JPH0369230U - - Google Patents

Info

Publication number
JPH0369230U
JPH0369230U JP1989131168U JP13116889U JPH0369230U JP H0369230 U JPH0369230 U JP H0369230U JP 1989131168 U JP1989131168 U JP 1989131168U JP 13116889 U JP13116889 U JP 13116889U JP H0369230 U JPH0369230 U JP H0369230U
Authority
JP
Japan
Prior art keywords
group
semiconductor
semiconductor substrate
solder bump
connection areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989131168U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989131168U priority Critical patent/JPH0369230U/ja
Publication of JPH0369230U publication Critical patent/JPH0369230U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/012—

Landscapes

  • Wire Bonding (AREA)
JP1989131168U 1989-11-10 1989-11-10 Pending JPH0369230U (Direct)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989131168U JPH0369230U (Direct) 1989-11-10 1989-11-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989131168U JPH0369230U (Direct) 1989-11-10 1989-11-10

Publications (1)

Publication Number Publication Date
JPH0369230U true JPH0369230U (Direct) 1991-07-09

Family

ID=31678691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989131168U Pending JPH0369230U (Direct) 1989-11-10 1989-11-10

Country Status (1)

Country Link
JP (1) JPH0369230U (Direct)

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