JPH0363811B2 - - Google Patents

Info

Publication number
JPH0363811B2
JPH0363811B2 JP3712984A JP3712984A JPH0363811B2 JP H0363811 B2 JPH0363811 B2 JP H0363811B2 JP 3712984 A JP3712984 A JP 3712984A JP 3712984 A JP3712984 A JP 3712984A JP H0363811 B2 JPH0363811 B2 JP H0363811B2
Authority
JP
Japan
Prior art keywords
bonding
wire
substrate
area
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3712984A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60182147A (ja
Inventor
Koichi Chiba
Yoshio Terasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59037129A priority Critical patent/JPS60182147A/ja
Publication of JPS60182147A publication Critical patent/JPS60182147A/ja
Publication of JPH0363811B2 publication Critical patent/JPH0363811B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP59037129A 1984-02-28 1984-02-28 ワイヤボンデイング方法 Granted JPS60182147A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59037129A JPS60182147A (ja) 1984-02-28 1984-02-28 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59037129A JPS60182147A (ja) 1984-02-28 1984-02-28 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS60182147A JPS60182147A (ja) 1985-09-17
JPH0363811B2 true JPH0363811B2 (cg-RX-API-DMAC10.html) 1991-10-02

Family

ID=12488998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59037129A Granted JPS60182147A (ja) 1984-02-28 1984-02-28 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS60182147A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5700482B2 (ja) * 2012-11-16 2015-04-15 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
JPS60182147A (ja) 1985-09-17

Similar Documents

Publication Publication Date Title
JP4917112B2 (ja) 半導体装置
US5953589A (en) Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same
US8184453B1 (en) Increased capacity semiconductor package
US4801997A (en) High packing density lead frame and integrated circuit
JP3663295B2 (ja) チップスケールパッケージ
US8835225B2 (en) Method for fabricating quad flat non-leaded semiconductor package
US8395246B2 (en) Two-sided die in a four-sided leadframe based package
JP3292082B2 (ja) ターミナルランドフレームとそれを用いた樹脂封止型半導体装置の製造方法
US8349655B2 (en) Method of fabricating a two-sided die in a four-sided leadframe based package
US5270570A (en) Lead frame for a multiplicity of terminals
JPH0363811B2 (cg-RX-API-DMAC10.html)
US5466967A (en) Lead frame for a multiplicity of terminals
CA2000338A1 (en) Lead frame for a multiplicity of terminals
JP4764608B2 (ja) 半導体装置
JP3665609B2 (ja) 半導体装置及びその半導体装置を複数個実装した半導体装置ユニット
JPH0228356A (ja) 表面実装型半導体装置及びその製造方法
JP3830640B2 (ja) リードフレームとその製造方法およびそのリードフレームを使用した半導体装置
JPS61128551A (ja) 半導体装置用リ−ドフレ−ム
JP2822446B2 (ja) 混成集積回路装置
JPS63160262A (ja) リ−ドフレ−ムおよびそれを用いた半導体装置
JPH02198147A (ja) Ｉｃパッケージ
JPS63164226A (ja) テ−プキヤリア素子の製造方法
JP2001044351A (ja) 半導体装置およびその製造方法
JPH03245560A (ja) リードフレーム
JPH01245534A (ja) 半導体装置