JPH0365630B2 - - Google Patents
Info
- Publication number
- JPH0365630B2 JPH0365630B2 JP9739485A JP9739485A JPH0365630B2 JP H0365630 B2 JPH0365630 B2 JP H0365630B2 JP 9739485 A JP9739485 A JP 9739485A JP 9739485 A JP9739485 A JP 9739485A JP H0365630 B2 JPH0365630 B2 JP H0365630B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- connector
- alloy
- plating layer
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052718 tin Inorganic materials 0.000 claims description 10
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 31
- 239000010949 copper Substances 0.000 description 14
- 229910000906 Bronze Inorganic materials 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 239000010974 bronze Substances 0.000 description 7
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Mechanical Coupling Of Light Guides (AREA)
- Surgical Instruments (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9739485A JPS61256579A (ja) | 1985-05-08 | 1985-05-08 | コネクタ− |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9739485A JPS61256579A (ja) | 1985-05-08 | 1985-05-08 | コネクタ− |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61256579A JPS61256579A (ja) | 1986-11-14 |
JPH0365630B2 true JPH0365630B2 (zh) | 1991-10-14 |
Family
ID=14191299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9739485A Granted JPS61256579A (ja) | 1985-05-08 | 1985-05-08 | コネクタ− |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61256579A (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0830231B2 (ja) * | 1987-07-16 | 1996-03-27 | 古河電気工業株式会社 | 耐屈曲ケ−ブル導体 |
JPH0830232B2 (ja) * | 1987-07-16 | 1996-03-27 | 古河電気工業株式会社 | 耐屈曲ケ−ブル導体 |
JPH0830230B2 (ja) * | 1987-07-16 | 1996-03-27 | 古河電気工業株式会社 | 耐屈曲ケ−ブル導体 |
JPS6421024A (en) * | 1987-07-16 | 1989-01-24 | Furukawa Electric Co Ltd | Bending-resisting cable conductor |
US4990820A (en) * | 1988-03-04 | 1991-02-05 | General Electric Company | Corrosion resistant sockets for electric lamps |
JP4461269B2 (ja) * | 2004-09-15 | 2010-05-12 | Dowaメタルテック株式会社 | 導電性を改善した銅合金およびその製造法 |
-
1985
- 1985-05-08 JP JP9739485A patent/JPS61256579A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61256579A (ja) | 1986-11-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4441118A (en) | Composite copper nickel alloys with improved solderability shelf life | |
JP5025387B2 (ja) | 接続部品用導電材料及びその製造方法 | |
JP2008223143A (ja) | めっき材料とその製造方法、それを用いた電気・電子部品 | |
JP2726434B2 (ja) | SnまたはSn合金被覆材料 | |
JP3824884B2 (ja) | 端子ないしはコネクタ用銅合金材 | |
JP4522970B2 (ja) | ウィスカーが抑制されたCu−Zn合金耐熱Snめっき条 | |
JPH11193494A (ja) | かん合型接続端子用めっき材及びかん合型接続端子 | |
JP2008248332A (ja) | Snめっき条及びその製造方法 | |
JPS63121693A (ja) | コネクタ−用端子 | |
JPH0855521A (ja) | 通電部材およびその製造方法 | |
JPH0365630B2 (zh) | ||
JP2670348B2 (ja) | SnまたはSn合金被覆材料 | |
JP5226032B2 (ja) | ウィスカーが抑制されたCu−Zn合金耐熱Snめっき条 | |
JP4043834B2 (ja) | めっき材料とその製造方法、それを用いた電気・電子部品 | |
JP2000045039A (ja) | コンタクト材料とその製造方法 | |
JP2798512B2 (ja) | 錫めっき銅合金材およびその製造方法 | |
JP2851245B2 (ja) | Sn合金めっき材 | |
JP4570948B2 (ja) | ウィスカー発生を抑制したCu−Zn系合金のSnめっき条及びその製造方法 | |
JP2007204854A (ja) | めっき材料とその製造方法、それを用いた電気・電子部品 | |
JP4318449B2 (ja) | 鉛フリーはんだ合金 | |
JP7380448B2 (ja) | アルミニウム心線用防食端子材とその製造方法、及び防食端子並びに電線端末部構造 | |
JPS60174840A (ja) | 電子電気機器用リン青銅 | |
JP4014739B2 (ja) | リフローSnめっき材及び前記リフローSnめっき材を用いた端子、コネクタ、又はリード部材 | |
JPH01316432A (ja) | ハンダ耐候性にすぐれた導電材料用銅合金 | |
JPH07150272A (ja) | 電気・電子部品用錫めっき銅合金材およびその製造方法 |