JPH0379764A - Ion plating device for long-sized material - Google Patents
Ion plating device for long-sized materialInfo
- Publication number
- JPH0379764A JPH0379764A JP21500589A JP21500589A JPH0379764A JP H0379764 A JPH0379764 A JP H0379764A JP 21500589 A JP21500589 A JP 21500589A JP 21500589 A JP21500589 A JP 21500589A JP H0379764 A JPH0379764 A JP H0379764A
- Authority
- JP
- Japan
- Prior art keywords
- roller
- rotating roller
- bias power
- ion plating
- power source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007733 ion plating Methods 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 title abstract description 11
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 12
- 230000008020 evaporation Effects 0.000 claims description 12
- 238000001704 evaporation Methods 0.000 claims description 12
- 239000010409 thin film Substances 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000010894 electron beam technology Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、長尺鋼板等の長尺の導電性の被処理物の表面
にイオンプレーティングにより薄膜を形成するに使用さ
れる長尺物用イオンプレーティング装置に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a long object used for forming a thin film on the surface of a long conductive object such as a long steel plate by ion plating. The present invention relates to an ion plating device.
（従来の技術）
従来の長尺物用イオンプレーティング装置として、例え
ば第１図示のように、蒸発源ａを備えた真空処理室す内
へ、回転ローラーＣで長尺の導電性の被処理物ｄを搬入
し、バイアス電源ｅにより蒸発源ａに正電位を印加する
と共に回転ローラーＣを介して被処理物ｄに負電位を印
加することにより蒸発源ａからの蒸発物をイオン化して
該被処理物ｄの表面に膜状に付着させるようにしたもの
が知られている。該被処理物ｄに負電位を印加する手段
は、第２図に見られるようにバイアス電源ｅからの給電
ケーブルｆを回転ローラーＣのベアリング軸受ｇに取付
けて構成されており、従ってバイアス電流は被処理物ｄ
１回転ローラーＣ、ベアリング軸受ｇの順に流れる。(Prior Art) As a conventional ion plating apparatus for long objects, for example, as shown in FIG. The object d is carried in, and a positive potential is applied to the evaporation source a by the bias power source e, and a negative potential is applied to the object to be processed d via the rotating roller C, thereby ionizing the evaporated material from the evaporation source a. It is known that the film is attached to the surface of the object to be processed d. The means for applying a negative potential to the object to be processed d is constructed by attaching a power supply cable f from a bias power source e to a bearing g of a rotating roller C, as shown in FIG. 2, so that the bias current is Processed object d
It flows in the order of one-rotation roller C and bearing g.
（発明が解決しようとする課題）
前記従来の装置では、バイアス回路の途中にベアリング
軸受ｇが介在するが、元来軸受は電流を安定して流せる
構造にはなっておらず、回転ローラーＣの回転によって
回転ローラーＣと軸受ｇとの接触抵抗が変化するため、
給電ケーブルｆから回転ローラーＣに安定してバイアス
電圧を供給することが出来ない不都合があった。(Problems to be Solved by the Invention) In the conventional device described above, a bearing g is interposed in the middle of the bias circuit, but the bearing is not originally structured to allow a stable current to flow, and the rotating roller C is Since the contact resistance between the rotating roller C and the bearing g changes due to rotation,
There was a problem in that a bias voltage could not be stably supplied from the power supply cable f to the rotating roller C.
特に高速成膜用のイオンプレーティング装置では、１０
００ Ａ程度の電流が軸受ｇを介して流れるため、軸受
ｇの接触抵抗の不安定さがあると被処理物ｄに形成され
る薄膜の密着性等の成膜性能が悪化して好ましくない。Especially in ion plating equipment for high-speed film formation, 10
Since a current of approximately 0.00 A flows through the bearing g, if the contact resistance of the bearing g is unstable, the film forming performance such as the adhesion of the thin film formed on the object d to be processed deteriorates, which is not preferable.
この発明は、上記のような従来のもののもつ不都合を解
決するもので、安定して長尺の被処理物に負電圧を印加
し得るイオンプレーティング装置を提供することを目的
とするものである。This invention solves the above-mentioned disadvantages of the conventional devices, and aims to provide an ion plating device that can stably apply a negative voltage to a long workpiece. .
（課題を解決するための手段）
本発明では、蒸発源を備えた真空処理室と、導電性の長
尺の被処理物を該真空処理室内へ搬送する回転ローラー
を備え、該被処理物に回転ローラーを介してバイアス電
源から負電位を与えると共に蒸発源に該バイアス電源か
ら正電位を与えるようにしたイオンプレーティング装置
に於いて、該回転ローラーにバイアス電源に接続したカ
ーボンブラシを接触させて設けることにより、前記目的
を達成するようにした。(Means for Solving the Problems) The present invention includes a vacuum processing chamber equipped with an evaporation source and a rotating roller for conveying a conductive long workpiece into the vacuum processing chamber. In an ion plating apparatus in which a negative potential is applied from a bias power source via a rotating roller and a positive potential is applied to an evaporation source from the bias power source, a carbon brush connected to the bias power source is brought into contact with the rotating roller. By providing this, the above object is achieved.
（作 用）
回転ローラーにより真空処理室内へ搬入される被処理物
に、回転ローラーを介してバイアス電源から負電位を与
えると共に、蒸発源にバイアス電源から正電位を与え、
蒸発源からの蒸発物をイオン化して該被処理物の表面に
膜状に付着させ、イオンプレーティングが行なわれるが
、該回転ローラーにはバイアス電源へ接続されたカーボ
ンブラシを介してバイアス電圧を印加するので、常に一
定で安定な接触抵抗が得られ、回転ローラーに安定した
バイアスの給電を行なえ、密着性等の成膜性能の良い薄
膜を被処理物に形成することが出来る。(Function) A negative potential is applied from a bias power source via the rotating roller to the workpiece carried into the vacuum processing chamber by the rotating roller, and a positive potential is applied from the bias power source to the evaporation source.
Ion plating is performed by ionizing the evaporated material from the evaporation source and depositing it on the surface of the workpiece in the form of a film, but a bias voltage is applied to the rotating roller via a carbon brush connected to a bias power source. Since the voltage is applied, a constant and stable contact resistance is always obtained, a stable bias power can be supplied to the rotating roller, and a thin film with good film-forming performance such as adhesion can be formed on the object to be processed.
（実施例）
本発明の実施例を図面第３図及び第４図に基づき説明す
ると、第３図に於いて符号（１〉は真空排気された真空
処理室、（２〉は該真空処理室（１）の下方に設けられ
た蒸発源、（３）は該真空処理室（１）内を通過するよ
うにその前後の差圧室（４） （４）に夫々設けた回転
ローラー（５） （５）により搬送される鋼板等の長尺
の導電性の被処理物を示す。該蒸発１１ｉｉｊ （２）
の内部に収めた蒸発物（６）は、電子銃（７）からの電
子ビーム（８〉により溶融蒸発され、その上方の被処理
物（３）に該蒸発物（６）の薄膜が形成されるが、該蒸
発源（２）へ直流のバイアス電源（９）から与えられる
正電位と、各回転ローラー（５） （５）を介して該バ
イアス電源（９）から被処理物（３）に与えた負電位と
によって該蒸発物（６）の蒸気がイオン化され、更に被
処理物（３）の負電位により加速されてその表面へ突入
し、密着性の強い薄膜を形成する。(Embodiment) An embodiment of the present invention will be explained based on FIGS. 3 and 4. In FIG. (1) An evaporation source provided below; (3) differential pressure chambers (4) before and after the vacuum processing chamber (1); rotating rollers (5) provided in each of (4); (5) shows a long electrically conductive workpiece such as a steel plate transported by the evaporation 11iij (2)
The evaporated material (6) contained inside is melted and evaporated by the electron beam (8) from the electron gun (7), and a thin film of the evaporated material (6) is formed on the object to be processed (3) above it. However, a positive potential is applied to the evaporation source (2) from a DC bias power supply (9), and a positive potential is applied to the workpiece (3) from the bias power supply (9) via each rotating roller (5). The vapor of the evaporated material (6) is ionized by the applied negative potential, is further accelerated by the negative potential of the object (3), and rushes to the surface of the object (3), forming a thin film with strong adhesion.
