JPH0357617B2 - - Google Patents
Info
- Publication number
- JPH0357617B2 JPH0357617B2 JP59171953A JP17195384A JPH0357617B2 JP H0357617 B2 JPH0357617 B2 JP H0357617B2 JP 59171953 A JP59171953 A JP 59171953A JP 17195384 A JP17195384 A JP 17195384A JP H0357617 B2 JPH0357617 B2 JP H0357617B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- tool
- semiconductor element
- metal protrusions
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 71
- 239000002184 metal Substances 0.000 claims description 71
- 239000004065 semiconductor Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910010977 Ti—Pd Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59171953A JPS6150339A (ja) | 1984-08-18 | 1984-08-18 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59171953A JPS6150339A (ja) | 1984-08-18 | 1984-08-18 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6150339A JPS6150339A (ja) | 1986-03-12 |
| JPH0357617B2 true JPH0357617B2 (nl) | 1991-09-02 |
Family
ID=15932842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59171953A Granted JPS6150339A (ja) | 1984-08-18 | 1984-08-18 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6150339A (nl) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8866780B2 (en) | 2007-12-03 | 2014-10-21 | Apple Inc. | Multi-dimensional scroll wheel |
| US8872771B2 (en) | 2009-07-07 | 2014-10-28 | Apple Inc. | Touch sensing device having conductive nodes |
| US8933890B2 (en) | 2003-11-25 | 2015-01-13 | Apple Inc. | Techniques for interactive input to portable electronic devices |
| US8952886B2 (en) | 2001-10-22 | 2015-02-10 | Apple Inc. | Method and apparatus for accelerated scrolling |
| US9354751B2 (en) | 2009-05-15 | 2016-05-31 | Apple Inc. | Input device with optimized capacitive sensing |
| US9360967B2 (en) | 2006-07-06 | 2016-06-07 | Apple Inc. | Mutual capacitance touch sensing device |
| US9367151B2 (en) | 2005-12-30 | 2016-06-14 | Apple Inc. | Touch pad with symbols based on mode |
| US9405421B2 (en) | 2006-07-06 | 2016-08-02 | Apple Inc. | Mutual capacitance touch sensing device |
| US9454256B2 (en) | 2008-03-14 | 2016-09-27 | Apple Inc. | Sensor configurations of an input device that are switchable based on mode |
-
1984
- 1984-08-18 JP JP59171953A patent/JPS6150339A/ja active Granted
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8952886B2 (en) | 2001-10-22 | 2015-02-10 | Apple Inc. | Method and apparatus for accelerated scrolling |
| US9009626B2 (en) | 2001-10-22 | 2015-04-14 | Apple Inc. | Method and apparatus for accelerated scrolling |
| US8933890B2 (en) | 2003-11-25 | 2015-01-13 | Apple Inc. | Techniques for interactive input to portable electronic devices |
| US9367151B2 (en) | 2005-12-30 | 2016-06-14 | Apple Inc. | Touch pad with symbols based on mode |
| US9360967B2 (en) | 2006-07-06 | 2016-06-07 | Apple Inc. | Mutual capacitance touch sensing device |
| US9405421B2 (en) | 2006-07-06 | 2016-08-02 | Apple Inc. | Mutual capacitance touch sensing device |
| US8866780B2 (en) | 2007-12-03 | 2014-10-21 | Apple Inc. | Multi-dimensional scroll wheel |
| US9454256B2 (en) | 2008-03-14 | 2016-09-27 | Apple Inc. | Sensor configurations of an input device that are switchable based on mode |
| US9354751B2 (en) | 2009-05-15 | 2016-05-31 | Apple Inc. | Input device with optimized capacitive sensing |
| US8872771B2 (en) | 2009-07-07 | 2014-10-28 | Apple Inc. | Touch sensing device having conductive nodes |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6150339A (ja) | 1986-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4048438A (en) | Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips | |
| KR100265616B1 (ko) | 도전성 폴리머 및 유전체를 이용한 플립칩 | |
| JP3131379B2 (ja) | はんだマスクの窓内に多数のはんだダムを備える電子モジュール | |
| JPH0332914B2 (nl) | ||
| JPS60262430A (ja) | 半導体装置の製造方法 | |
| US5109601A (en) | Method of marking a thin film package | |
| KR19980063532A (ko) | 반도체 장치와 그의 제조방법 및 필름 캐리어 테이프와 그의 제조방법 | |
| JP2003508898A (ja) | マイクロビームアセンブリおよび集積回路と基板との内部連結方法 | |
| JPH0357617B2 (nl) | ||
| JPH0432541B2 (nl) | ||
| US4965700A (en) | Thin film package for mixed bonding of chips | |
| JP2643613B2 (ja) | 電気的接続接点の形成方法および電子部品の実装方法 | |
| JP2721580B2 (ja) | 半導体装置の製造方法 | |
| JPH03101142A (ja) | 半導体装置の製造方法 | |
| JP2764628B2 (ja) | 電子回路基板とその製造方法 | |
| JPH03129745A (ja) | 半導体装置の実装方法 | |
| JP2674786B2 (ja) | Ｉｃの実装方法および実装装置 | |
| JP3021508B2 (ja) | 導電突起の形成方法 | |
| JPH0510365Y2 (nl) | ||
| EP0343379A2 (en) | Thin film package for mixed bonding of a chip | |
| JP2000294586A (ja) | 半導体装置及び半導体装置の製造方法 | |
| JPH05251505A (ja) | Ｉｃチップのエリアテープへの接続方法 | |
| JP2867547B2 (ja) | 導電突起の形成方法 | |
| JP2998507B2 (ja) | 半導体装置の製造方法 | |
| JPS6091656A (ja) | 半導体装置の製造方法 |