JPH0361358B2 - - Google Patents
Info
- Publication number
- JPH0361358B2 JPH0361358B2 JP16401582A JP16401582A JPH0361358B2 JP H0361358 B2 JPH0361358 B2 JP H0361358B2 JP 16401582 A JP16401582 A JP 16401582A JP 16401582 A JP16401582 A JP 16401582A JP H0361358 B2 JPH0361358 B2 JP H0361358B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductor
- plating
- green sheet
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 47
- 239000004020 conductor Substances 0.000 claims description 41
- 238000007747 plating Methods 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 14
- 238000009713 electroplating Methods 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 10
- 238000003825 pressing Methods 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16401582A JPS5954297A (ja) | 1982-09-22 | 1982-09-22 | グリ−ンシ−ト印刷配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16401582A JPS5954297A (ja) | 1982-09-22 | 1982-09-22 | グリ−ンシ−ト印刷配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5954297A JPS5954297A (ja) | 1984-03-29 |
| JPH0361358B2 true JPH0361358B2 (de) | 1991-09-19 |
Family
ID=15785155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16401582A Granted JPS5954297A (ja) | 1982-09-22 | 1982-09-22 | グリ−ンシ−ト印刷配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5954297A (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6115394A (ja) * | 1984-07-02 | 1986-01-23 | 東京プリント工業株式会社 | ジヤンパ−層等を備えた複合プリント配線基板の積層方法 |
| JPS61147597A (ja) * | 1984-12-21 | 1986-07-05 | 株式会社住友金属セラミックス | セラミック回路基板の製造方法 |
-
1982
- 1982-09-22 JP JP16401582A patent/JPS5954297A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5954297A (ja) | 1984-03-29 |
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