JPH0370900B2 - - Google Patents
Info
- Publication number
- JPH0370900B2 JPH0370900B2 JP61106824A JP10682486A JPH0370900B2 JP H0370900 B2 JPH0370900 B2 JP H0370900B2 JP 61106824 A JP61106824 A JP 61106824A JP 10682486 A JP10682486 A JP 10682486A JP H0370900 B2 JPH0370900 B2 JP H0370900B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- wafer
- probe card
- prober
- head plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 claims description 40
- 235000012431 wafers Nutrition 0.000 description 55
- 238000012360 testing method Methods 0.000 description 12
- 238000005259 measurement Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 241001422033 Thestylus Species 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61106824A JPS62263647A (ja) | 1986-05-12 | 1986-05-12 | ウエハプロ−バ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61106824A JPS62263647A (ja) | 1986-05-12 | 1986-05-12 | ウエハプロ−バ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62263647A JPS62263647A (ja) | 1987-11-16 |
| JPH0370900B2 true JPH0370900B2 (ko) | 1991-11-11 |
Family
ID=14443524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61106824A Granted JPS62263647A (ja) | 1986-05-12 | 1986-05-12 | ウエハプロ−バ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62263647A (ko) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2599939B2 (ja) * | 1987-11-30 | 1997-04-16 | 東京エレクトロン株式会社 | プローブ装置及びプローブ方法 |
| JP2626772B2 (ja) * | 1987-12-01 | 1997-07-02 | 東京エレクトロン株式会社 | プローブ装置 |
| JP2828989B2 (ja) * | 1988-04-08 | 1998-11-25 | 東京エレクトロン株式会社 | 半導体ウェハプローバ |
| JP2726899B2 (ja) * | 1988-06-27 | 1998-03-11 | 東京エレクトロン株式会社 | プローブ装置 |
| JPH02224260A (ja) * | 1988-11-02 | 1990-09-06 | Tokyo Electron Ltd | 位置合わせ方法 |
| US5148103A (en) * | 1990-10-31 | 1992-09-15 | Hughes Aircraft Company | Apparatus for testing integrated circuits |
| EP0707214A3 (en) * | 1994-10-14 | 1997-04-16 | Hughes Aircraft Co | Multiport membrane probe to test complete semiconductor plates |
| US5642054A (en) * | 1995-08-08 | 1997-06-24 | Hughes Aircraft Company | Active circuit multi-port membrane probe for full wafer testing |
| JP4123408B2 (ja) * | 2001-12-13 | 2008-07-23 | 東京エレクトロン株式会社 | プローブカード交換装置 |
| JP4998791B2 (ja) * | 2007-10-25 | 2012-08-15 | 横河電機株式会社 | 半導体試験装置 |
| JP6425027B2 (ja) * | 2015-03-24 | 2018-11-21 | 株式会社東京精密 | プローバ及びウエハチャック温度測定方法 |
| JP7287250B2 (ja) * | 2019-11-18 | 2023-06-06 | 三菱電機株式会社 | 試験装置及び試験方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58196029A (ja) * | 1982-05-11 | 1983-11-15 | Nec Corp | プロ−ブカ−ド切替装置 |
| JPS59175740A (ja) * | 1983-03-25 | 1984-10-04 | Telmec Co Ltd | ウエハ検出装置 |
-
1986
- 1986-05-12 JP JP61106824A patent/JPS62263647A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58196029A (ja) * | 1982-05-11 | 1983-11-15 | Nec Corp | プロ−ブカ−ド切替装置 |
| JPS59175740A (ja) * | 1983-03-25 | 1984-10-04 | Telmec Co Ltd | ウエハ検出装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62263647A (ja) | 1987-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |