JPH0350363U - - Google Patents
Info
- Publication number
- JPH0350363U JPH0350363U JP11003289U JP11003289U JPH0350363U JP H0350363 U JPH0350363 U JP H0350363U JP 11003289 U JP11003289 U JP 11003289U JP 11003289 U JP11003289 U JP 11003289U JP H0350363 U JPH0350363 U JP H0350363U
- Authority
- JP
- Japan
- Prior art keywords
- gold
- substrate
- heat sink
- platinum
- chromium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004927 fusion Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- -1 chromium-gold-platinum-tin Chemical compound 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Description
図面は、本考案の半導体レーザのヒートシンク
の１実施例を示し、第１図は断面図、第２図ａ〜
ｃは形成工程を示す断面図、第３図は半導体レー
ザの電流と光出力との関係図である。
１……ヒートシンク基板、２……レーザチツプ
用融着層、３……ステム用融着層、２ａ，３ａ…
…Ｃｒ層、２ｂ，２ｄ，３ｂ……Ａｕ層、２ｃ，
３ｃ……Ｐｔ層、２ｅ……Ｉｎ層、３ｄ……Ｓｎ
層。
The drawings show an embodiment of a heat sink for a semiconductor laser according to the present invention, and FIG. 1 is a cross-sectional view, and FIG.
3c is a sectional view showing the formation process, and FIG. 3 is a diagram showing the relationship between the current and optical output of the semiconductor laser. DESCRIPTION OF SYMBOLS 1...Heat sink board, 2...Fusion layer for laser chip, 3...Fusion layer for stem, 2a, 3a...
...Cr layer, 2b, 2d, 3b...Au layer, 2c,
3c...Pt layer, 2e...In layer, 3d...Sn
layer.
Claims (1)
ートシンク基板と、 前記基板の上面にクロム−金−白金−金−イン
ジウムの各層が順次積層されて形成されたレーザ
チツプ用融着層と、 前記基板の下面にクロム−金−白金−スズの各
層が順次積層されて形成されたシステム用融着層
と を備えた半導体レーザのヒートシンク。[Claims for Utility Model Registration] A heat sink substrate made of cubic boron nitride or diamond, and a fusion layer for a laser chip formed by successively laminating layers of chromium, gold, platinum, gold, and indium on the upper surface of the substrate. . A heat sink for a semiconductor laser, comprising: a system adhesive layer formed by sequentially laminating chromium-gold-platinum-tin layers on the lower surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11003289U JPH0350363U (en) | 1989-09-20 | 1989-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11003289U JPH0350363U (en) | 1989-09-20 | 1989-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350363U true JPH0350363U (en) | 1991-05-16 |
Family
ID=31658589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11003289U Pending JPH0350363U (en) | 1989-09-20 | 1989-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350363U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5852892A (en) * | 1981-09-25 | 1983-03-29 | Hitachi Ltd | Mounting structure of compound semiconductor element |
| JPS6459838A (en) * | 1987-08-31 | 1989-03-07 | Denki Kagaku Kogyo Kk | Heat sink |
-
1989
- 1989-09-20 JP JP11003289U patent/JPH0350363U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5852892A (en) * | 1981-09-25 | 1983-03-29 | Hitachi Ltd | Mounting structure of compound semiconductor element |
| JPS6459838A (en) * | 1987-08-31 | 1989-03-07 | Denki Kagaku Kogyo Kk | Heat sink |