JPH035075B2 - - Google Patents
Info
- Publication number
- JPH035075B2 JPH035075B2 JP57233705A JP23370582A JPH035075B2 JP H035075 B2 JPH035075 B2 JP H035075B2 JP 57233705 A JP57233705 A JP 57233705A JP 23370582 A JP23370582 A JP 23370582A JP H035075 B2 JPH035075 B2 JP H035075B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- ceramic circuit
- green sheet
- glass
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23370582A JPS59124149A (ja) | 1982-12-29 | 1982-12-29 | セラミツク回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23370582A JPS59124149A (ja) | 1982-12-29 | 1982-12-29 | セラミツク回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59124149A JPS59124149A (ja) | 1984-07-18 |
| JPH035075B2 true JPH035075B2 (enrdf_load_html_response) | 1991-01-24 |
Family
ID=16959251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23370582A Granted JPS59124149A (ja) | 1982-12-29 | 1982-12-29 | セラミツク回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59124149A (enrdf_load_html_response) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60153193A (ja) * | 1984-01-23 | 1985-08-12 | 富士通株式会社 | セラミツク回路基板用導電ペ−スト |
| JPH0611018B2 (ja) * | 1988-01-07 | 1994-02-09 | 株式会社村田製作所 | セラミック生シートの積層方法 |
| JPH065656B2 (ja) * | 1988-02-19 | 1994-01-19 | 株式会社村田製作所 | セラミック積層体の製造方法 |
| US5682018A (en) * | 1991-10-18 | 1997-10-28 | International Business Machines Corporation | Interface regions between metal and ceramic in a metal/ceramic substrate |
| JPH05221760A (ja) * | 1992-02-04 | 1993-08-31 | Shinko Electric Ind Co Ltd | 回路形成用金属ペースト及びセラミック回路基板の製造方法 |
| JP5436699B2 (ja) * | 2011-02-04 | 2014-03-05 | 三菱電機株式会社 | パターン形成方法および太陽電池の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5396692A (en) * | 1977-02-03 | 1978-08-24 | Dainippon Printing Co Ltd | Method of making electrode plate |
| JPS55107295A (en) * | 1979-02-09 | 1980-08-16 | Hitachi Ltd | Method of fabricating ceramic circuit board |
-
1982
- 1982-12-29 JP JP23370582A patent/JPS59124149A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59124149A (ja) | 1984-07-18 |
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