JPH0346994B2 - - Google Patents
Info
- Publication number
- JPH0346994B2 JPH0346994B2 JP17927585A JP17927585A JPH0346994B2 JP H0346994 B2 JPH0346994 B2 JP H0346994B2 JP 17927585 A JP17927585 A JP 17927585A JP 17927585 A JP17927585 A JP 17927585A JP H0346994 B2 JPH0346994 B2 JP H0346994B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- reflow
- chip
- lead
- reflow bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17927585A JPS6240794A (ja) | 1985-08-16 | 1985-08-16 | リフロ−ボンデイングチツプによる部品検知方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17927585A JPS6240794A (ja) | 1985-08-16 | 1985-08-16 | リフロ−ボンデイングチツプによる部品検知方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6240794A JPS6240794A (ja) | 1987-02-21 |
| JPH0346994B2 true JPH0346994B2 (de) | 1991-07-17 |
Family
ID=16062991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17927585A Granted JPS6240794A (ja) | 1985-08-16 | 1985-08-16 | リフロ−ボンデイングチツプによる部品検知方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240794A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62165996A (ja) * | 1986-01-17 | 1987-07-22 | 富士通株式会社 | リフローボンディング装置 |
-
1985
- 1985-08-16 JP JP17927585A patent/JPS6240794A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6240794A (ja) | 1987-02-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |