JPH0366608B2 - - Google Patents
Info
- Publication number
- JPH0366608B2 JPH0366608B2 JP22939882A JP22939882A JPH0366608B2 JP H0366608 B2 JPH0366608 B2 JP H0366608B2 JP 22939882 A JP22939882 A JP 22939882A JP 22939882 A JP22939882 A JP 22939882A JP H0366608 B2 JPH0366608 B2 JP H0366608B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- metal layer
- bonding material
- silicon
- temperature bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000005275 alloying Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57229398A JPS59119866A (ja) | 1982-12-27 | 1982-12-27 | 電子素子の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57229398A JPS59119866A (ja) | 1982-12-27 | 1982-12-27 | 電子素子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59119866A JPS59119866A (ja) | 1984-07-11 |
| JPH0366608B2 true JPH0366608B2 (cg-RX-API-DMAC10.html) | 1991-10-18 |
Family
ID=16891576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57229398A Granted JPS59119866A (ja) | 1982-12-27 | 1982-12-27 | 電子素子の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59119866A (cg-RX-API-DMAC10.html) |
-
1982
- 1982-12-27 JP JP57229398A patent/JPS59119866A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59119866A (ja) | 1984-07-11 |
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