JPH0348658B2 - - Google Patents

Info

Publication number
JPH0348658B2
JPH0348658B2 JP58203474A JP20347483A JPH0348658B2 JP H0348658 B2 JPH0348658 B2 JP H0348658B2 JP 58203474 A JP58203474 A JP 58203474A JP 20347483 A JP20347483 A JP 20347483A JP H0348658 B2 JPH0348658 B2 JP H0348658B2
Authority
JP
Japan
Prior art keywords
type
silicon substrate
silicon
semiconductor device
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58203474A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6094737A (ja
Inventor
Yoshimitsu Tanaka
Toshiro Abe
Shigeaki Tomonari
Shuichiro Yamaguchi
Kyoshi Hosoya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP58203474A priority Critical patent/JPS6094737A/ja
Publication of JPS6094737A publication Critical patent/JPS6094737A/ja
Publication of JPH0348658B2 publication Critical patent/JPH0348658B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/191—Preparing SOI wafers using full isolation by porous oxide silicon [FIPOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers

Landscapes

  • Element Separation (AREA)
  • Formation Of Insulating Films (AREA)
JP58203474A 1983-10-28 1983-10-28 半導体装置の製法 Granted JPS6094737A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58203474A JPS6094737A (ja) 1983-10-28 1983-10-28 半導体装置の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58203474A JPS6094737A (ja) 1983-10-28 1983-10-28 半導体装置の製法

Publications (2)

Publication Number Publication Date
JPS6094737A JPS6094737A (ja) 1985-05-27
JPH0348658B2 true JPH0348658B2 (2) 1991-07-25

Family

ID=16474736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58203474A Granted JPS6094737A (ja) 1983-10-28 1983-10-28 半導体装置の製法

Country Status (1)

Country Link
JP (1) JPS6094737A (2)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3413090B2 (ja) 1997-12-26 2003-06-03 キヤノン株式会社 陽極化成装置及び陽極化成処理方法
JP2000277478A (ja) 1999-03-25 2000-10-06 Canon Inc 陽極化成装置、陽極化成システム、基板の処理装置及び処理方法、並びに基板の製造方法
US6410436B2 (en) 1999-03-26 2002-06-25 Canon Kabushiki Kaisha Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate
JP3677199B2 (ja) 2000-07-31 2005-07-27 和泉電気株式会社 押しボタンスイッチ及びこれを備えた教示ペンダント
CN106460223B (zh) * 2014-06-27 2018-09-28 株式会社村田制作所 电镀装置

Also Published As

Publication number Publication date
JPS6094737A (ja) 1985-05-27

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