JPH04111730U - Molecular beam epitaxy equipment - Google Patents

Molecular beam epitaxy equipment

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Publication number
JPH04111730U
JPH04111730U JP2231091U JP2231091U JPH04111730U JP H04111730 U JPH04111730 U JP H04111730U JP 2231091 U JP2231091 U JP 2231091U JP 2231091 U JP2231091 U JP 2231091U JP H04111730 U JPH04111730 U JP H04111730U
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Japan
Prior art keywords
cell
shutter
temperature
molecular beam
semiconductor wafer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2231091U
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Japanese (ja)
Inventor
智之 松田
Original Assignee
関西日本電気株式会社
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Priority to JP2231091U priority Critical patent/JPH04111730U/en
Publication of JPH04111730U publication Critical patent/JPH04111730U/en
Withdrawn legal-status Critical Current

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  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

(57)【要約】 【目的】超高真空チャンバー内への余分な物資の分子線
の飛散を防止し、且つセル内の温度が安定した状態で物
資の分子線を半導体ウェーハに向けて飛散させることを
目的とする。 【構成】セル1の開口面に二重シャッタ2,3を配置
し、セル内に供給された物質を所定温度に加熱すると、
一旦セル開口面に近いシャッタ2を開放してセル内の温
度変化を安定させてからシャッタ3を開き、所望の温度
で蒸発した物質の分子線を半導体ウェーハWに向かって
飛散させ、所望の濃度の結晶膜を半導体ウェーハWに成
長させる。
(57) [Summary] [Purpose] Preventing the scattering of excess material molecular beams into the ultra-high vacuum chamber and scattering the material molecular beams toward the semiconductor wafer while the temperature inside the cell remains stable. The purpose is to [Structure] Double shutters 2 and 3 are arranged on the opening surface of a cell 1, and when the substance supplied into the cell is heated to a predetermined temperature,
Once the shutter 2 close to the cell opening surface is opened to stabilize the temperature change inside the cell, the shutter 3 is opened, and the molecular beam of the substance evaporated at the desired temperature is scattered toward the semiconductor wafer W to achieve the desired concentration. A crystal film of is grown on a semiconductor wafer W.

Description

【考案の詳細な説明】[Detailed explanation of the idea]

【0001】0001

【産業上の利用分野】[Industrial application field]

本考案は、分子線エピタキシィ装置(以下、MBE(Molecular Beem Epitaxy )装置という)に関し、特に分子線の発生源となるセルの改良に関する。 This invention uses a molecular beam epitaxy device (hereinafter referred to as MBE). ), and particularly relates to improvements in cells that serve as sources of molecular beams.

【0002】0002

【従来の技術】[Conventional technology]

半導体ウェーハ上にエピタキシャル成長層を形成する場合、MBE装置を用い る場合がある。このMBE装置としては、例えば、図3に示すように、逆椀状の 超高真空チャンバー100の凹曲面中心点を含む平面に半導体ウェーハWを配置 し、底面付近にエピタキシャル成長させるための物質の分子線の発生源となるセ ル101をそれぞれの物質毎に複数箇所に設けたものがある。 When forming an epitaxial growth layer on a semiconductor wafer, an MBE device is used. There may be cases where For example, as shown in FIG. 3, this MBE device has an inverted bowl shape. A semiconductor wafer W is placed on a plane that includes the center point of the concave curved surface of the ultra-high vacuum chamber 100. There is a cell near the bottom that is the source of molecular beams for epitaxial growth. Some devices have multiple holes 101 for each substance.

【0003】 上記セル101は、例えば、図4に示すとおり、セラミック製のるつぼ102 に加熱用のタングステンヒータ103が巻き付けられており、該タングステンヒ ータ103の周囲を薄いタンタル板104で何重にも覆って保温効果を高め、開 口面側にドーナツ状のキャップ105を装着したもので、上記るつぼ102の中 に半導体ウェーハWに成長させるための高純度のガリウムや砒素等の物質が供給 されている。そして、再び図3に戻り、セル101が取り付けられた基板106 には該セル101の開口面を開閉する円板状のシャッタ107が、外部のステッ ピングモータ108等に接続された軸109に回動自在に取着されている。0003 For example, as shown in FIG. 4, the cell 101 is made of a ceramic crucible 102. A tungsten heater 103 for heating is wound around the tungsten heater 103 for heating. The area around the heater 103 is covered with thin tantalum plates 104 in multiple layers to increase the heat retention effect, A donut-shaped cap 105 is attached to the mouth side of the crucible 102. Highly purified materials such as gallium and arsenic are supplied to grow semiconductor wafers W. has been done. Then, returning to FIG. 3 again, the substrate 106 to which the cell 101 is attached A disc-shaped shutter 107 that opens and closes the opening of the cell 101 is connected to an external step. It is rotatably attached to a shaft 109 connected to a ping motor 108 or the like.

