JPH0371784B2 - - Google Patents

Info

Publication number
JPH0371784B2
JPH0371784B2 JP57012459A JP1245982A JPH0371784B2 JP H0371784 B2 JPH0371784 B2 JP H0371784B2 JP 57012459 A JP57012459 A JP 57012459A JP 1245982 A JP1245982 A JP 1245982A JP H0371784 B2 JPH0371784 B2 JP H0371784B2
Authority
JP
Japan
Prior art keywords
epoxy resin
parts
resin composition
semiconductor encapsulation
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57012459A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58128757A (ja
Inventor
Tooru Nishimura
Katsumi Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP57012459A priority Critical patent/JPS58128757A/ja
Publication of JPS58128757A publication Critical patent/JPS58128757A/ja
Publication of JPH0371784B2 publication Critical patent/JPH0371784B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
JP57012459A 1982-01-27 1982-01-27 半導体封止用エポキシ樹脂組成物 Granted JPS58128757A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57012459A JPS58128757A (ja) 1982-01-27 1982-01-27 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57012459A JPS58128757A (ja) 1982-01-27 1982-01-27 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58128757A JPS58128757A (ja) 1983-08-01
JPH0371784B2 true JPH0371784B2 (enrdf_load_stackoverflow) 1991-11-14

Family

ID=11805926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57012459A Granted JPS58128757A (ja) 1982-01-27 1982-01-27 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58128757A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08100049A (ja) * 1994-09-30 1996-04-16 Dainippon Ink & Chem Inc 半導体封止材料用エポキシ樹脂組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4844796B2 (ja) * 2004-11-11 2011-12-28 Ｄｉｃ株式会社 １液型エポキシ樹脂組成物及びその硬化物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5550503B2 (enrdf_load_stackoverflow) * 1973-08-08 1980-12-18
JPS5325758B2 (enrdf_load_stackoverflow) * 1973-11-14 1978-07-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08100049A (ja) * 1994-09-30 1996-04-16 Dainippon Ink & Chem Inc 半導体封止材料用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS58128757A (ja) 1983-08-01

Similar Documents

Publication Publication Date Title
US5319005A (en) Epoxy resin molding material for sealing of electronic component
JPS6284147A (ja) エポキシ樹脂組成物
JPH0371784B2 (enrdf_load_stackoverflow)
JPH1192550A (ja) 液状エポキシ樹脂組成物
JPS6218565B2 (enrdf_load_stackoverflow)
JP2746905B2 (ja) 光半導体封止用エポキシ樹脂組成物
JPS62136860A (ja) 半導体装置
JPH06192396A (ja) 一液型エポキシ樹脂組成物
JP2705493B2 (ja) 液状エポキシ樹脂組成物及び半導体装置
JPS6325009B2 (enrdf_load_stackoverflow)
JPH0218412A (ja) 可撓性エポキシ樹脂組成物
JP2933243B2 (ja) 液状エポキシ樹脂組成物
JPH1192549A (ja) 液状エポキシ樹脂組成物
JPH05279450A (ja) エポキシ樹脂組成物
JPH10324733A (ja) エポキシ樹脂組成物、エポキシ樹脂の製造方法及び半導体封止材料
JP2646391B2 (ja) 液状エポキシ樹脂組成物
JPS6181427A (ja) エポキシ樹脂組成物
JPH0125487B2 (enrdf_load_stackoverflow)
JPH02235918A (ja) 半導体封止用エポキシ樹脂組成物
JP3365065B2 (ja) 封止用エポキシ樹脂組成物
JP2010083956A (ja) 封止用樹脂組成物および半導体封止装置
KR890004007B1 (ko) 반도체 봉지용 에폭시수지 조성물
JP2643547B2 (ja) 半導体封止用エポキシ樹脂組成物
JP3279084B2 (ja) 封止用エポキシ樹脂組成物
JPH0611843B2 (ja) エポキシ樹脂組成物