JPH0345482B2 - - Google Patents

Info

Publication number
JPH0345482B2
JPH0345482B2 JP57235037A JP23503782A JPH0345482B2 JP H0345482 B2 JPH0345482 B2 JP H0345482B2 JP 57235037 A JP57235037 A JP 57235037A JP 23503782 A JP23503782 A JP 23503782A JP H0345482 B2 JPH0345482 B2 JP H0345482B2
Authority
JP
Japan
Prior art keywords
conductive
coated
particles
metal
flakes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57235037A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58161205A (ja
Inventor
Ii Gotsutsu Kenesu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOTSUTAASU IND Inc
Original Assignee
HOTSUTAASU IND Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOTSUTAASU IND Inc filed Critical HOTSUTAASU IND Inc
Publication of JPS58161205A publication Critical patent/JPS58161205A/ja
Publication of JPH0345482B2 publication Critical patent/JPH0345482B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B20/00Use of materials as fillers for mortars, concrete or artificial stone according to more than one of groups C04B14/00 - C04B18/00 and characterised by shape or grain distribution; Treatment of materials according to more than one of the groups C04B14/00 - C04B18/00 specially adapted to enhance their filling properties in mortars, concrete or artificial stone; Expanding or defibrillating materials
    • C04B20/10Coating or impregnating
    • C04B20/1055Coating or impregnating with inorganic materials
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B26/00Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
    • C04B26/02Macromolecular compounds
    • C04B26/04Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B26/06Acrylates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/32Radiation-absorbing paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • C09D7/62Additives non-macromolecular inorganic modified by treatment with other compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/70Additives characterised by shape, e.g. fibres, flakes or microspheres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/02Ingredients treated with inorganic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Thermal Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
JP57235037A 1982-02-08 1982-12-23 導電性要素、流動性導電性組成物および製造法 Granted JPS58161205A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34664882A 1982-02-08 1982-02-08
US346648 1994-11-30

Publications (2)

Publication Number Publication Date
JPS58161205A JPS58161205A (ja) 1983-09-24
JPH0345482B2 true JPH0345482B2 (enExample) 1991-07-11

Family

ID=23360392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57235037A Granted JPS58161205A (ja) 1982-02-08 1982-12-23 導電性要素、流動性導電性組成物および製造法

Country Status (5)

Country Link
JP (1) JPS58161205A (enExample)
CA (1) CA1254330A (enExample)
DE (1) DE3302552A1 (enExample)
FR (1) FR2521338A1 (enExample)
GB (1) GB2115396B (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974700A (ja) * 1982-10-20 1984-04-27 燐化学工業株式会社 電磁波遮蔽材の製造方法
JPS59152936A (ja) * 1983-02-21 1984-08-31 Kuraray Co Ltd 電磁しやへい性および剛性に優れたハイブリツト系樹脂組成物
JPS59168044A (ja) * 1983-03-14 1984-09-21 Toyobo Co Ltd 導電性熱可塑性樹脂組成物
JPS59223763A (ja) * 1983-05-10 1984-12-15 Mitsubishi Metal Corp 電磁シ−ルド用導電塗料
JPS6050813A (ja) * 1983-08-31 1985-03-20 触媒化成工業株式会社 プラスチック又は塗料配合用透光性導電性粉末素材
JPS6076542A (ja) * 1983-10-03 1985-05-01 Mitsubishi Metal Corp 導電性樹脂
JPS6081260A (ja) * 1983-10-13 1985-05-09 Mitsubishi Metal Corp 導電性塗料の製造法
JPS60124653A (ja) * 1983-12-10 1985-07-03 Victor Co Of Japan Ltd 導電性樹脂組成物
DE3613060A1 (de) * 1986-04-18 1987-10-22 Herberts Gmbh Ueberzugsmittel mit hoher elektrischer leitfaehigkeit und dessen verwendung zur herstellung von ueberzuegen
US4777205A (en) * 1987-07-22 1988-10-11 Wacker Silicones Corporation Electrically conductive compositions
EP0306172A1 (en) * 1987-08-31 1989-03-08 Corning Glass Works Stabilized phyllosilicates and method for their production
JPH01297463A (ja) * 1988-05-25 1989-11-30 Tech Res & Dev Inst Of Japan Def Agency 軍用迷彩装備品
WO1997013545A1 (en) * 1995-10-10 1997-04-17 Iris Materials B.V. I.O. Material with radiation-shielding properties
DE60029253T2 (de) * 1999-12-20 2007-06-28 New Venture Holdings, L.L.C., Sterling Heigths Methode zum lackieren von smc-teilen
JP2001192499A (ja) * 2000-01-14 2001-07-17 Otsuka Chem Co Ltd 導電性樹脂組成物
US6851869B2 (en) * 2000-08-04 2005-02-08 Cool Options, Inc. Highly thermally conductive electronic connector
EP1327666A4 (en) * 2000-09-13 2005-01-12 Kaneka Corp POLYIMIDE RESIN COMPOSITION, POLYIMIDE PRODUCT FORMED IN FILM, AND INTERMEDIATE TRANSFER STRIP COMPRISING THE SAME
JP2004189938A (ja) * 2002-12-12 2004-07-08 Nippon Sheet Glass Co Ltd 導電性樹脂成形部品
CH697165A5 (de) * 2003-10-27 2008-05-30 Grieder Lab Metalle enthaltender Zusatzstoff für organisch gebundene Baustoffe.
EP2009067B1 (en) * 2006-04-07 2012-01-25 Nippon Sheet Glass Company, Limited Photoluminescent pigment, method for production of the pigment, and cosmetic, coating, ink or resin composition comprising the pigment
GB0801686D0 (en) 2008-01-31 2008-03-05 Qinetiq Ltd Paint composition
WO2010000096A1 (en) * 2008-07-03 2010-01-07 National Starch And Chemical Investment Holding Coporation Silver coated flaky material filled conductive curable composition and the application in die attach
JP5330396B2 (ja) * 2008-09-08 2013-10-30 新日鉄住金化学株式会社 高熱伝導性ポリイミドフィルム、高熱伝導性金属張積層体及びその製造方法
JP5925556B2 (ja) * 2012-03-29 2016-05-25 Dowaエレクトロニクス株式会社 銀被覆フレーク状硝子粉およびその製造方法
DE102014203740A1 (de) 2014-02-28 2015-09-03 Siemens Aktiengesellschaft Glimmschutzsystem, insbesondere Außenglimmschutzsystem für eine elektrische Maschine
JP6110464B2 (ja) * 2015-11-20 2017-04-05 Dowaエレクトロニクス株式会社 銀被覆フレーク状硝子粉およびその製造方法
CN112646438A (zh) * 2020-12-16 2021-04-13 彭龙水 一种负离子抗菌涂料及其制备方法
CN114656724B (zh) * 2022-03-30 2023-09-26 金发科技股份有限公司 一种导电母粒、电磁屏蔽增强聚酰胺组合物及其应用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH542909A (de) * 1970-12-24 1973-10-15 Micafil Ag Elektrisch leitender Füllstoff
US4419279A (en) * 1980-09-15 1983-12-06 Potters Industries, Inc. Conductive paste, electroconductive body and fabrication of same
CA1218839A (en) * 1982-10-28 1987-03-10 Tokuzo Kanbe Shielding material of electromagnetic waves

Also Published As

Publication number Publication date
DE3302552A1 (de) 1983-08-18
JPS58161205A (ja) 1983-09-24
FR2521338A1 (fr) 1983-08-12
GB2115396B (en) 1985-04-03
GB8301248D0 (en) 1983-02-16
CA1254330A (en) 1989-05-16
GB2115396A (en) 1983-09-07

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