バイアス電ＩＸ（９）から回転ローラー〈５）への給電
は、第４図示のように、バイアス電源（９）へ接続した
円板又は角板状のカーボンブラシ（１Ｇを回転ローラー
（５）に接触させることにより行なわれ、図示の例では
真空シールＣＩ′Ｄを介して大気圧の外部へ導出した回
転ローラー（５）の回転軸ａつに銅製の鉤形の電極ａ３
を固定し、該回転ローラー（５）と共に回転する電極（
１３の鍔面にばね（ｌ＠でカーボンブラシＧｏを押圧す
るようにした。ＧＧはカーボンブラシ（ＩＯを取付けた
ホルダ（１７１とバイアス電源（９〉とを接続する給電
ケーブル、■はスラストベアリング、（１９はロックナ
ツトである。Power is supplied from the bias power supply IX (9) to the rotating roller (5) by using a disk or square plate-shaped carbon brush (1G) connected to the bias power supply (9) as shown in the fourth diagram. In the illustrated example, a copper hook-shaped electrode a3 is attached to one rotating shaft a of a rotating roller (5) led out to the outside of atmospheric pressure via a vacuum seal CI'D.
is fixed, and an electrode (
The carbon brush Go is pressed by a spring (l@) on the flange surface of 13. GG is the carbon brush (the holder with the IO installed (the power supply cable connecting 171 and the bias power supply (9)), ■ is the thrust bearing, (19 is a rock nut.
その作動を説明すると、各回転ローラー（５）が回転さ
れ搬送される被処理物（６〉へイオンプレーティング処
理を行なう場合、バイアス電源（９）から回転ローラー
（５）を介して被処理物（６）に負電位を与えるが、そ
の給電はバイアス電源（９）に給電ケーブル（ＩＧで接
続したカーボンブラシ（１０を回転ローラー（５）に接
触させることにより行なわれるので、被処理物〈６）の
高速搬送に伴い高速で回転ローラー（５）が回転しても
、カーボンブラシ（ＩＯがその潤滑性で回転ローラー（
５）と滑らかに接触し、接触抵抗が−様になるので−様
な電流を流通させ得、密着性等の成膜性能の良好な薄膜
を被処理物（６）に形成することが出来る。To explain its operation, when each rotating roller (5) is rotated and conveyed to perform the ion plating process on the processed material (6), the processed material is A negative potential is applied to (6), and the power is supplied by bringing the carbon brush (10) connected to the bias power supply (9) through the power supply cable (IG) into contact with the rotating roller (5). Even if the rotating roller (5) rotates at high speed due to the high-speed conveyance of the carbon brush (IO), its lubricity will cause the rotating roller (
5) and the contact resistance becomes -like, a -like current can flow, and a thin film with good film-forming performance such as adhesion can be formed on the object to be processed (6).
（発明の効果）
以上のように本発明によるときは、回転ローラーにより
搬送される長尺の被処理物に負電位ヲ与えるイオンプレ
ーティング装置に於いて、該回転ローラーにバイアス電
源に接続したカーボンブラシを接触させて給電するよう
にしたので、回転ローラーの高速回転時に接触抵抗が安
定し、回転ローラーに対して常に安定してバイアス電圧
を供給出来、密着性の−様なイオンプレーティングを行
なえる等の効果をある。(Effects of the Invention) As described above, according to the present invention, in an ion plating apparatus that applies a negative potential to a long workpiece conveyed by a rotating roller, carbon dioxide is connected to a bias power supply to the rotating roller. Since the brushes are in contact with each other to supply power, the contact resistance is stable when the rotating roller rotates at high speed, and a bias voltage can always be stably supplied to the rotating roller, making it possible to perform ion plating with good adhesion. It has the effect of
第１図は従来の長尺物用イオンプレーティング装置の概
略断面図、第２図は第１図の回転ローラーの給電部分の
断面図、第３図は本発明の実施例の概略断面図、第４図
は第３図の要部の断面図である。
（１）・・・真空処理室 （２）・・・蒸発源（３
）・・・被処理物
（９）・・・バイアス電源
ａ３・・・電 極
（５）・・・回転ローラー
（＋１）・・・カーボンブラシ
（Ｉ２）・・・ば ね
特 許 出 願 人
同
上
代
理
人
日本真空技術株式会社
川崎製鉄株式会社
北 村 欣 −４′１、−３τ・外３名：
、７．．＋
第２図FIG. 1 is a schematic cross-sectional view of a conventional ion plating apparatus for long objects, FIG. 2 is a cross-sectional view of the power supply portion of the rotating roller in FIG. 1, and FIG. FIG. 4 is a sectional view of the main part of FIG. 3. (1)...Vacuum processing chamber (2)...Evaporation source (3
)...Workpiece (9)...Bias power supply a3...Electrode (5)...Rotating roller (+1)...Carbon brush (I2)...Spring patent applicant Agent for the above: Japan Vacuum Technology Co., Ltd. Kawasaki Steel Corporation Kin Kitamura -4'1, -3τ・3 others:
,7. ．． + Figure 2
Claims (2)
理物を該真空処理室内へ搬送する回転ローラーを備え、
該被処理物に回転ローラーを介してバイアス電源から負
電位を与えると共に蒸発源に該バイアス電源から正電位
を与えるようにしたイオンプレーティング装置に於いて
、該回転ローラーにバイアス電源に接続したカーボンブ
ラシを接触させて設けたことを特徴とする長尺物用イオ
ンプレーティング装置。1. Equipped with a vacuum processing chamber equipped with an evaporation source and a rotating roller that conveys a conductive long workpiece into the vacuum processing chamber,
In an ion plating apparatus in which a negative potential is applied to the workpiece from a bias power source via a rotating roller, and a positive potential is applied to an evaporation source from the bias power source, a carbon plate connected to the bias power source is connected to the rotating roller. An ion plating device for long objects, characterized in that brushes are provided in contact with each other.
鍔面に円板又は角板状の前記カーボンブラシをばねで押
圧して接触させたことを特徴とする請求項１に記載の長
尺物用イオンプレーティング装置。2. 2. The elongated article according to claim 1, wherein a flange-shaped electrode is provided integrally with the rotating roller, and the disc or square plate-shaped carbon brush is pressed by a spring and brought into contact with the flange surface. ion plating equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1215005A JP2572279B2 (en) | 1989-08-23 | 1989-08-23 | Ion plating equipment for long objects |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1215005A JP2572279B2 (en) | 1989-08-23 | 1989-08-23 | Ion plating equipment for long objects |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0379764A true JPH0379764A (en) | 1991-04-04 |
| JP2572279B2 JP2572279B2 (en) | 1997-01-16 |
Family
ID=16665134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1215005A Expired - Lifetime JP2572279B2 (en) | 1989-08-23 | 1989-08-23 | Ion plating equipment for long objects |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2572279B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006089794A (en) * | 2004-09-22 | 2006-04-06 | Shin Meiwa Ind Co Ltd | Ion working apparatus |
| JP2006336034A (en) * | 2005-05-31 | 2006-12-14 | Canon Anelva Corp | Vacuum treatment system |
| JP2009046710A (en) * | 2007-08-16 | 2009-03-05 | Fuji Electric Systems Co Ltd | Continuous manufacturing apparatus of semiconductor device |
| JP2012523675A (en) * | 2009-04-14 | 2012-10-04 | チュシクフェサ ダウォンシス | Plasma surface treatment apparatus and method |
| CN110857466A (en) * | 2018-08-24 | 2020-03-03 | 安徽纯源镀膜科技有限公司 | Product clamping device of vacuum coating equipment |
| CN110857464A (en) * | 2018-08-24 | 2020-03-03 | 安徽纯源镀膜科技有限公司 | Novel bias system of vacuum coating equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61278029A (en) * | 1985-05-31 | 1986-12-08 | Mitsubishi Electric Corp | Production of magnetic recording element |
| JPS6455375A (en) * | 1987-08-26 | 1989-03-02 | Nissin Electric Co Ltd | Device for projecting ion beam |
-
1989
- 1989-08-23 JP JP1215005A patent/JP2572279B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61278029A (en) * | 1985-05-31 | 1986-12-08 | Mitsubishi Electric Corp | Production of magnetic recording element |
| JPS6455375A (en) * | 1987-08-26 | 1989-03-02 | Nissin Electric Co Ltd | Device for projecting ion beam |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006089794A (en) * | 2004-09-22 | 2006-04-06 | Shin Meiwa Ind Co Ltd | Ion working apparatus |
| JP2006336034A (en) * | 2005-05-31 | 2006-12-14 | Canon Anelva Corp | Vacuum treatment system |
| JP4646066B2 (en) * | 2005-05-31 | 2011-03-09 | キヤノンアネルバ株式会社 | Vacuum processing equipment |
| JP2009046710A (en) * | 2007-08-16 | 2009-03-05 | Fuji Electric Systems Co Ltd | Continuous manufacturing apparatus of semiconductor device |
| JP2012523675A (en) * | 2009-04-14 | 2012-10-04 | チュシクフェサ ダウォンシス | Plasma surface treatment apparatus and method |
| CN110857466A (en) * | 2018-08-24 | 2020-03-03 | 安徽纯源镀膜科技有限公司 | Product clamping device of vacuum coating equipment |
| CN110857464A (en) * | 2018-08-24 | 2020-03-03 | 安徽纯源镀膜科技有限公司 | Novel bias system of vacuum coating equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2572279B2 (en) | 1997-01-16 |
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