JPH0361332B2 - - Google Patents
Info
- Publication number
- JPH0361332B2 JPH0361332B2 JP8497987A JP8497987A JPH0361332B2 JP H0361332 B2 JPH0361332 B2 JP H0361332B2 JP 8497987 A JP8497987 A JP 8497987A JP 8497987 A JP8497987 A JP 8497987A JP H0361332 B2 JPH0361332 B2 JP H0361332B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- frame
- electrical component
- frame body
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 8
- 239000012777 electrically insulating material Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Organic Insulating Materials (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8497987A JPS63250109A (ja) | 1987-04-07 | 1987-04-07 | 電気部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8497987A JPS63250109A (ja) | 1987-04-07 | 1987-04-07 | 電気部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63250109A JPS63250109A (ja) | 1988-10-18 |
| JPH0361332B2 true JPH0361332B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-09-19 |
Family
ID=13845733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8497987A Granted JPS63250109A (ja) | 1987-04-07 | 1987-04-07 | 電気部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63250109A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7049680B2 (en) | 1994-05-27 | 2006-05-23 | Renesas Technology Corp. | Semiconductor integrated circuit device and process for manufacturing the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2958018B2 (ja) * | 1989-04-03 | 1999-10-06 | 日本ケミコン株式会社 | チップ形コンデンサ |
| JP4567954B2 (ja) * | 2003-07-31 | 2010-10-27 | 三洋電機株式会社 | 半導体装置およびその製造方法 |
-
1987
- 1987-04-07 JP JP8497987A patent/JPS63250109A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7049680B2 (en) | 1994-05-27 | 2006-05-23 | Renesas Technology Corp. | Semiconductor integrated circuit device and process for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63250109A (ja) | 1988-10-18 |