JPH0374506B2 - - Google Patents

Info

Publication number
JPH0374506B2
JPH0374506B2 JP60010616A JP1061685A JPH0374506B2 JP H0374506 B2 JPH0374506 B2 JP H0374506B2 JP 60010616 A JP60010616 A JP 60010616A JP 1061685 A JP1061685 A JP 1061685A JP H0374506 B2 JPH0374506 B2 JP H0374506B2
Authority
JP
Japan
Prior art keywords
wafers
cassette
stocker
disk
stored
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60010616A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61168934A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60010616A priority Critical patent/JPS61168934A/ja
Priority to US06/819,253 priority patent/US4759681A/en
Publication of JPS61168934A publication Critical patent/JPS61168934A/ja
Publication of JPH0374506B2 publication Critical patent/JPH0374506B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
JP60010616A 1985-01-22 1985-01-22 ウエハハンドリング方法 Granted JPS61168934A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60010616A JPS61168934A (ja) 1985-01-22 1985-01-22 ウエハハンドリング方法
US06/819,253 US4759681A (en) 1985-01-22 1986-01-16 End station for an ion implantation apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60010616A JPS61168934A (ja) 1985-01-22 1985-01-22 ウエハハンドリング方法

Publications (2)

Publication Number Publication Date
JPS61168934A JPS61168934A (ja) 1986-07-30
JPH0374506B2 true JPH0374506B2 (fr) 1991-11-27

Family

ID=11755164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60010616A Granted JPS61168934A (ja) 1985-01-22 1985-01-22 ウエハハンドリング方法

Country Status (1)

Country Link
JP (1) JPS61168934A (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0265252A (ja) * 1988-08-31 1990-03-05 Nec Kyushu Ltd 半導体製造装置
JPH0727955B2 (ja) * 1990-08-03 1995-03-29 国際電気株式会社 ウェーハ移載方法及びその制御装置及び半導体製造装置
JP2584927Y2 (ja) * 1992-06-25 1998-11-11 日新電機株式会社 イオン注入装置
JP2014225707A (ja) * 2014-09-01 2014-12-04 東京エレクトロン株式会社 基板処理装置
JP7345437B2 (ja) * 2020-06-30 2023-09-15 三菱電機株式会社 イオン注入装置および半導体装置の製造方法

Also Published As

Publication number Publication date
JPS61168934A (ja) 1986-07-30

Similar Documents

Publication Publication Date Title
US4759681A (en) End station for an ion implantation apparatus
US6079927A (en) Automated wafer buffer for use with wafer processing equipment
US6330755B1 (en) Vacuum processing and operating method
US6540466B2 (en) Compact apparatus and method for storing and loading semiconductor wafer carriers
JP2002527901A (ja) ウエーハ用並べ換え／貯蔵装置とその取扱法
EP0848413B1 (fr) Appareil compact et méthode de stockage et de chargement de supports de galettes semi-conductrices
EP0035844A2 (fr) Système de manipulation d'articles et procédé pour chaine de fabrication
JP2001298069A (ja) カセットの保管および移動装置
JPH10256346A (ja) カセット搬出入機構及び半導体製造装置
US20070092359A1 (en) Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position
US4498832A (en) Workpiece accumulating and transporting apparatus
JPH11130255A (ja) 基板搬送移載装置
JPH0374506B2 (fr)
JPS6339102B2 (fr)
JPH1079412A (ja) 半導体製造装置
JPS62131455A (ja) イオン処理装置用エンドステ−シヨン
JP4229497B2 (ja) 基板処理装置および基板の処理方法
JPH04298059A (ja) 真空処理装置
JP2639093B2 (ja) イオン処理装置
JP3082148B2 (ja) 複合型ウェハ処理装置
JPH0237742A (ja) 半導体装置の製造装置
USRE39775E1 (en) Vacuum processing operating method with wafers, substrates and/or semiconductors
JPS6327035A (ja) ウエハ昇降装置
JPH0648858Y2 (ja) ウエハ収納容器
JPS594039A (ja) ウエ−ハ搬送装置