JPS61142447U - - Google Patents
Info
- Publication number
- JPS61142447U JPS61142447U JP2594085U JP2594085U JPS61142447U JP S61142447 U JPS61142447 U JP S61142447U JP 2594085 U JP2594085 U JP 2594085U JP 2594085 U JP2594085 U JP 2594085U JP S61142447 U JPS61142447 U JP S61142447U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- semiconductor integrated
- support portion
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 3
Landscapes
- Die Bonding (AREA)
Description
第１図ａ，ｂは本考案の半導体集積回路装置の
一実施例を示すモールドＩＣの断面図、第２図ａ
，ｂは従来のモールドＩＣの一例を示す断面図で
ある。
１，１１……ダイパツド、２，１２……ダイパ
ツド吊りピン、３，１３……折れ曲がり箇所、４
，１４……ダイパツド最縁端部、５……ヒーター
ブロツク、６……治具、７……半導体素子（ダイ
）、８……隙間、９……ダイクラツク。
FIGS. 1a and 1b are cross-sectional views of a molded IC showing an embodiment of the semiconductor integrated circuit device of the present invention, and FIG.
, b are cross-sectional views showing an example of a conventional molded IC. 1, 11... Die pad, 2, 12... Die pad hanging pin, 3, 13... Bent part, 4
, 14... Edge end of die pad, 5... Heater block, 6... Jig, 7... Semiconductor element (die), 8... Gap, 9... Die crack.
Claims (1)
導体素子を接合載置するための台部が該台部の支
持部から下方に折れ曲がつているリードフレーム
において、前記支持部の折れ曲がり箇所が前記台
部の最縁端部より内側にあることを特徴とする半
導体集積回路装置。 In a lead frame in which a pedestal portion for bonding and mounting a semiconductor element of a molded resin-sealed semiconductor integrated circuit device is bent downward from a support portion of the pedestal portion, the bent portion of the support portion is bent downward from the support portion of the pedestal portion. A semiconductor integrated circuit device characterized in that the semiconductor integrated circuit device is located inside the outermost edge of the portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2594085U JPS61142447U (en) | 1985-02-25 | 1985-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2594085U JPS61142447U (en) | 1985-02-25 | 1985-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61142447U true JPS61142447U (en) | 1986-09-03 |
Family
ID=30521481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2594085U Pending JPS61142447U (en) | 1985-02-25 | 1985-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61142447U (en) |
-
1985
- 1985-02-25 JP JP2594085U patent/JPS61142447U/ja active Pending
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