JPH0353499Y2 - - Google Patents

Info

Publication number
JPH0353499Y2
JPH0353499Y2 JP1985037960U JP3796085U JPH0353499Y2 JP H0353499 Y2 JPH0353499 Y2 JP H0353499Y2 JP 1985037960 U JP1985037960 U JP 1985037960U JP 3796085 U JP3796085 U JP 3796085U JP H0353499 Y2 JPH0353499 Y2 JP H0353499Y2
Authority
JP
Japan
Prior art keywords
lead frame
molding
mold
tablet
storage section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985037960U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61153342U (en, 2012
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985037960U priority Critical patent/JPH0353499Y2/ja
Publication of JPS61153342U publication Critical patent/JPS61153342U/ja
Application granted granted Critical
Publication of JPH0353499Y2 publication Critical patent/JPH0353499Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1985037960U 1985-03-15 1985-03-15 Expired JPH0353499Y2 (en, 2012)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985037960U JPH0353499Y2 (en, 2012) 1985-03-15 1985-03-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985037960U JPH0353499Y2 (en, 2012) 1985-03-15 1985-03-15

Publications (2)

Publication Number Publication Date
JPS61153342U JPS61153342U (en, 2012) 1986-09-22
JPH0353499Y2 true JPH0353499Y2 (en, 2012) 1991-11-22

Family

ID=30544522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985037960U Expired JPH0353499Y2 (en, 2012) 1985-03-15 1985-03-15

Country Status (1)

Country Link
JP (1) JPH0353499Y2 (en, 2012)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167639A (en) * 1981-04-08 1982-10-15 Toshiba Corp Feeder for lead frame in molding device for resin sealing
JPH0339804Y2 (en, 2012) * 1985-08-02 1991-08-21

Also Published As

Publication number Publication date
JPS61153342U (en, 2012) 1986-09-22

Similar Documents

Publication Publication Date Title
CN110871356B (zh) 门锁旋钮组件的自动组装机
JPH10208844A (ja) ワイヤーハーネス用コネクタ端子の実装装置
JP2976266B2 (ja) 多点品の組立システム
JP4339452B2 (ja) Ｃｓｐ基板分割装置
US20050102976A1 (en) Diagnostic kit flexible assembly system and method of using the same
CN108582641B (zh) 卡托自动化生产方法
JP3542365B2 (ja) 汎用リード加工機
JP4288059B2 (ja) ワーク収納装置及びワーク収納方法
JPH0353499Y2 (en, 2012)
JPH0353500Y2 (en, 2012)
JP3609824B1 (ja) 樹脂封止成形装置
CN110064927A (zh) 一种光电开关自动组装裁切设备
JP2547192B2 (ja) 半導体部品の製造方法及び製造装置
JPS61210641A (ja) 半導体部品の製造装置
JPS59220931A (ja) 集積回路用自動モ−ルデイング装置
KR900007807B1 (ko) 가공물의 공급방법
JP3304569B2 (ja) 排出シュータ付き搬送レール機構
JPS6262461B2 (en, 2012)
JPH104108A (ja) 線材供給装置
JPH01186638A (ja) 自動モールディング装置
JPS6131628B2 (en, 2012)
CN112074085B (zh) 带有信息跟踪系统的全自动智能生产线
JP2897455B2 (ja) 捺印装置
JP3720132B2 (ja) 樹脂モールド装置
JPH07241874A (ja) 電子部品の樹脂封止装置