JPH0353793B2 - - Google Patents
Info
- Publication number
- JPH0353793B2 JPH0353793B2 JP59009762A JP976284A JPH0353793B2 JP H0353793 B2 JPH0353793 B2 JP H0353793B2 JP 59009762 A JP59009762 A JP 59009762A JP 976284 A JP976284 A JP 976284A JP H0353793 B2 JPH0353793 B2 JP H0353793B2
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- substrate
- solder
- hole
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 26
- 239000004020 conductor Substances 0.000 claims description 24
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 238000009792 diffusion process Methods 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 10
- 238000007740 vapor deposition Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000007769 metal material Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 238000009736 wetting Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 12
- 239000010409 thin film Substances 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP976284A JPS59150495A (ja) | 1984-01-23 | 1984-01-23 | 厚膜回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP976284A JPS59150495A (ja) | 1984-01-23 | 1984-01-23 | 厚膜回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59150495A JPS59150495A (ja) | 1984-08-28 |
| JPH0353793B2 true JPH0353793B2 (de) | 1991-08-16 |
Family
ID=11729283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP976284A Granted JPS59150495A (ja) | 1984-01-23 | 1984-01-23 | 厚膜回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59150495A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6287476U (de) * | 1985-11-19 | 1987-06-04 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4841257A (de) * | 1971-09-23 | 1973-06-16 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5234949U (de) * | 1975-09-03 | 1977-03-11 |
-
1984
- 1984-01-23 JP JP976284A patent/JPS59150495A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4841257A (de) * | 1971-09-23 | 1973-06-16 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59150495A (ja) | 1984-08-28 |
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