JPH0345777Y2 - - Google Patents
Info
- Publication number
- JPH0345777Y2 JPH0345777Y2 JP7145086U JP7145086U JPH0345777Y2 JP H0345777 Y2 JPH0345777 Y2 JP H0345777Y2 JP 7145086 U JP7145086 U JP 7145086U JP 7145086 U JP7145086 U JP 7145086U JP H0345777 Y2 JPH0345777 Y2 JP H0345777Y2
- Authority
- JP
- Japan
- Prior art keywords
- casting
- resin
- jig
- led
- casting jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005266 casting Methods 0.000 claims description 18
- 238000010125 resin casting Methods 0.000 claims description 16
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000008188 pellet Substances 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7145086U JPH0345777Y2 (enrdf_load_stackoverflow) | 1986-05-12 | 1986-05-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7145086U JPH0345777Y2 (enrdf_load_stackoverflow) | 1986-05-12 | 1986-05-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62182709U JPS62182709U (enrdf_load_stackoverflow) | 1987-11-19 |
JPH0345777Y2 true JPH0345777Y2 (enrdf_load_stackoverflow) | 1991-09-27 |
Family
ID=30914011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7145086U Expired JPH0345777Y2 (enrdf_load_stackoverflow) | 1986-05-12 | 1986-05-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0345777Y2 (enrdf_load_stackoverflow) |
-
1986
- 1986-05-12 JP JP7145086U patent/JPH0345777Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS62182709U (enrdf_load_stackoverflow) | 1987-11-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4599062A (en) | Encapsulation molding apparatus | |
CA2070283A1 (en) | Cross-lamination injection molding | |
JPH0345777Y2 (enrdf_load_stackoverflow) | ||
JP3411448B2 (ja) | 半導体素子の樹脂封止金型及び半導体装置の製造方法 | |
CN109760268B (zh) | 一种塑胶件的成型方法及塑胶件 | |
CN211194750U (zh) | 一种手机镜头隔圈注塑模具 | |
CN113752466A (zh) | 一种导电滑环中轴的注塑工艺 | |
JPH0726089Y2 (ja) | 多色成形金型 | |
JPS5724542A (en) | Preparation of resin sealed type semiconductor device | |
CN220198381U (zh) | 一种伺服器注塑模具 | |
JPH04329680A (ja) | 発光装置 | |
JP2598161B2 (ja) | 中空型半導体装置の樹脂封止方法 | |
CN217293370U (zh) | 一种基于反半球结构的定模板及注塑机锁模单元 | |
CN215661578U (zh) | 一种热流道模具 | |
JPS6337221Y2 (enrdf_load_stackoverflow) | ||
KR900006090A (ko) | 제품을 캡슐화하는 방법 | |
CN215969846U (zh) | 一种塑料件生产用新型注塑模具 | |
JPS56103483A (en) | Manufacture of semiconductor device for photoelectric conversion | |
JPS6339053Y2 (enrdf_load_stackoverflow) | ||
JPS629515U (enrdf_load_stackoverflow) | ||
JPS62286713A (ja) | プラスチツク用型の形成方法 | |
JPH04137045U (ja) | 半導体素子封入金型 | |
JPH023299B2 (enrdf_load_stackoverflow) | ||
JPS635226Y2 (enrdf_load_stackoverflow) | ||
JP2678672B2 (ja) | 射出成形型の製造方法 |