JPH0370887B2 - - Google Patents
Info
- Publication number
- JPH0370887B2 JPH0370887B2 JP25906585A JP25906585A JPH0370887B2 JP H0370887 B2 JPH0370887 B2 JP H0370887B2 JP 25906585 A JP25906585 A JP 25906585A JP 25906585 A JP25906585 A JP 25906585A JP H0370887 B2 JPH0370887 B2 JP H0370887B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductive material
- pilot hole
- reference unit
- fired
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25906585A JPS62118505A (ja) | 1985-11-18 | 1985-11-18 | 積層チツプインダクタの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25906585A JPS62118505A (ja) | 1985-11-18 | 1985-11-18 | 積層チツプインダクタの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62118505A JPS62118505A (ja) | 1987-05-29 |
| JPH0370887B2 true JPH0370887B2 (enrdf_load_stackoverflow) | 1991-11-11 |
Family
ID=17328832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25906585A Granted JPS62118505A (ja) | 1985-11-18 | 1985-11-18 | 積層チツプインダクタの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118505A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH071821B2 (ja) * | 1989-12-11 | 1995-01-11 | サンケン電気株式会社 | 配線基板 |
| JPH04118910A (ja) * | 1990-02-23 | 1992-04-20 | Taiyo Yuden Co Ltd | 積層チップインダクタの製造方法 |
| CA2158784A1 (en) * | 1994-11-09 | 1996-05-10 | Jeffrey T. Adelman | Electronic thick film component termination and method of making the same |
| JP4816708B2 (ja) * | 2008-10-21 | 2011-11-16 | Ｔｄｋ株式会社 | 積層コンデンサの製造方法 |
| US8056199B2 (en) | 2008-10-21 | 2011-11-15 | Tdk Corporation | Methods of producing multilayer capacitor |
| US10269481B2 (en) * | 2016-05-27 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stacked coil for wireless charging structure on InFO package |
| CN112687462B (zh) * | 2020-12-11 | 2022-06-07 | 全南群英达电子有限公司 | 一种磁头磁芯冲切和铆压一体机 |
-
1985
- 1985-11-18 JP JP25906585A patent/JPS62118505A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62118505A (ja) | 1987-05-29 |
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