JPH0346261B2 - - Google Patents

Info

Publication number
JPH0346261B2
JPH0346261B2 JP61027234A JP2723486A JPH0346261B2 JP H0346261 B2 JPH0346261 B2 JP H0346261B2 JP 61027234 A JP61027234 A JP 61027234A JP 2723486 A JP2723486 A JP 2723486A JP H0346261 B2 JPH0346261 B2 JP H0346261B2
Authority
JP
Japan
Prior art keywords
wafer
rotary table
lower rotary
semiconductor wafer
positioning device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61027234A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62188656A (ja
Inventor
Akira Kawaguchi
Shigeru Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP61027234A priority Critical patent/JPS62188656A/ja
Publication of JPS62188656A publication Critical patent/JPS62188656A/ja
Publication of JPH0346261B2 publication Critical patent/JPH0346261B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP61027234A 1986-02-10 1986-02-10 ウエ−ハの外周研削装置 Granted JPS62188656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61027234A JPS62188656A (ja) 1986-02-10 1986-02-10 ウエ−ハの外周研削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61027234A JPS62188656A (ja) 1986-02-10 1986-02-10 ウエ−ハの外周研削装置

Publications (2)

Publication Number Publication Date
JPS62188656A JPS62188656A (ja) 1987-08-18
JPH0346261B2 true JPH0346261B2 (enrdf_load_html_response) 1991-07-15

Family

ID=12215381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61027234A Granted JPS62188656A (ja) 1986-02-10 1986-02-10 ウエ−ハの外周研削装置

Country Status (1)

Country Link
JP (1) JPS62188656A (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109676463A (zh) * 2018-12-24 2019-04-26 广州市铭芯自动化控制设备有限公司 一种去毛机数控加工装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59183328U (ja) * 1983-05-17 1984-12-06 不二越機械工業株式会社 研削装置
JPS6059110A (ja) * 1983-09-12 1985-04-05 Kanebo Silk Eregansu Kk 繰糸装置
JPS6085536A (ja) * 1983-10-17 1985-05-15 Hitachi Ltd ウエハ位置決め装置

Also Published As

Publication number Publication date
JPS62188656A (ja) 1987-08-18

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