JPH0366829B2 - - Google Patents

Info

Publication number
JPH0366829B2
JPH0366829B2 JP10207086A JP10207086A JPH0366829B2 JP H0366829 B2 JPH0366829 B2 JP H0366829B2 JP 10207086 A JP10207086 A JP 10207086A JP 10207086 A JP10207086 A JP 10207086A JP H0366829 B2 JPH0366829 B2 JP H0366829B2
Authority
JP
Japan
Prior art keywords
copper
plating
oxide film
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10207086A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62260389A (ja
Inventor
Kanji Murakami
Akio Tadokoro
Haruo Akaboshi
Mineo Kawamoto
Motoyo Wajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10207086A priority Critical patent/JPS62260389A/ja
Publication of JPS62260389A publication Critical patent/JPS62260389A/ja
Publication of JPH0366829B2 publication Critical patent/JPH0366829B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP10207086A 1986-05-06 1986-05-06 プリント配線板の製造方法 Granted JPS62260389A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10207086A JPS62260389A (ja) 1986-05-06 1986-05-06 プリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10207086A JPS62260389A (ja) 1986-05-06 1986-05-06 プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS62260389A JPS62260389A (ja) 1987-11-12
JPH0366829B2 true JPH0366829B2 (enrdf_load_stackoverflow) 1991-10-18

Family

ID=14317504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10207086A Granted JPS62260389A (ja) 1986-05-06 1986-05-06 プリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS62260389A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS62260389A (ja) 1987-11-12

Similar Documents

Publication Publication Date Title
JP2819523B2 (ja) 印刷配線板及びその製造方法
KR20060114010A (ko) 알루미늄상의 전기 도금 방법
JP2003008199A (ja) プリント配線基板の銅表面粗化方法ならびにプリント配線基板およびその製造方法
JP3605520B2 (ja) 多層プリント回路板の製造方法
US6044550A (en) Process for the manufacture of printed circuit boards
JPH04100294A (ja) プリント配線板の製造方法
JPH0217953B2 (enrdf_load_stackoverflow)
JP2550081B2 (ja) 回路形成法
JPH02238942A (ja) 銅箔と樹脂との密着性向上方法
JP2000261149A (ja) 多層プリント配線板およびその製造方法
JPH0366829B2 (enrdf_load_stackoverflow)
JPH08148810A (ja) プリント配線板の製造法
US5139923A (en) Method for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereon
JPH0964538A (ja) プリント配線板の製造方法
JPH0710028B2 (ja) プリント板の製造法
JPH0636470B2 (ja) 内層用回路板の銅回路の処理方法
JP2002266087A5 (enrdf_load_stackoverflow)
JPH05167248A (ja) プリント配線板の製造方法
JPS61163693A (ja) プリント配線板の製造方法
JPH03201592A (ja) プリント配線板の製造法
JP2768122B2 (ja) 多層配線板の製造方法
JP2768123B2 (ja) 多層配線板の製造方法
JPS6016494A (ja) プリント回路板の製造法
JPH04155993A (ja) 多層プリント配線板の製造法
JPS62266895A (ja) 耐熱性単層及び多層積層基板の製法