GB8301248D0 - Electroconductive element - Google Patents
Electroconductive elementInfo
- Publication number
- GB8301248D0 GB8301248D0 GB838301248A GB8301248A GB8301248D0 GB 8301248 D0 GB8301248 D0 GB 8301248D0 GB 838301248 A GB838301248 A GB 838301248A GB 8301248 A GB8301248 A GB 8301248A GB 8301248 D0 GB8301248 D0 GB 8301248D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- electroconductive element
- electroconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B20/00—Use of materials as fillers for mortars, concrete or artificial stone according to more than one of groups C04B14/00 - C04B18/00 and characterised by shape or grain distribution; Treatment of materials according to more than one of the groups C04B14/00 - C04B18/00 specially adapted to enhance their filling properties in mortars, concrete or artificial stone; Expanding or defibrillating materials
- C04B20/10—Coating or impregnating
- C04B20/1055—Coating or impregnating with inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/04—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/06—Acrylates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/32—Radiation-absorbing paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wood Science & Technology (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Structural Engineering (AREA)
- Thermal Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electromagnetism (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34664882A | 1982-02-08 | 1982-02-08 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8301248D0 true GB8301248D0 (en) | 1983-02-16 |
GB2115396A GB2115396A (en) | 1983-09-07 |
GB2115396B GB2115396B (en) | 1985-04-03 |
Family
ID=23360392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08301248A Expired GB2115396B (en) | 1982-02-08 | 1983-01-18 | Mica conductive flakes |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS58161205A (en) |
CA (1) | CA1254330A (en) |
DE (1) | DE3302552A1 (en) |
FR (1) | FR2521338A1 (en) |
GB (1) | GB2115396B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114656724A (en) * | 2022-03-30 | 2022-06-24 | 金发科技股份有限公司 | Conductive master batch, electromagnetic shielding enhanced polyamide composition and application thereof |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5974700A (en) * | 1982-10-20 | 1984-04-27 | 燐化学工業株式会社 | Method of producing electromagnetic wave shielding material |
JPS59152936A (en) * | 1983-02-21 | 1984-08-31 | Kuraray Co Ltd | Hybrid resin composition having excellent electromagnetic shielding property and rigidity |
JPS59168044A (en) * | 1983-03-14 | 1984-09-21 | Toyobo Co Ltd | Electrically conductive thermoplastic resin composition |
JPS59223763A (en) * | 1983-05-10 | 1984-12-15 | Mitsubishi Metal Corp | Electrically conductive paint for electromagnetic wave shielding |
JPS6050813A (en) * | 1983-08-31 | 1985-03-20 | 触媒化成工業株式会社 | Conductive material for transmitting light |
JPS6076542A (en) * | 1983-10-03 | 1985-05-01 | Mitsubishi Metal Corp | Electrically conductive resin |
JPS6081260A (en) * | 1983-10-13 | 1985-05-09 | Mitsubishi Metal Corp | Production of electrically conductive coating material |
JPS60124653A (en) * | 1983-12-10 | 1985-07-03 | Victor Co Of Japan Ltd | Electrically conductive resin composition |
DE3613060A1 (en) * | 1986-04-18 | 1987-10-22 | Herberts Gmbh | COATING AGENTS WITH HIGH ELECTRICAL CONDUCTIVITY AND THE USE THEREOF FOR THE PRODUCTION OF COATING |
US4777205A (en) * | 1987-07-22 | 1988-10-11 | Wacker Silicones Corporation | Electrically conductive compositions |
EP0306172A1 (en) * | 1987-08-31 | 1989-03-08 | Corning Glass Works | Stabilized phyllosilicates and method for their production |
JPH01297463A (en) * | 1988-05-25 | 1989-11-30 | Tech Res & Dev Inst Of Japan Def Agency | Coloring composition for camouflaging and camouflaged colored material |
AU7146896A (en) * | 1995-10-10 | 1997-04-30 | Wilhelmus Hermanus Iding | Material with radiation-shielding properties |
EP1272343B1 (en) * | 1999-12-20 | 2006-07-05 | New Venture Holdings, L.L.C. | Method for priming smc parts |
JP2001192499A (en) * | 2000-01-14 | 2001-07-17 | Otsuka Chem Co Ltd | Electroconductive resin composition |
US6851869B2 (en) * | 2000-08-04 | 2005-02-08 | Cool Options, Inc. | Highly thermally conductive electronic connector |
EP1327666A4 (en) * | 2000-09-13 | 2005-01-12 | Kaneka Corp | Polyimide resin composition and, polyimide product formed into film and intermediate transfer belt comprising the same |
JP2004189938A (en) * | 2002-12-12 | 2004-07-08 | Nippon Sheet Glass Co Ltd | Conductive molded resin part |
CH697165A5 (en) * | 2003-10-27 | 2008-05-30 | Grieder Lab | Metals containing additive for organic based materials. |
KR20090008242A (en) * | 2006-04-07 | 2009-01-21 | 니혼 이타가라스 가부시키가이샤 | Photoluminescent pigment, method for production of the pigment, and cosmetic, coating, ink or resin composition comprising the pigment |
GB0801686D0 (en) * | 2008-01-31 | 2008-03-05 | Qinetiq Ltd | Paint composition |
KR20110025836A (en) * | 2008-07-03 | 2011-03-11 | 헨켈 코포레이션 | Silver coated flaky material filled conductive curable composition and the application in die attach |
WO2010027070A1 (en) * | 2008-09-08 | 2010-03-11 | 新日鐵化学株式会社 | Highly heat conductive polyimide film, highly heat conductive metal-clad laminate and method for producing same |
JP5925556B2 (en) * | 2012-03-29 | 2016-05-25 | Dowaエレクトロニクス株式会社 | Silver-coated flaky glass powder and method for producing the same |
DE102014203740A1 (en) | 2014-02-28 | 2015-09-03 | Siemens Aktiengesellschaft | Corona protection system, in particular external corona protection system for an electrical machine |
JP6110464B2 (en) * | 2015-11-20 | 2017-04-05 | Dowaエレクトロニクス株式会社 | Silver-coated flaky glass powder and method for producing the same |
CN112646438A (en) * | 2020-12-16 | 2021-04-13 | 彭龙水 | Negative ion antibacterial coating and preparation method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH542909A (en) * | 1970-12-24 | 1973-10-15 | Micafil Ag | Electrically conductive filler |
US4419279A (en) * | 1980-09-15 | 1983-12-06 | Potters Industries, Inc. | Conductive paste, electroconductive body and fabrication of same |
CA1218839A (en) * | 1982-10-28 | 1987-03-10 | Tokuzo Kanbe | Shielding material of electromagnetic waves |
-
1982
- 1982-11-12 CA CA000415495A patent/CA1254330A/en not_active Expired
- 1982-12-23 JP JP57235037A patent/JPS58161205A/en active Granted
-
1983
- 1983-01-18 GB GB08301248A patent/GB2115396B/en not_active Expired
- 1983-01-26 DE DE19833302552 patent/DE3302552A1/en not_active Withdrawn
- 1983-02-08 FR FR8302163A patent/FR2521338A1/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114656724A (en) * | 2022-03-30 | 2022-06-24 | 金发科技股份有限公司 | Conductive master batch, electromagnetic shielding enhanced polyamide composition and application thereof |
CN114656724B (en) * | 2022-03-30 | 2023-09-26 | 金发科技股份有限公司 | Conductive master batch, electromagnetic shielding reinforced polyamide composition and application thereof |
Also Published As
Publication number | Publication date |
---|---|
GB2115396B (en) | 1985-04-03 |
FR2521338A1 (en) | 1983-08-12 |
JPS58161205A (en) | 1983-09-24 |
GB2115396A (en) | 1983-09-07 |
DE3302552A1 (en) | 1983-08-18 |
CA1254330A (en) | 1989-05-16 |
JPH0345482B2 (en) | 1991-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |