceramic member and metal member and manufacture | |
| JP3539456B2 (en) | Corrosion resistant inkjet printhead and method of manufacturing the same | |
| JPH01249669A (en) | Ceramic circuit board | |
| JPS60231474A (en) | Method of soldering ceramic and metal | |
| JPH01179769A (en) | Method for bonding ceramic material and metallic material | |
| JPH04305069A (en) | Method for joining alumina-based sintered body | |
| JP3531838B2 (en) | Method of forming metal layer on zirconia ceramics surface | |
| Wielage et al. | Active Brazing of Metal and Ceramic | |
| JP2669321B2 (en) | TCP tower mounted device | |
| JPH0234945A (en) | Brazing method | |
| JP3292767B2 (en) | Joining method of silicon carbide ceramics and silicon | |
| JPS62112051A (en) | Oxygen sensor |