JPH0229526U - - Google Patents
Info
- Publication number
- JPH0229526U JPH0229526U JP10851888U JP10851888U JPH0229526U JP H0229526 U JPH0229526 U JP H0229526U JP 10851888 U JP10851888 U JP 10851888U JP 10851888 U JP10851888 U JP 10851888U JP H0229526 U JPH0229526 U JP H0229526U
- Authority
- JP
- Japan
- Prior art keywords
- bonding jig
- bonding
- island
- semiconductor chip
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
Description
第１図ａ，ｂは本考案の一実施例を説明するた
めのボンデイング治具の平面図及びＡ―Ａ′線断
面図、第２図ａ，ｂは従来のボンデイング治具を
示す平面図及びＢ―Ｂ′線断面図である。
１…ヒータブロツク、２…気体吹出孔、３…ア
イランド、４…半導体チツプ、５…リード、６…
ボンデイング線、７…不活性ガス。
Figures 1a and b are a plan view and a sectional view taken along the line A-A' of a bonding jig for explaining an embodiment of the present invention, and Figures 2a and b are a plan view and a cross-sectional view showing a conventional bonding jig. It is a sectional view taken along the line B-B'. DESCRIPTION OF SYMBOLS 1...Heater block, 2...Gas blow-off hole, 3...Island, 4...Semiconductor chip, 5...Lead, 6...
Bonding wire, 7...Inert gas.
Claims (1)
レームを載せて加熱し前記リードフレームのリー
ドと前記半導体チツプの電極との間をワイヤボン
デイングするためのボンデイング用治具において
、前記ボンデイング治具が前記アイランドと前記
リードとの間に設けた気体吹出孔を有することを
特徴とするボンデイング用治具。 In a bonding jig for wire bonding between the leads of the lead frame and the electrodes of the semiconductor chip by placing a lead frame on which a semiconductor chip is mounted on an island and heating it, the bonding jig connects the island and the leads. A bonding jig characterized by having a gas blowing hole provided between the bonding jig and the bonding jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10851888U JPH0229526U (en) | 1988-08-17 | 1988-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10851888U JPH0229526U (en) | 1988-08-17 | 1988-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229526U true JPH0229526U (en) | 1990-02-26 |
Family
ID=31343929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10851888U Pending JPH0229526U (en) | 1988-08-17 | 1988-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229526U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569135A (en) * | 2012-02-07 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | Heating block for wire bonding |
-
1988
- 1988-08-17 JP JP10851888U patent/JPH0229526U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569135A (en) * | 2012-02-07 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | Heating block for wire bonding |