JPH0350346U - - Google Patents
Info
- Publication number
- JPH0350346U JPH0350346U JP11064389U JP11064389U JPH0350346U JP H0350346 U JPH0350346 U JP H0350346U JP 11064389 U JP11064389 U JP 11064389U JP 11064389 U JP11064389 U JP 11064389U JP H0350346 U JPH0350346 U JP H0350346U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- external terminal
- conductor
- circuit package
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000615 nonconductor Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂはこの考案の一実施例による集積
回路パツケージを示す斜視図及びＣ部拡大図、第
２図ａ，ｂはこの考案の他の実施例の集積回路パ
ツケージを示す斜視図及びＤ部拡大図、第３図ａ
，ｂは従来の集積回路パツケージを示す斜視図及
びＥ部拡大図である。
図中、１……パツケージ本体、３……外部端子
、３ａ……導体部、３ｂ……導体非着部、５……
バンプを示す。なお、図中同一符号は同一又は相
当部分を示す。
1A and 1B are a perspective view and an enlarged view of part C of an integrated circuit package according to one embodiment of this invention, and FIGS. 2A and 2B are perspective views and an enlarged view of an integrated circuit package according to another embodiment of this invention. Enlarged view of part D, Figure 3a
, b are a perspective view and an enlarged view of part E showing a conventional integrated circuit package. In the figure, 1...Package body, 3...External terminal, 3a...Conductor part, 3b...Conductor non-attaching part, 5...
Showing bumps. Note that the same reference numerals in the figures indicate the same or equivalent parts.
補正 平２．１１．６
図面の簡単な説明を次のように補正する。
明細書中、第６頁第４〜５行の「３ａ……導体
部」を「３ａ……導体非着部」に補正する。
明細書中、第６頁第５行の「３ｂ……導体非着
部」を「３ｂ……導体部」に補正する。Amendment 2.11.6 The brief description of the drawing is amended as follows. In the specification, "3a . . . conductor portion" on page 6, lines 4 and 5 is corrected to "3a . . . conductor non-attached portion." In the specification, "3b . . . conductor non-attached portion" on page 6, line 5 is corrected to "3b . . . conductor portion."
Claims (1)
積回路から信号を取出すための外部端子とを備え
た集積回路パツケージにおいて、上記外部端子の
基板接合面とは反対側に、半田等の接続導体が付
着しにくく、かつ耐熱性を有する導体非着部を設
けたことを特徴とする集積回路パツケージ。 In an integrated circuit package that includes a package body containing an integrated circuit and an external terminal for extracting signals from this integrated circuit, a connecting conductor such as solder is attached to the side of the external terminal opposite to the board bonding surface. An integrated circuit package characterized by being provided with a non-conductor part that is difficult to adhere to and has heat resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11064389U JPH0350346U (en) | 1989-09-20 | 1989-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11064389U JPH0350346U (en) | 1989-09-20 | 1989-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350346U true JPH0350346U (en) | 1991-05-16 |
Family
ID=31659168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11064389U Pending JPH0350346U (en) | 1989-09-20 | 1989-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350346U (en) |
-
1989
- 1989-09-20 JP JP11064389U patent/JPH0350346U/ja active Pending