JPS6210461U - - Google Patents
Info
- Publication number
- JPS6210461U JPS6210461U JP10073585U JP10073585U JPS6210461U JP S6210461 U JPS6210461 U JP S6210461U JP 10073585 U JP10073585 U JP 10073585U JP 10073585 U JP10073585 U JP 10073585U JP S6210461 U JPS6210461 U JP S6210461U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor laser
- alloy
- stem
- sequentially laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910015367 Au—Sb Inorganic materials 0.000 claims description 2
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 229910001245 Sb alloy Inorganic materials 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の実施例を示す断面図、第２図
は寿命特性を示す特性図、第３図は従来装置を示
す断面図である。
１…Ｓｉヒートシンク、２，６…第１、第２の
Ａｕ―Ｓｂ層、３，７…第１、第２のＰｔ層、４
…Ａｕ層、５…Ｉｎ層、８…Ｓｎ層、９…半導体
レーザチツプ、１０…Ｃｕステム、１２…Ｉｎ―
Ｓｎ合金半田。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a characteristic diagram showing life characteristics, and FIG. 3 is a sectional view showing a conventional device. 1... Si heat sink, 2, 6... First and second Au-Sb layers, 3, 7... First and second Pt layers, 4
...Au layer, 5...In layer, 8...Sn layer, 9...semiconductor laser chip, 10...Cu stem, 12...In-
Sn alloy solder.
Claims (1)
てＣｕステム上にボンデイングしてなる半導体レ
ーザ装置において、 上記Ｓｉヒートシンクの上記半導体レーザチツ
プ固着面にはＡｕ―Ｓｂ合金、Ｐｔ，Ａｕ，Ｉｎ
が順次積層され、上記Ｓｉヒートシンクの上記Ｃ
ｕステム固着面にはＡｕ―Ｓｂ合金、Ｐｔ，Ｓｎ
が順次積層され、上記Ｓｉヒートシンクと上記Ｃ
ｕステムとはＩｎ―Ｓｎ合金半田にて回着された
ことを特徴とする半導体レーザ装置。[Claims for Utility Model Registration] In a semiconductor laser device formed by bonding a semiconductor laser chip onto a Cu stem via a Si heat sink, the surface of the Si heat sink to which the semiconductor laser chip is fixed is made of Au--Sb alloy, Pt, Au, In.
are sequentially laminated, and the above C of the above Si heat sink is
The u-stem fixing surface is made of Au-Sb alloy, Pt, Sn.
are sequentially laminated, and the above Si heat sink and the above C
The u-stem is a semiconductor laser device characterized by being connected using In--Sn alloy solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10073585U JPH041742Y2 (en) | 1985-07-02 | 1985-07-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10073585U JPH041742Y2 (en) | 1985-07-02 | 1985-07-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6210461U true JPS6210461U (en) | 1987-01-22 |
| JPH041742Y2 JPH041742Y2 (en) | 1992-01-21 |
Family
ID=30970834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10073585U Expired JPH041742Y2 (en) | 1985-07-02 | 1985-07-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH041742Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06147030A (en) * | 1992-10-29 | 1994-05-27 | Kiyousan Denki Kk | Fuel vaporized gas discharge restraining device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7129581B1 (en) * | 2022-06-01 | 2022-09-01 | 田中貴金属工業株式会社 | Materials for deposition equipment |
| JP7175420B1 (en) * | 2022-06-01 | 2022-11-18 | 田中貴金属工業株式会社 | METHOD FOR MANUFACTURING MEMBERS FOR FILM-FORMING APPARATUS, METHOD FOR REMOVING DEPOSIT, METHOD FOR RECOVERING VALUABLE METAL, AND METHOD FOR REPRODUCTION OF MEMBER FOR FILM-FORMING APPARATUS |
-
1985
- 1985-07-02 JP JP10073585U patent/JPH041742Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06147030A (en) * | 1992-10-29 | 1994-05-27 | Kiyousan Denki Kk | Fuel vaporized gas discharge restraining device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH041742Y2 (en) | 1992-01-21 |
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