JPS63170944U - - Google Patents

Info

Publication number
JPS63170944U
JPS63170944U JP1987062445U JP6244587U JPS63170944U JP S63170944 U JPS63170944 U JP S63170944U JP 1987062445 U JP1987062445 U JP 1987062445U JP 6244587 U JP6244587 U JP 6244587U JP S63170944 U JPS63170944 U JP S63170944U
Authority
JP
Japan
Prior art keywords
main surface
layer made
electrode
semiconductor device
disposing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987062445U
Other languages
Japanese (ja)
Other versions
JPH0528765Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987062445U priority Critical patent/JPH0528765Y2/ja
Publication of JPS63170944U publication Critical patent/JPS63170944U/ja
Application granted granted Critical
Publication of JPH0528765Y2 publication Critical patent/JPH0528765Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による半導体装置の電極の一実
施例の構成図、第２図は従来の半導体装置の電極
の構成図である。 １……Ｓｉ、２……ＳｉＯ２、３……Ａ、８
……Ａｕ、９……Ｃｕ。 FIG. 1 is a block diagram of an embodiment of an electrode of a semiconductor device according to the present invention, and FIG. 2 is a block diagram of an electrode of a conventional semiconductor device. 1...Si, 2 ...SiO2, 3...A, 8
...Au, 9...Cu.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 主表面上にＡｕ線を接合してなる半導体装置の
電極において、Ａからなる層の上にＣｕからな
る層を配置して主表面を形成してなることを特徴
とする半導体装置の電極。 1. An electrode for a semiconductor device comprising an Au wire bonded to a main surface thereof, wherein the main surface is formed by disposing a layer made of Cu on a layer made of A.
JP1987062445U 1987-04-24 1987-04-24 Expired - Lifetime JPH0528765Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987062445U JPH0528765Y2 (en) 1987-04-24 1987-04-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987062445U JPH0528765Y2 (en) 1987-04-24 1987-04-24

Publications (2)

Publication Number Publication Date
JPS63170944U true JPS63170944U (en) 1988-11-07
JPH0528765Y2 JPH0528765Y2 (en) 1993-07-23

Family

ID=30896733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987062445U Expired - Lifetime JPH0528765Y2 (en) 1987-04-24 1987-04-24

Country Status (1)

Country Link
JP (1) JPH0528765Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPP398798A0 (en) 1998-06-09 1998-07-02 Silverbrook Research Pty Ltd Image creation method and apparatus (ij43)

Also Published As

Publication number Publication date
JPH0528765Y2 (en) 1993-07-23

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