JPH0354461B2 - - Google Patents

Info

Publication number
JPH0354461B2
JPH0354461B2 JP57030292A JP3029282A JPH0354461B2 JP H0354461 B2 JPH0354461 B2 JP H0354461B2 JP 57030292 A JP57030292 A JP 57030292A JP 3029282 A JP3029282 A JP 3029282A JP H0354461 B2 JPH0354461 B2 JP H0354461B2
Authority
JP
Japan
Prior art keywords
etching
film
active layer
opening
compound semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57030292A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58147122A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3029282A priority Critical patent/JPS58147122A/ja
Publication of JPS58147122A publication Critical patent/JPS58147122A/ja
Publication of JPH0354461B2 publication Critical patent/JPH0354461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Drying Of Semiconductors (AREA)
JP3029282A 1982-02-26 1982-02-26 化合物半導体装置の製造方法 Granted JPS58147122A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3029282A JPS58147122A (ja) 1982-02-26 1982-02-26 化合物半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3029282A JPS58147122A (ja) 1982-02-26 1982-02-26 化合物半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58147122A JPS58147122A (ja) 1983-09-01
JPH0354461B2 true JPH0354461B2 (enrdf_load_stackoverflow) 1991-08-20

Family

ID=12299648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3029282A Granted JPS58147122A (ja) 1982-02-26 1982-02-26 化合物半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58147122A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4595454A (en) * 1984-06-15 1986-06-17 At&T Bell Laboratories Fabrication of grooved semiconductor devices
JPH0212817A (ja) * 1988-06-29 1990-01-17 Nec Corp ドライエッチング方法
JP2953958B2 (ja) * 1994-09-01 1999-09-27 日本電気株式会社 ドライエッチング方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5929136B2 (ja) * 1976-03-30 1984-07-18 株式会社東芝 半導体装置の製造方法
JPS5710936A (en) * 1980-06-25 1982-01-20 Sanyo Electric Co Ltd Forming method for contact hole
JPS5737835A (en) * 1980-08-19 1982-03-02 Nec Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS58147122A (ja) 1983-09-01

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