JPH0365837B2 - - Google Patents

Info

Publication number
JPH0365837B2
JPH0365837B2 JP22179984A JP22179984A JPH0365837B2 JP H0365837 B2 JPH0365837 B2 JP H0365837B2 JP 22179984 A JP22179984 A JP 22179984A JP 22179984 A JP22179984 A JP 22179984A JP H0365837 B2 JPH0365837 B2 JP H0365837B2
Authority
JP
Japan
Prior art keywords
adhesive composition
acid
bis
resin
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22179984A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6198782A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP22179984A priority Critical patent/JPS6198782A/ja
Publication of JPS6198782A publication Critical patent/JPS6198782A/ja
Publication of JPH0365837B2 publication Critical patent/JPH0365837B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP22179984A 1984-10-22 1984-10-22 耐熱性接着剤組成物 Granted JPS6198782A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22179984A JPS6198782A (ja) 1984-10-22 1984-10-22 耐熱性接着剤組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22179984A JPS6198782A (ja) 1984-10-22 1984-10-22 耐熱性接着剤組成物

Publications (2)

Publication Number Publication Date
JPS6198782A JPS6198782A (ja) 1986-05-17
JPH0365837B2 true JPH0365837B2 (cg-RX-API-DMAC7.html) 1991-10-15

Family

ID=16772377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22179984A Granted JPS6198782A (ja) 1984-10-22 1984-10-22 耐熱性接着剤組成物

Country Status (1)

Country Link
JP (1) JPS6198782A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0771836B2 (ja) * 1988-03-22 1995-08-02 日立化成工業株式会社 金属板ベース銅張積層板
US5268432A (en) * 1992-06-16 1993-12-07 Industrial Technology Research Institute Heat resistant modified bismaleimide adhesive composition

Also Published As

Publication number Publication date
JPS6198782A (ja) 1986-05-17

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