JPH035273B2 - - Google Patents
Info
- Publication number
- JPH035273B2 JPH035273B2 JP31127886A JP31127886A JPH035273B2 JP H035273 B2 JPH035273 B2 JP H035273B2 JP 31127886 A JP31127886 A JP 31127886A JP 31127886 A JP31127886 A JP 31127886A JP H035273 B2 JPH035273 B2 JP H035273B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- vapor phase
- saturated vapor
- elevating body
- preheat chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012808 vapor phase Substances 0.000 claims description 32
- 230000003028 elevating effect Effects 0.000 claims description 24
- 229920006395 saturated elastomer Polymers 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 13
- 238000009834 vaporization Methods 0.000 claims description 5
- 230000008016 vaporization Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000007664 blowing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31127886A JPS63168276A (ja) | 1986-12-27 | 1986-12-27 | バツチタイプ気相式はんだ付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31127886A JPS63168276A (ja) | 1986-12-27 | 1986-12-27 | バツチタイプ気相式はんだ付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63168276A JPS63168276A (ja) | 1988-07-12 |
| JPH035273B2 true JPH035273B2 (enrdf_load_stackoverflow) | 1991-01-25 |
Family
ID=18015208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31127886A Granted JPS63168276A (ja) | 1986-12-27 | 1986-12-27 | バツチタイプ気相式はんだ付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63168276A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5831340A (en) * | 1995-05-25 | 1998-11-03 | Nippondenso Co., Ltd. | Starter with high vibration resistance construction |
| JPH09209891A (ja) * | 1996-02-08 | 1997-08-12 | Denso Corp | スタータ |
-
1986
- 1986-12-27 JP JP31127886A patent/JPS63168276A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63168276A (ja) | 1988-07-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW449840B (en) | Compact reflow and cleaning apparatus | |
| KR960030309A (ko) | 레지스트처리장치 및 레지스트처리방법 | |
| JPH035273B2 (enrdf_load_stackoverflow) | ||
| JPH07176472A (ja) | 基板加熱装置 | |
| JP2000022325A (ja) | リフロー装置およびリフロー装置を用いた加熱方法 | |
| JPS58212861A (ja) | 雰囲気炉 | |
| US20040200878A1 (en) | System and method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process | |
| JPH09246712A (ja) | リフロー半田付け方法とその装置 | |
| JPH0216854Y2 (enrdf_load_stackoverflow) | ||
| JPH11162804A (ja) | 熱処理装置及び熱処理方法 | |
| JP3191398B2 (ja) | リフロー装置 | |
| JPH0779071A (ja) | 電子部品のはんだ付け方法及びはんだ付け装置 | |
| JP2000015431A (ja) | リフロー方法およびその装置 | |
| JP2994454B2 (ja) | はんだリフロー炉 | |
| JP2634449B2 (ja) | 気相式はんだ付け装置 | |
| JPS61289967A (ja) | 連続加熱装置 | |
| JPS62144876A (ja) | 電子部品の半田付け装置 | |
| JPH0726049Y2 (ja) | 自動半田付け機 | |
| JPH03216269A (ja) | リフロー装置 | |
| JPH02238289A (ja) | 雰囲気炉の酸素濃度低減化方法及び酸素濃度極低化雰囲気炉 | |
| JPH06204230A (ja) | バンプ形成法およびバンプ製造装置 | |
| JPH0377772A (ja) | 赤外線加熱式リフローハンダ付け方法および赤外線加熱式リフローハンダ付け装置 | |
| JPS63130266A (ja) | 連続加熱装置 | |
| JPS6125461B2 (enrdf_load_stackoverflow) | ||
| JP4186284B2 (ja) | 加熱装置 |