JPH0369233U - - Google Patents
Info
- Publication number
- JPH0369233U JPH0369233U JP1989130600U JP13060089U JPH0369233U JP H0369233 U JPH0369233 U JP H0369233U JP 1989130600 U JP1989130600 U JP 1989130600U JP 13060089 U JP13060089 U JP 13060089U JP H0369233 U JPH0369233 U JP H0369233U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum electrode
- semiconductor device
- film carrier
- film
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例を示す半導体素子の電
極形成工程断面図、第２図は本考案の半導体素子
へのフイルムキヤリアの接続状態を示す一部破断
斜視図、第３図は従来の半導体素子の電極形成工
程断面図、第４図は従来の半導体素子の金突起電
極とフイルムキヤリア法によるインナリードとの
接続状態を示す断面図である。
３１……半導体素子、３２……熱酸化（ＳｉＯ
２）膜、３３……アルミニウム電極、３４……保
護（Ｓｉ３Ｎ４）膜、３７……レジスト、３８…
…開口部、４０……インナリード、４１……ポリ
イミドフイルム、４６……ボンデイング治具。
FIG. 1 is a cross-sectional view of the electrode formation process of a semiconductor device showing an embodiment of the present invention, FIG. 2 is a partially cutaway perspective view showing the state of connection of a film carrier to the semiconductor device of the present invention, and FIG. 3 is a conventional FIG. 4 is a cross-sectional view showing the process of forming electrodes of a semiconductor element. FIG. 4 is a cross-sectional view showing a connection state between a gold protrusion electrode of a conventional semiconductor element and an inner lead by a film carrier method. 31...Semiconductor element, 32...Thermal oxidation (SiO
2 ) Film, 33... Aluminum electrode, 34... Protective (Si 3 N 4 ) film, 37... Resist, 38...
...opening, 40...inner lead, 41...polyimide film, 46...bonding jig.
Claims (1)
において (a) 半導体素子の主表面に形成されるアルミニ
ウム電極と、 (b) 該アルミニウム電極に対応する一部を切い
欠いて形成される保護膜とを設け、 (c) 前記アルミニウム電極に直接フイルムキヤ
リアのリードを接続するようにしたことを特徴と
する半導体素子の電極構造。[Claims for Utility Model Registration] In a semiconductor device connected using a film carrier, (a) an aluminum electrode formed on the main surface of the semiconductor device, and (b) a portion corresponding to the aluminum electrode cut out. (c) a lead of a film carrier is directly connected to the aluminum electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989130600U JPH0369233U (en) | 1989-11-10 | 1989-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989130600U JPH0369233U (en) | 1989-11-10 | 1989-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0369233U true JPH0369233U (en) | 1991-07-09 |
Family
ID=31678166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989130600U Pending JPH0369233U (en) | 1989-11-10 | 1989-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0369233U (en) |
-
1989
- 1989-11-10 JP JP1989130600U patent/JPH0369233U/ja active Pending