JPH037073Y2 - - Google Patents
Info
- Publication number
- JPH037073Y2 JPH037073Y2 JP1986084567U JP8456786U JPH037073Y2 JP H037073 Y2 JPH037073 Y2 JP H037073Y2 JP 1986084567 U JP1986084567 U JP 1986084567U JP 8456786 U JP8456786 U JP 8456786U JP H037073 Y2 JPH037073 Y2 JP H037073Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- temperature
- soldering
- amount
- rotation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986084567U JPH037073Y2 (https=) | 1986-06-03 | 1986-06-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986084567U JPH037073Y2 (https=) | 1986-06-03 | 1986-06-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62199264U JPS62199264U (https=) | 1987-12-18 |
| JPH037073Y2 true JPH037073Y2 (https=) | 1991-02-21 |
Family
ID=30939185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986084567U Expired JPH037073Y2 (https=) | 1986-06-03 | 1986-06-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH037073Y2 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5539434B2 (https=) * | 1972-08-25 | 1980-10-11 | ||
| JPS54117998A (en) * | 1978-03-06 | 1979-09-13 | Toshiba Corp | Laser working device |
| JPS56146831A (en) * | 1980-04-14 | 1981-11-14 | Hitachi Ltd | Temperature controlling method for continuous heat treatment apparatus |
| JPS5717369A (en) * | 1980-07-04 | 1982-01-29 | Toshiba Corp | Method for soldering by laser |
| JPS57111089A (en) * | 1980-12-27 | 1982-07-10 | Omron Tateisi Electronics Co | Method of sodering chip part |
| JPS5812106B2 (ja) * | 1981-05-25 | 1983-03-07 | 株式会社東芝 | レ−ザ半田付け装置 |
| JPS58122175A (ja) * | 1982-01-18 | 1983-07-20 | Nec Corp | ハンダ付け装置 |
-
1986
- 1986-06-03 JP JP1986084567U patent/JPH037073Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62199264U (https=) | 1987-12-18 |
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