JPH0379415B2 - - Google Patents

Info

Publication number
JPH0379415B2
JPH0379415B2 JP60265619A JP26561985A JPH0379415B2 JP H0379415 B2 JPH0379415 B2 JP H0379415B2 JP 60265619 A JP60265619 A JP 60265619A JP 26561985 A JP26561985 A JP 26561985A JP H0379415 B2 JPH0379415 B2 JP H0379415B2
Authority
JP
Japan
Prior art keywords
wire
bonding
gold
copper
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60265619A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62127436A (ja
Inventor
Harumichi Okamoto
Takashi Ogata
Norimichi Matsusue
Takatoki Fukuda
Eiichi Fujimoto
Toshitake Ootaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Kogyo KK
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Nihon Kogyo KK
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Kogyo KK, Tatsuta Electric Wire and Cable Co Ltd filed Critical Nihon Kogyo KK
Priority to JP60265619A priority Critical patent/JPS62127436A/ja
Publication of JPS62127436A publication Critical patent/JPS62127436A/ja
Publication of JPH0379415B2 publication Critical patent/JPH0379415B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/01565—
    • H10W72/5522—
    • H10W72/5525—

Landscapes

  • Wire Bonding (AREA)
JP60265619A 1985-11-26 1985-11-26 半導体素子用ボンディング線 Granted JPS62127436A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60265619A JPS62127436A (ja) 1985-11-26 1985-11-26 半導体素子用ボンディング線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60265619A JPS62127436A (ja) 1985-11-26 1985-11-26 半導体素子用ボンディング線

Publications (2)

Publication Number Publication Date
JPS62127436A JPS62127436A (ja) 1987-06-09
JPH0379415B2 true JPH0379415B2 (Direct) 1991-12-18

Family

ID=17419649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60265619A Granted JPS62127436A (ja) 1985-11-26 1985-11-26 半導体素子用ボンディング線

Country Status (1)

Country Link
JP (1) JPS62127436A (Direct)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2507743B2 (ja) * 1987-06-10 1996-06-19 古河電気工業株式会社 フレキシブルプリント用銅合金
JP2726939B2 (ja) * 1989-03-06 1998-03-11 日鉱金属 株式会社 加工性，耐熱性の優れた高導電性銅合金
WO2006134724A1 (ja) 2005-06-15 2006-12-21 Nippon Mining & Metals Co., Ltd. 超高純度銅及びその製造方法並びに超高純度銅からなるボンディングワイヤ

Also Published As

Publication number Publication date
JPS62127436A (ja) 1987-06-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees