JPH0361353B2 - - Google Patents

Info

Publication number
JPH0361353B2
JPH0361353B2 JP23280586A JP23280586A JPH0361353B2 JP H0361353 B2 JPH0361353 B2 JP H0361353B2 JP 23280586 A JP23280586 A JP 23280586A JP 23280586 A JP23280586 A JP 23280586A JP H0361353 B2 JPH0361353 B2 JP H0361353B2
Authority
JP
Japan
Prior art keywords
paste
substrate
circuit
bonding
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP23280586A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6387791A (ja
Inventor
Takashi Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP23280586A priority Critical patent/JPS6387791A/ja
Publication of JPS6387791A publication Critical patent/JPS6387791A/ja
Publication of JPH0361353B2 publication Critical patent/JPH0361353B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP23280586A 1986-09-30 1986-09-30 高放熱性回路基板の製造方法 Granted JPS6387791A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23280586A JPS6387791A (ja) 1986-09-30 1986-09-30 高放熱性回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23280586A JPS6387791A (ja) 1986-09-30 1986-09-30 高放熱性回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS6387791A JPS6387791A (ja) 1988-04-19
JPH0361353B2 true JPH0361353B2 (enrdf_load_stackoverflow) 1991-09-19

Family

ID=16945043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23280586A Granted JPS6387791A (ja) 1986-09-30 1986-09-30 高放熱性回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS6387791A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6387791A (ja) 1988-04-19

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