JPH0376780B2 - - Google Patents
Info
- Publication number
- JPH0376780B2 JPH0376780B2 JP59273077A JP27307784A JPH0376780B2 JP H0376780 B2 JPH0376780 B2 JP H0376780B2 JP 59273077 A JP59273077 A JP 59273077A JP 27307784 A JP27307784 A JP 27307784A JP H0376780 B2 JPH0376780 B2 JP H0376780B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pressure fluid
- burr removal
- lead frame
- resin burr
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 45
- 239000011347 resin Substances 0.000 claims description 45
- 239000012530 fluid Substances 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 238000002347 injection Methods 0.000 claims description 14
- 239000007924 injection Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59273077A JPS61152028A (ja) | 1984-12-26 | 1984-12-26 | レジンバリ除去装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59273077A JPS61152028A (ja) | 1984-12-26 | 1984-12-26 | レジンバリ除去装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61152028A JPS61152028A (ja) | 1986-07-10 |
JPH0376780B2 true JPH0376780B2 (ko) | 1991-12-06 |
Family
ID=17522822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59273077A Granted JPS61152028A (ja) | 1984-12-26 | 1984-12-26 | レジンバリ除去装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61152028A (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6386529A (ja) * | 1986-09-30 | 1988-04-16 | Toshiba Corp | 樹脂封止型半導体のバリ取り装置 |
JP2760339B2 (ja) * | 1996-03-05 | 1998-05-28 | 日本電気株式会社 | リードフレームのばり取り方法およびリードフレーム用ばり取り装置 |
US20040194803A1 (en) * | 2003-04-04 | 2004-10-07 | Asm Technology Singapore Pte Ltd | Cleaning of an electronic device |
CN104217864A (zh) * | 2014-07-24 | 2014-12-17 | 天津三星电机有限公司 | Mlcc载板的异物清理装置及清理方法 |
JP6880678B2 (ja) * | 2016-11-30 | 2021-06-02 | 日亜化学工業株式会社 | パッケージの製造方法、パッケージ、及び発光装置 |
KR101882649B1 (ko) * | 2018-03-16 | 2018-07-26 | 서장호 | 버 제거부를 구비한 금형장치 |
KR101882648B1 (ko) * | 2018-03-16 | 2018-07-26 | 서장호 | 버 제거부를 구비한 금형장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5582443A (en) * | 1978-12-14 | 1980-06-21 | Toa Seimitsu Kogyo Kk | Method and device for processing after sealing up semiconductor device |
JPS5588340A (en) * | 1978-12-27 | 1980-07-04 | Hitachi Ltd | Trimming method for resin-sealed electronic parts |
-
1984
- 1984-12-26 JP JP59273077A patent/JPS61152028A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5582443A (en) * | 1978-12-14 | 1980-06-21 | Toa Seimitsu Kogyo Kk | Method and device for processing after sealing up semiconductor device |
JPS5588340A (en) * | 1978-12-27 | 1980-07-04 | Hitachi Ltd | Trimming method for resin-sealed electronic parts |
Also Published As
Publication number | Publication date |
---|---|
JPS61152028A (ja) | 1986-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
EXPY | Cancellation because of completion of term |