【0004】 上記構成のMBE装置では、超高真空チャンバー100の上方に半導体ウェー ハWを配置し、セル101の開口面をシャッタ107で覆い、セル101のタン グステンヒータ103へ通電を行なってその発熱によってるつぼ102を加熱し 、該るつぼ102を所定の高温状態とすることにより該つぼ102内に供給され た物質を蒸発させて分子線を半導体ウェーハWに向かって飛散させ、その衝突に より半導体ウェーハWの表面にエピタキシャル成長層を形成している。このよう なMBE装置では、るつぼ102の加熱温度の微妙な変化により蒸発する物質の 分子量が異なるため、半導体ウェーハWに形成されるエピタキシャル成長層の濃 度変化の調整が容易となる利点がある。0004 In the MBE apparatus with the above configuration, a semiconductor wafer is placed above the ultra-high vacuum chamber 100. the opening surface of the cell 101 is covered with the shutter 107, and the button of the cell 101 is placed. The gsten heater 103 is energized and the crucible 102 is heated by the heat generated. , is supplied into the crucible 102 by bringing the crucible 102 to a predetermined high temperature state. The molecular beam is scattered toward the semiconductor wafer W by evaporating the substance, and the collision An epitaxial growth layer is formed on the surface of the semiconductor wafer W. like this In a typical MBE device, the amount of material evaporated is controlled by subtle changes in the heating temperature of the crucible 102. Because the molecular weights are different, the concentration of the epitaxial growth layer formed on the semiconductor wafer W is This has the advantage that the degree change can be easily adjusted.

【0005】[0005]

【考案が解決しようとする課題】[Problem that the idea aims to solve]

しかしながら、上記MBE装置では、セル101の開口面とシャッタ107の 取り付け位置との間隔hが約30〜50mm程度と比較的離れた状態となってい るので、るつぼ102を加熱して所定温度に達する前に放出される蒸気が、シャ ッタ107とるつぼ102の開口面との隙間から漏れだし、超高真空チャンバー 100内に余分な物質が付着し、メンテナンスが頻繁になるといった問題があっ た。 However, in the above MBE device, the opening surface of the cell 101 and the shutter 107 are The distance h from the mounting position is about 30 to 50 mm, which is relatively far away. Therefore, the steam released before heating the crucible 102 and reaching the predetermined temperature is It leaks from the gap between the crucible 107 and the opening surface of the crucible 102, and the ultra-high vacuum chamber There are problems such as excess substances adhering to the inside of the 100 and requiring frequent maintenance. Ta.

【0006】 これを防止するために、シャッタ107をセル101の開口面に近付けて隙間 を狭くすると、シャッタ107を開いた瞬間にるつぼ102と超高真空チャンバ ー100内の温度差により、るつぼ102の温度が所定温度より瞬時に低下し、 従って、所望の温度より低い温度で蒸発した物質が飛散するようになり、半導体 ウェーハWに形成されるエピタキシャル成長層の濃度の調整に問題があった。[0006] In order to prevent this, move the shutter 107 close to the opening surface of the cell 101 so that there is no gap. When the shutter 107 is narrowed, the crucible 102 and the ultra-high vacuum chamber are separated at the moment the shutter 107 is opened. - 100, the temperature of the crucible 102 instantly drops below a predetermined temperature, Therefore, substances evaporated at a temperature lower than the desired temperature become scattered, and the semiconductor There was a problem in adjusting the concentration of the epitaxial growth layer formed on the wafer W.

【0007】[0007]

【課題を解決するための手段】[Means to solve the problem]

上記課題を解決するために、本考案の分子線エピタキシィ装置は、分子線を得 るための物質を保持した複数のセルを超高真空チャンバー内に設けてなる分子線 エピタキシィ装置であって、上記セルの開口面に多重シャッタを配置したことを 特徴とする。 In order to solve the above problems, the molecular beam epitaxy device of the present invention obtains molecular beams. A molecular beam that consists of multiple cells holding substances to be used in an ultra-high vacuum chamber. This is an epitaxy device in which multiple shutters are placed on the opening surface of the cell. Features.

【0008】[0008]

【作用】[Effect]

上記構成の分子線エピタキシィ装置では、超高真空チャンバー内に設けられた 複数のセルを加熱して所定の温度に近付くと多重シャッタの内、セルの開口面側 に一番近いシャッタを開く。これにより超高真空チャンバーとセル内との温度が 変化するが、この状態を維持してセル内の温度を安定させてから外側のシャッタ を開くと、所望の温度で蒸発する物質の分子線を超高真空チャンバーに配置され た半導体ウェーハに向かって飛散させることができる。 In the molecular beam epitaxy device with the above configuration, the When multiple cells are heated and the temperature approaches a predetermined temperature, the opening side of the cells is activated by multiple shutters. Open the shutter closest to . This reduces the temperature between the ultra-high vacuum chamber and the inside of the cell. However, maintain this state to stabilize the temperature inside the cell before closing the outer shutter. When opened, a molecular beam of a substance is placed in an ultra-high vacuum chamber that evaporates at a desired temperature. It can be scattered towards the semiconductor wafer.

【0009】[0009]

【実施例】【Example】

以下、図面を参照して本考案の一実施例を説明する。 An embodiment of the present invention will be described below with reference to the drawings.

【0010】 図1は本考案の一実施例に係る分子線エピタキシィ装置の特徴となるセルの斜 視図であり、図2はその拡大縦断面図である。図に示すにセル1は既述したセル 101に二重のシャッタ2,3を設けた点を除いて実質的に同一のため、同一部 材に同一符号を付してここでは説明を省略する。即ち、このセル1は超高真空チ ャンバー100に同様に設けられたもので、セル1に設けられたシャッタ2,3 は何れも開口面を覆うものであり、セル1を取り付けた基板106に挿着された 軸21,31を介してそれぞれステッピグモータ4,5に回動自在に取着されて いる。シャッタ2はセル1の開口面の近くに配置され、シャッタ3がそれより外 側に配置されている。具体的には、セル1の開口面とシャッタ2との間隔H1 は 約5mm、シャッタ2とシャッタ3との間隔H2 は従来のシャッタと同様の約3 0〜50mmとなっている。また、シャッタ2はセル1の開口面を覆うだけのも ので、ほぼ等しい面積であれば充分であり、シャッタ3はそれより広い面積とな っている。0010 Figure 1 shows a cell diagonal that is a feature of a molecular beam epitaxy device according to an embodiment of the present invention. This is a perspective view, and FIG. 2 is an enlarged longitudinal sectional view thereof. In the figure, cell 1 is the cell mentioned above. 101 is substantially the same except that double shutters 2 and 3 are provided, so the same part The same reference numerals are given to the members, and the explanation thereof will be omitted here. That is, this cell 1 is an ultra-high vacuum chamber. The shutters 2 and 3 provided in the cell 1 are similarly provided in the chamber 100. Both cover the opening surface and are inserted into the substrate 106 on which the cell 1 is attached. It is rotatably attached to the stepping motors 4 and 5 via shafts 21 and 31, respectively. There is. Shutter 2 is placed near the opening surface of cell 1, and shutter 3 is placed outside it. placed on the side. Specifically, the distance H1 between the opening surface of cell 1 and shutter 2 is Approximately 5 mm, and the distance H2 between shutter 2 and shutter 3 is approximately 3 mm, which is the same as the conventional shutter. It is 0 to 50 mm. In addition, the shutter 2 may only cover the opening surface of the cell 1. Therefore, it is sufficient that the area is approximately the same, and the shutter 3 should have a wider area than that. ing.

【0011】 上記構成のセル1を用いた分子線エピタキシィ装置では、セル1のるつぼ10 2内に半導体ウェーハWに成長させる高純度の物質をそれぞれ供給し、シャッタ 2,3でそれぞれセル1の開口面を閉じた状態でタングステンヒータ103に通 電して発熱させてるつぼ102を昇温する。これにより、物質が加熱されて蒸気 を発生するようになる。しかし、シャッタ2でセル1の開口面の近くを覆ってい るため、蒸気となった分子線がシャッタ2の周囲から超高真空チャンバー100 内に飛散し難くなる。従って、半導体ウェーハWへの成長に寄与しない状態では 余分な分子線が超高真空チャンバー100内に飛散し難いため、チャンバー内の 汚れが激減し、メンテナンス回数が改善される。[0011] In the molecular beam epitaxy apparatus using the cell 1 having the above configuration, the crucible 10 of the cell 1 is A high-purity substance to be grown on the semiconductor wafer W is supplied into each of the two chambers, and the shutter is 2 and 3, respectively, with the opening surface of cell 1 closed, the tungsten heater 103 is passed through. The temperature of the pot 102, which is heated by electricity, is raised. This heats the substance and creates steam will occur. However, shutter 2 covers the area near the opening surface of cell 1. As a result, the molecular beam that has become vapor flows from around the shutter 2 to the ultra-high vacuum chamber 100. It becomes difficult to scatter inside. Therefore, in a state that does not contribute to growth on the semiconductor wafer W, Because excess molecular beams are difficult to scatter into the ultra-high vacuum chamber 100, Dirt is drastically reduced and maintenance frequency is improved.

【0012】 そして、所望の温度に物質を昇温して蒸発させ、分子線を半導体ウェーハWに 飛散させて結晶膜を成長させる場合には、例えば、所定温度となって成長を開始 する約5程前にシャッタ2の軸21が接続されたステッピグモータ4を動作させ てシャッタ2を回動させ、セル1の開口面を開放する。シャッタ2を開放すると セル1内の温度が一瞬低下するが、この状態で約5分程度加熱保持すると所望の 温度に復帰する。この間、温度の低い物質の蒸気の飛散はシャッタ3により防止 できる。短時間の内にるつぼ102内の物質は所望の温度となるので、このとき シャッタ3の軸31が接続されたステッピグモータ5を動作させてシャッタ3を 開放する。これにより、蒸気となった分子線が半導体ウェーハWに向かってビー ム状に飛散し所定の濃度を有する結晶膜を成長させるようになる。0012 Then, the substance is heated to a desired temperature and evaporated, and the molecular beam is directed onto the semiconductor wafer W. When growing a crystal film by scattering, for example, growth starts when the temperature reaches a predetermined temperature. Approximately 5 minutes before the shutter 2 shaft 21 is connected to the The shutter 2 is rotated to open the opening surface of the cell 1. When shutter 2 is opened The temperature inside cell 1 will drop momentarily, but if you keep heating it in this state for about 5 minutes, the desired temperature will be reached. Return to temperature. During this time, the shutter 3 prevents the vapor of low temperature substances from scattering. can. Since the substance in the crucible 102 reaches the desired temperature within a short time, at this time The shutter 3 is activated by operating the stepping motor 5 to which the shaft 31 of the shutter 3 is connected. Open. As a result, the molecular beam that has turned into vapor beams toward the semiconductor wafer W. The crystals scatter in a cloud shape and grow a crystal film having a predetermined concentration.

【0013】 このようにセル1に二重のシャッタ2,3を設けると、所定温度に達するまで に蒸発する分子線の超高真空チャンバー100内への飛散をセル1の開口面側に 配置されたシャッタ2によって防止でき、超高真空チャンバー100内の汚れを 必要最小限に止められ、実際に結晶膜を成長させる少し前にシャッタ2だけを開 いて超高真空チャンバー100とセル1内の温度変動を見越し、所定温度まで回 復するまで加熱保持してからシャッタ3を開放するので、所定温度で蒸発した分 子線を正確に半導体ウェーハWに向けて飛散させることができる。このとき、シ ャッタ3はセル1の開口面から離れているため、開放したときにセル1内の温度 が低下することもなく、正確な温度で物質を蒸発させて分子線を半導体ウェーハ Wに飛散させることができる。従って、半導体ウェーハWに成長される結晶膜に は微妙な濃度変化が生じず、所望の濃度の結晶膜が正確に成長される。[0013] By providing double shutters 2 and 3 in cell 1 in this way, until the predetermined temperature is reached, The scattering of the molecular beam that evaporates into the ultra-high vacuum chamber 100 is directed to the opening side of the cell 1. The installed shutter 2 can prevent dirt inside the ultra-high vacuum chamber 100. It is kept to the minimum necessary, and only shutter 2 is opened a little before actually growing the crystal film. In anticipation of temperature fluctuations within the ultra-high vacuum chamber 100 and cell 1, the temperature is heated to a predetermined temperature. Since the shutter 3 is opened after heating is maintained until The sub-beams can be accurately scattered toward the semiconductor wafer W. At this time, Since the shutter 3 is located away from the opening surface of the cell 1, the temperature inside the cell 1 decreases when it is opened. The molecular beam is transferred to semiconductor wafers by evaporating the substance at a precise temperature without any drop in temperature. It can be scattered by W. Therefore, in the crystal film grown on the semiconductor wafer W, With this method, a crystal film with a desired concentration can be grown accurately without causing subtle concentration changes.

【0014】 尚、実施例では、二重シャッタをセル1の開口面に取着したものを例示したが 、三重以上の多重シャッタを配置し、それぞれのシャッタの開閉を制御して分子 線の飛散を調節しても何等問題はないが、制御やメンテナンス等を考慮すると実 施例に示したような二重シャッタ程度が好適である。[0014] In the example, a double shutter was attached to the opening surface of cell 1. , by arranging three or more multiple shutters and controlling the opening and closing of each shutter. There is no problem in adjusting the scattering of the wire, but it is not practical when considering control and maintenance. A double shutter as shown in the example is suitable.

【0015】[0015]

【考案の効果】 以上の説明から明らかなように、本考案の分子線エピタキシィ装置は、セルの 開口面の近くに配置されたシャッタによって加熱蒸発により発生する物質の分子 線の超高真空チャンバー内への漏れだしが防止でき、余分な分子線による超高真 空チャンバー内の汚染が防止できる。また、セル開口面から離れたシャッタを開 く前に、開口面に近い方のシャッタを開いてセル内の温度を安定させてから離れ たシャッタを開くことができるので、半導体ウェーハに所定の濃度の結晶膜を正 確に成長させることができるといった効果を奏する。[Effect of the idea] As is clear from the above explanation, the molecular beam epitaxy device of the present invention can Molecules of substances generated by heating and evaporation by a shutter placed near the opening surface It can prevent the wire from leaking into the ultra-high vacuum chamber, and the ultra-high vacuum due to excess molecular beam can be prevented. Contamination inside the empty chamber can be prevented. Also, open the shutter far from the cell opening surface. Before opening the cell, open the shutter closest to the opening surface to stabilize the temperature inside the cell, and then move it away from the cell. The shutter can be opened to directly deposit a crystal film with a predetermined concentration on a semiconductor wafer. It has the effect of being able to grow reliably.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本考案の一実施例に係る分子線エピタキシィ装
置に使用されて特徴となるセルの斜視図。
FIG. 1 is a perspective view of a characteristic cell used in a molecular beam epitaxy apparatus according to an embodiment of the present invention.

【図2】図1のセルの要部拡大断面図。FIG. 2 is an enlarged sectional view of a main part of the cell in FIG. 1.

【図3】従来の分子線エピタキシィ装置の概略断面図。FIG. 3 is a schematic cross-sectional view of a conventional molecular beam epitaxy apparatus.

【図4】従来の分子線エピタキシィ装置に使用されるセ
ルの要部拡大断面図。
FIG. 4 is an enlarged sectional view of a main part of a cell used in a conventional molecular beam epitaxy apparatus.

【符号の説明】[Explanation of symbols]

1 セル 2,3 シャッタ 100 超高真空チャンバー 1 cell 2,3 Shutter 100 Ultra-high vacuum chamber

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】分子線を得るための物質を保持した複数の
セルを超高真空チャンバー内に設けてなる分子線エピタ
キシィ装置であって、上記セルの開口面に多重シャッタ
を配置したことを特徴とする分子線エピタキシィ装置。
1. A molecular beam epitaxy apparatus comprising a plurality of cells holding substances for obtaining a molecular beam in an ultra-high vacuum chamber, characterized in that multiple shutters are arranged on the opening surfaces of the cells. Molecular beam epitaxy equipment.
JP2231091U 1991-03-12 1991-03-12 Molecular beam epitaxy equipment Withdrawn JPH04111730U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2231091U JPH04111730U (en) 1991-03-12 1991-03-12 Molecular beam epitaxy equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2231091U JPH04111730U (en) 1991-03-12 1991-03-12 Molecular beam epitaxy equipment

Publications (1)

Publication Number Publication Date
JPH04111730U true JPH04111730U (en) 1992-09-29

Family

ID=31907835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2231091U Withdrawn JPH04111730U (en) 1991-03-12 1991-03-12 Molecular beam epitaxy equipment

Country Status (1)

Country Link
JP (1) JPH04111730U (en)

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