JPH0349675B2 - - Google Patents
Info
- Publication number
- JPH0349675B2 JPH0349675B2 JP13980484A JP13980484A JPH0349675B2 JP H0349675 B2 JPH0349675 B2 JP H0349675B2 JP 13980484 A JP13980484 A JP 13980484A JP 13980484 A JP13980484 A JP 13980484A JP H0349675 B2 JPH0349675 B2 JP H0349675B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- palladium
- melting point
- weight
- wax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550°C
- B23K35/322—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550°C a Pt-group metal as principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13980484A JPS6120696A (ja) | 1984-07-06 | 1984-07-06 | パラジウムろう |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13980484A JPS6120696A (ja) | 1984-07-06 | 1984-07-06 | パラジウムろう |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6120696A JPS6120696A (ja) | 1986-01-29 |
| JPH0349675B2 true JPH0349675B2 (mo) | 1991-07-30 |
Family
ID=15253819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13980484A Granted JPS6120696A (ja) | 1984-07-06 | 1984-07-06 | パラジウムろう |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6120696A (mo) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103240540B (zh) * | 2013-05-22 | 2015-08-19 | 哈尔滨工业大学 | 一种用于SiO2陶瓷及SiO2陶瓷基复合材料连接的钎料及其制备方法 |
-
1984
- 1984-07-06 JP JP13980484A patent/JPS6120696A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6120696A (ja) | 1986-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6613123B2 (en) | Variable melting point solders and brazes | |
| JP3357184B2 (ja) | 低融点の硬ロウ | |
| JP2019527145A (ja) | SnBiSb系低温鉛フリーはんだ | |
| JPH0970687A (ja) | 無鉛はんだ合金 | |
| US4135656A (en) | Nickel base brazing alloy | |
| MXPA04005835A (es) | Soldadura blanda sin plomo. | |
| EP0103805B1 (en) | Homogeneous low melting point copper based alloys | |
| JPH10193169A (ja) | 無鉛はんだ合金 | |
| JP3081230B2 (ja) | ろう付け充填金属として使用される銅合金 | |
| JP3386009B2 (ja) | はんだ合金 | |
| JP2001287082A (ja) | はんだ合金 | |
| JP3205466B2 (ja) | Sn基低融点ろう材 | |
| JPS6247935B2 (mo) | ||
| Beáta et al. | Development of SnAgCu solders with Bi and In additions and microstructural characterization of joint interface | |
| JPH046476B2 (mo) | ||
| CN112935618A (zh) | 一种用于纯钛、钛合金钎焊的Zr-Ti-Ni-Nb-Hf钎料及使用方法 | |
| JPH0349675B2 (mo) | ||
| JP3057662B2 (ja) | ロウ材料 | |
| JPH0445277B2 (mo) | ||
| JP3210766B2 (ja) | Sn基低融点ろう材 | |
| US4522331A (en) | Method of brazing with low melting point copper-tin foils | |
| JPH0349676B2 (mo) | ||
| JPS62263895A (ja) | ろう材 | |
| CN111151864A (zh) | 连接钨基粉末合金与低膨胀高温合金的焊接材料和工艺 | |
| KR100320545B1 (ko) | Sn계저융점땜납재 |