JPH0376795B2 - - Google Patents
Info
- Publication number
- JPH0376795B2 JPH0376795B2 JP60013052A JP1305285A JPH0376795B2 JP H0376795 B2 JPH0376795 B2 JP H0376795B2 JP 60013052 A JP60013052 A JP 60013052A JP 1305285 A JP1305285 A JP 1305285A JP H0376795 B2 JPH0376795 B2 JP H0376795B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- metal plate
- plating film
- mounting
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 164
- 239000002184 metal Substances 0.000 claims description 164
- 238000007747 plating Methods 0.000 claims description 79
- 239000000758 substrate Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60013052A JPS61172393A (ja) | 1985-01-26 | 1985-01-26 | 電子部品搭載用基板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60013052A JPS61172393A (ja) | 1985-01-26 | 1985-01-26 | 電子部品搭載用基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61172393A JPS61172393A (ja) | 1986-08-04 |
| JPH0376795B2 true JPH0376795B2 (US06168655-20010102-C00055.png) | 1991-12-06 |
Family
ID=11822356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60013052A Granted JPS61172393A (ja) | 1985-01-26 | 1985-01-26 | 電子部品搭載用基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61172393A (US06168655-20010102-C00055.png) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2520429B2 (ja) * | 1987-10-27 | 1996-07-31 | 松下電工株式会社 | 電子部品実装用プリント配線板 |
| JPH0379440U (US06168655-20010102-C00055.png) * | 1989-12-01 | 1991-08-13 | ||
| JP4856470B2 (ja) * | 2006-05-18 | 2012-01-18 | 日本特殊陶業株式会社 | 配線基板 |
| JP2010258260A (ja) * | 2009-04-27 | 2010-11-11 | Nec Corp | 放熱プリント基板 |
| JP6138500B2 (ja) * | 2013-01-30 | 2017-05-31 | 株式会社 日立パワーデバイス | パワー半導体装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
| JPS5946087A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板 |
| JPS5967687A (ja) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | プリント配線基板 |
| JPS5967686A (ja) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | プリント配線基板とその製造方法 |
-
1985
- 1985-01-26 JP JP60013052A patent/JPS61172393A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
| JPS5946087A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板 |
| JPS5967687A (ja) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | プリント配線基板 |
| JPS5967686A (ja) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | プリント配線基板とその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61172393A (ja) | 1986-08-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |