GB2115396B - Mica conductive flakes - Google Patents

Mica conductive flakes

Info

Publication number
GB2115396B
GB2115396B GB08301248A GB8301248A GB2115396B GB 2115396 B GB2115396 B GB 2115396B GB 08301248 A GB08301248 A GB 08301248A GB 8301248 A GB8301248 A GB 8301248A GB 2115396 B GB2115396 B GB 2115396B
Authority
GB
United Kingdom
Prior art keywords
conductive flakes
mica
mica conductive
flakes
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08301248A
Other languages
English (en)
Other versions
GB8301248D0 (en
GB2115396A (en
Inventor
Kenneth E Goetz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Potters Industries LLC
Original Assignee
Potters Industries LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Potters Industries LLC filed Critical Potters Industries LLC
Publication of GB8301248D0 publication Critical patent/GB8301248D0/en
Publication of GB2115396A publication Critical patent/GB2115396A/en
Application granted granted Critical
Publication of GB2115396B publication Critical patent/GB2115396B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B20/00—Use of materials as fillers for mortars, concrete or artificial stone according to more than one of groups C04B14/00 - C04B18/00 and characterised by shape or grain distribution; Treatment of materials according to more than one of the groups C04B14/00 - C04B18/00 specially adapted to enhance their filling properties in mortars, concrete or artificial stone; Expanding or defibrillating materials
    • C04B20/10—Coating or impregnating
    • C04B20/1055—Coating or impregnating with inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
    • C04B26/02—Macromolecular compounds
    • C04B26/04—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B26/06—Acrylates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/32—Radiation-absorbing paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Thermal Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
GB08301248A 1982-02-08 1983-01-18 Mica conductive flakes Expired GB2115396B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34664882A 1982-02-08 1982-02-08

Publications (3)

Publication Number Publication Date
GB8301248D0 GB8301248D0 (en) 1983-02-16
GB2115396A GB2115396A (en) 1983-09-07
GB2115396B true GB2115396B (en) 1985-04-03

Family

ID=23360392

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08301248A Expired GB2115396B (en) 1982-02-08 1983-01-18 Mica conductive flakes

Country Status (5)

Country Link
JP (1) JPS58161205A (enExample)
CA (1) CA1254330A (enExample)
DE (1) DE3302552A1 (enExample)
FR (1) FR2521338A1 (enExample)
GB (1) GB2115396B (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974700A (ja) * 1982-10-20 1984-04-27 燐化学工業株式会社 電磁波遮蔽材の製造方法
JPS59152936A (ja) * 1983-02-21 1984-08-31 Kuraray Co Ltd 電磁しやへい性および剛性に優れたハイブリツト系樹脂組成物
JPS59168044A (ja) * 1983-03-14 1984-09-21 Toyobo Co Ltd 導電性熱可塑性樹脂組成物
JPS59223763A (ja) * 1983-05-10 1984-12-15 Mitsubishi Metal Corp 電磁シ−ルド用導電塗料
JPS6050813A (ja) * 1983-08-31 1985-03-20 触媒化成工業株式会社 プラスチック又は塗料配合用透光性導電性粉末素材
JPS6076542A (ja) * 1983-10-03 1985-05-01 Mitsubishi Metal Corp 導電性樹脂
JPS6081260A (ja) * 1983-10-13 1985-05-09 Mitsubishi Metal Corp 導電性塗料の製造法
JPS60124653A (ja) * 1983-12-10 1985-07-03 Victor Co Of Japan Ltd 導電性樹脂組成物
DE3613060A1 (de) * 1986-04-18 1987-10-22 Herberts Gmbh Ueberzugsmittel mit hoher elektrischer leitfaehigkeit und dessen verwendung zur herstellung von ueberzuegen
US4777205A (en) * 1987-07-22 1988-10-11 Wacker Silicones Corporation Electrically conductive compositions
EP0306172A1 (en) * 1987-08-31 1989-03-08 Corning Glass Works Stabilized phyllosilicates and method for their production
JPH01297463A (ja) * 1988-05-25 1989-11-30 Tech Res & Dev Inst Of Japan Def Agency 軍用迷彩装備品
EP0796125A1 (en) * 1995-10-10 1997-09-24 Iris materials B.V. Material with radiation-shielding properties
WO2001045936A1 (en) * 1999-12-20 2001-06-28 Patent Holding Company Method for priming smc parts
JP2001192499A (ja) * 2000-01-14 2001-07-17 Otsuka Chem Co Ltd 導電性樹脂組成物
US6851869B2 (en) * 2000-08-04 2005-02-08 Cool Options, Inc. Highly thermally conductive electronic connector
EP1327666A4 (en) * 2000-09-13 2005-01-12 Kaneka Corp POLYIMIDE RESIN COMPOSITION, POLYIMIDE PRODUCT FORMED IN FILM, AND INTERMEDIATE TRANSFER STRIP COMPRISING THE SAME
JP2004189938A (ja) * 2002-12-12 2004-07-08 Nippon Sheet Glass Co Ltd 導電性樹脂成形部品
CH697165A5 (de) * 2003-10-27 2008-05-30 Grieder Lab Metalle enthaltender Zusatzstoff für organisch gebundene Baustoffe.
WO2007117004A1 (ja) * 2006-04-07 2007-10-18 Nippon Sheet Glass Company, Limited 光輝性顔料およびその製造方法、該光輝性顔料を含む化粧料、塗料、インク、または樹脂組成物
GB0801686D0 (en) 2008-01-31 2008-03-05 Qinetiq Ltd Paint composition
WO2010000096A1 (en) * 2008-07-03 2010-01-07 National Starch And Chemical Investment Holding Coporation Silver coated flaky material filled conductive curable composition and the application in die attach
KR101501957B1 (ko) * 2008-09-08 2015-03-12 신닛테츠 수미킨 가가쿠 가부시키가이샤 고열전도성 폴리이미드 필름, 고열전도성 금속장 적층체 및 그 제조방법
JP5925556B2 (ja) * 2012-03-29 2016-05-25 Ｄｏｗａエレクトロニクス株式会社 銀被覆フレーク状硝子粉およびその製造方法
DE102014203740A1 (de) * 2014-02-28 2015-09-03 Siemens Aktiengesellschaft Glimmschutzsystem, insbesondere Außenglimmschutzsystem für eine elektrische Maschine
JP6110464B2 (ja) * 2015-11-20 2017-04-05 Ｄｏｗａエレクトロニクス株式会社 銀被覆フレーク状硝子粉およびその製造方法
CN112646438A (zh) * 2020-12-16 2021-04-13 彭龙水 一种负离子抗菌涂料及其制备方法
CN114656724B (zh) * 2022-03-30 2023-09-26 金发科技股份有限公司 一种导电母粒、电磁屏蔽增强聚酰胺组合物及其应用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH542909A (de) * 1970-12-24 1973-10-15 Micafil Ag Elektrisch leitender Füllstoff
US4419279A (en) * 1980-09-15 1983-12-06 Potters Industries, Inc. Conductive paste, electroconductive body and fabrication of same
CA1218839A (en) * 1982-10-28 1987-03-10 Tokuzo Kanbe Shielding material of electromagnetic waves

Also Published As

Publication number Publication date
DE3302552A1 (de) 1983-08-18
JPH0345482B2 (enExample) 1991-07-11
CA1254330A (en) 1989-05-16
FR2521338A1 (fr) 1983-08-12
JPS58161205A (ja) 1983-09-24
GB8301248D0 (en) 1983-02-16
GB2115396A (en) 1983-09-07

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee