JPH0353795B2 - - Google Patents

Info

Publication number
JPH0353795B2
JPH0353795B2 JP59247123A JP24712384A JPH0353795B2 JP H0353795 B2 JPH0353795 B2 JP H0353795B2 JP 59247123 A JP59247123 A JP 59247123A JP 24712384 A JP24712384 A JP 24712384A JP H0353795 B2 JPH0353795 B2 JP H0353795B2
Authority
JP
Japan
Prior art keywords
layer
ground
signal
polyimide
entire surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59247123A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61125196A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP59247123A priority Critical patent/JPS61125196A/ja
Priority to US06/724,587 priority patent/US4754371A/en
Priority to FR8506423A priority patent/FR2563656B1/fr
Publication of JPS61125196A publication Critical patent/JPS61125196A/ja
Publication of JPH0353795B2 publication Critical patent/JPH0353795B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP59247123A 1984-04-27 1984-11-22 回路基板 Granted JPS61125196A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP59247123A JPS61125196A (ja) 1984-11-22 1984-11-22 回路基板
US06/724,587 US4754371A (en) 1984-04-27 1985-04-18 Large scale integrated circuit package
FR8506423A FR2563656B1 (fr) 1984-04-27 1985-04-26 Bloc de circuits a integration a grande echelle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59247123A JPS61125196A (ja) 1984-11-22 1984-11-22 回路基板

Publications (2)

Publication Number Publication Date
JPS61125196A JPS61125196A (ja) 1986-06-12
JPH0353795B2 true JPH0353795B2 (fr) 1991-08-16

Family

ID=17158771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59247123A Granted JPS61125196A (ja) 1984-04-27 1984-11-22 回路基板

Country Status (1)

Country Link
JP (1) JPS61125196A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4880684A (en) * 1988-03-11 1989-11-14 International Business Machines Corporation Sealing and stress relief layers and use thereof
JP2645233B2 (ja) * 1995-04-21 1997-08-25 テインチイチイイエ ヨウシェンコンス 低漏話信号伝送媒体

Also Published As

Publication number Publication date
JPS61125196A (ja) 1986-06-12

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