JPH0358544B2 - - Google Patents
Info
- Publication number
- JPH0358544B2 JPH0358544B2 JP59219207A JP21920784A JPH0358544B2 JP H0358544 B2 JPH0358544 B2 JP H0358544B2 JP 59219207 A JP59219207 A JP 59219207A JP 21920784 A JP21920784 A JP 21920784A JP H0358544 B2 JPH0358544 B2 JP H0358544B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- array
- memory cell
- semiconductor device
- long side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003491 array Methods 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Dram (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59219207A JPS6197854A (ja) | 1984-10-18 | 1984-10-18 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59219207A JPS6197854A (ja) | 1984-10-18 | 1984-10-18 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6197854A JPS6197854A (ja) | 1986-05-16 |
JPH0358544B2 true JPH0358544B2 (de) | 1991-09-05 |
Family
ID=16731882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59219207A Granted JPS6197854A (ja) | 1984-10-18 | 1984-10-18 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6197854A (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5365113A (en) * | 1987-06-30 | 1994-11-15 | Hitachi, Ltd. | Semiconductor device |
US5184208A (en) * | 1987-06-30 | 1993-02-02 | Hitachi, Ltd. | Semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6140053A (ja) * | 1984-07-31 | 1986-02-26 | Toshiba Corp | 半導体装置 |
-
1984
- 1984-10-18 JP JP59219207A patent/JPS6197854A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6140053A (ja) * | 1984-07-31 | 1986-02-26 | Toshiba Corp | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6197854A (ja) | 1986-05-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |