JPH037073Y2 - - Google Patents

Info

Publication number
JPH037073Y2
JPH037073Y2 JP1986084567U JP8456786U JPH037073Y2 JP H037073 Y2 JPH037073 Y2 JP H037073Y2 JP 1986084567 U JP1986084567 U JP 1986084567U JP 8456786 U JP8456786 U JP 8456786U JP H037073 Y2 JPH037073 Y2 JP H037073Y2
Authority
JP
Japan
Prior art keywords
solder
temperature
soldering
amount
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986084567U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62199264U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986084567U priority Critical patent/JPH037073Y2/ja
Publication of JPS62199264U publication Critical patent/JPS62199264U/ja
Application granted granted Critical
Publication of JPH037073Y2 publication Critical patent/JPH037073Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1986084567U 1986-06-03 1986-06-03 Expired JPH037073Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986084567U JPH037073Y2 (enExample) 1986-06-03 1986-06-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986084567U JPH037073Y2 (enExample) 1986-06-03 1986-06-03

Publications (2)

Publication Number Publication Date
JPS62199264U JPS62199264U (enExample) 1987-12-18
JPH037073Y2 true JPH037073Y2 (enExample) 1991-02-21

Family

ID=30939185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986084567U Expired JPH037073Y2 (enExample) 1986-06-03 1986-06-03

Country Status (1)

Country Link
JP (1) JPH037073Y2 (enExample)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5539434B2 (enExample) * 1972-08-25 1980-10-11
JPS54117998A (en) * 1978-03-06 1979-09-13 Toshiba Corp Laser working device
JPS56146831A (en) * 1980-04-14 1981-11-14 Hitachi Ltd Temperature controlling method for continuous heat treatment apparatus
JPS5717369A (en) * 1980-07-04 1982-01-29 Toshiba Corp Method for soldering by laser
JPS57111089A (en) * 1980-12-27 1982-07-10 Omron Tateisi Electronics Co Method of sodering chip part
JPS5812106B2 (ja) * 1981-05-25 1983-03-07 株式会社東芝 レ−ザ半田付け装置
JPS58122175A (ja) * 1982-01-18 1983-07-20 Nec Corp ハンダ付け装置

Also Published As

Publication number Publication date
JPS62199264U (enExample) 1987-12-18

Similar Documents

Publication Publication Date Title
US4121087A (en) Method and apparatus for controlling laser welding
US5376770A (en) Process and device for machining workpieces by means of a laser beam
JPS6186069A (ja) 自動はんだ付けシステムの制御装置
JPH037073Y2 (enExample)
KR880002411B1 (ko) 직류 펄스 변조 아아크 용접 제어 장치 및 방법
EP1177849B1 (en) Brazing apparatus and brazing method in which the amount of heating is controlled on the basis of temperature of articles to be brazed
CA2049666C (en) Method for reducing the energy consumption and minimizing the martensite formation when joining a connecting piece of metal with a metal surface by pin brazing and arrangement forcarrying out the method
DE10056068C1 (de) Verfahren zum Steuern und Regeln der Laminiertemperatur eines beheizbaren Laminators und durch das Verfahren gesteuerter und geregelter Laminator
JPS59176535A (ja) 加熱液体が所定の加熱状態に達したとき加熱液体を操作する装置
JPS62172791A (ja) リフロ−式ハンダ付方法及び装置
JP3417287B2 (ja) 電子部品の熱圧着装置および熱圧着方法
DE102020113788A1 (de) Lötvorrichtung zum Löten durch Laserlicht und mit einer Lötvorrichtung versehene Robotervorrichtung
CN111069773B (zh) 一种光功率自动调节方法及其系统
JPS62292266A (ja) レ−ザはんだ付け方法
JP2712296B2 (ja) 加熱炉の温度制御装置
JPH05208266A (ja) こて式自動はんだ付け装置
JP3172371B2 (ja) レーザ加工方法
JP3280890B2 (ja) パルスヒート式接合装置およびその制御方法
JPS63309370A (ja) はんだ付方法
GB2271305A (en) Reflow soldering process control
EP3911449B1 (en) Ir non-contact temperature sensing in a dispenser
JP2873474B2 (ja) リフロー装置
JPS6026660A (ja) 蒸発源の溶融面制御装置
JPS60145264A (ja) はんだ付け方法
Shiloh et al. How to Profile a PCB