JPH0360649B2 - - Google Patents

Info

Publication number
JPH0360649B2
JPH0360649B2 JP5310882A JP5310882A JPH0360649B2 JP H0360649 B2 JPH0360649 B2 JP H0360649B2 JP 5310882 A JP5310882 A JP 5310882A JP 5310882 A JP5310882 A JP 5310882A JP H0360649 B2 JPH0360649 B2 JP H0360649B2
Authority
JP
Japan
Prior art keywords
mold
plastic
molding device
heating furnace
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5310882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58168511A (ja
Inventor
Yoji Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5310882A priority Critical patent/JPS58168511A/ja
Publication of JPS58168511A publication Critical patent/JPS58168511A/ja
Publication of JPH0360649B2 publication Critical patent/JPH0360649B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP5310882A 1982-03-31 1982-03-31 プラスチックモ−ルド形成方法 Granted JPS58168511A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5310882A JPS58168511A (ja) 1982-03-31 1982-03-31 プラスチックモ−ルド形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5310882A JPS58168511A (ja) 1982-03-31 1982-03-31 プラスチックモ−ルド形成方法

Publications (2)

Publication Number Publication Date
JPS58168511A JPS58168511A (ja) 1983-10-04
JPH0360649B2 true JPH0360649B2 (enrdf_load_stackoverflow) 1991-09-17

Family

ID=12933592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5310882A Granted JPS58168511A (ja) 1982-03-31 1982-03-31 プラスチックモ−ルド形成方法

Country Status (1)

Country Link
JP (1) JPS58168511A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS58168511A (ja) 1983-10-04

Similar Documents

Publication Publication Date Title
JP2778608B2 (ja) 樹脂モールド型半導体装置の製造方法
JPH04147814A (ja) 樹脂封入成形用金型
KR20190017684A (ko) 수지 성형품의 반송 기구, 수지 성형 장치 및 수지 성형품의 제조 방법
JPH0360649B2 (enrdf_load_stackoverflow)
KR20190075797A (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
JPS6154633A (ja) 半導体樹脂封止用金型
JP2666630B2 (ja) 半導体装置の製造方法
JPS61114824A (ja) レジンモ−ルド装置
JPS59172241A (ja) 半導体樹脂封止装置
JP2857075B2 (ja) 半導体パッケージの製造方法と、これに用いられるフィルムおよび金型
JP5724266B2 (ja) 熱硬化性樹脂の射出成形方法
JPH06132331A (ja) 半導体封止金型
JPS6154635A (ja) 半導体樹脂封止用金型
JPH06204273A (ja) 半導体樹脂封止装置
JP2000156385A (ja) 電子部品の樹脂封止成形方法
JPS6154636A (ja) 半導体樹脂封止用金型
JPH01235620A (ja) 電子部品の樹脂封止成形用金型
JPH04179242A (ja) 半導体素子の封止方法
JPS5821345A (ja) 電子部品の樹脂封止方法
JP3543742B2 (ja) 樹脂封止成形装置
JPH0431285B2 (enrdf_load_stackoverflow)
JPS6224632A (ja) モ−ルド金型
JPS61117844A (ja) 半導体装置の樹脂封止方法
CN114927426A (zh) 一种盖体封装中去除胶层气泡的方法及所用模具
JP2000037745A (ja) 熱硬化性樹脂成形品の製造方法と製造装置および金型装置