CN114656724B - Conductive master batch, electromagnetic shielding reinforced polyamide composition and application thereof - Google Patents

Conductive master batch, electromagnetic shielding reinforced polyamide composition and application thereof Download PDF

Info

Publication number
CN114656724B
CN114656724B CN202210325760.4A CN202210325760A CN114656724B CN 114656724 B CN114656724 B CN 114656724B CN 202210325760 A CN202210325760 A CN 202210325760A CN 114656724 B CN114656724 B CN 114656724B
Authority
CN
China
Prior art keywords
parts
conductive
polyamide composition
electromagnetic shielding
master batch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210325760.4A
Other languages
Chinese (zh)
Other versions
CN114656724A (en
Inventor
付大炯
陈平绪
叶南飚
张超
张永
叶士兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kingfa Science and Technology Co Ltd
Original Assignee
Kingfa Science and Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kingfa Science and Technology Co Ltd filed Critical Kingfa Science and Technology Co Ltd
Priority to CN202210325760.4A priority Critical patent/CN114656724B/en
Publication of CN114656724A publication Critical patent/CN114656724A/en
Application granted granted Critical
Publication of CN114656724B publication Critical patent/CN114656724B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/20Compounding polymers with additives, e.g. colouring
    • C08J3/22Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C08J3/226Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06Polyamides derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2423/00Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2423/02Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2423/10Homopolymers or copolymers of propene
    • C08J2423/14Copolymers of propene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/16Solid spheres
    • C08K7/18Solid spheres inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/10Encapsulated ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)

Abstract

The invention discloses a conductive master batch, an electromagnetic shielding reinforced polyamide composition and application thereof, and belongs to the technical field of electromagnetic shielding materials. The conductive master batch comprises the following components in parts by weight: 79-89 parts of PP resin, 30-50 parts of conductive filler and 0-2 parts of auxiliary agent, wherein the conductive filler is solid glass microsphere with silver plating treatment on the surface, the particle diameter D90 of the solid glass microsphere is 20-45 mu m, and the mass content of the silver plating layer is 8-20%. According to the conductive master batch disclosed by the invention, the solid glass microspheres with the surfaces subjected to silver plating treatment are added to serve as conductive fillers, so that a uniform conductive layer is formed on the surfaces of the solid glass microspheres, and the conductive master batch has higher conductivity. The conductive master batch disclosed by the invention is applied to a polyamide composition, so that the conductivity of a polyamide material can be realized, the defect that the polyamide material is easy to warp and deform can be obviously improved, the polyamide composition has the characteristic that the shrinkage rate of the polyamide composition in the flowing direction is close to that of the polyamide composition in the vertical flowing direction, and the problem of warping caused by inconsistent shrinkage rates is further avoided.

Description

Conductive master batch, electromagnetic shielding reinforced polyamide composition and application thereof
Technical Field
The invention relates to the technical field of electromagnetic shielding materials, in particular to a conductive master batch, an electromagnetic shielding reinforced polyamide composition and application thereof.
Background
New energy automobiles are a necessary trend of the 21 st automobile industry development. The new energy automobile, especially the electric automobile, is different from the traditional fuel automobile in that the new energy automobile is added with a large number of electronic components, especially various signal sensors, inductive radars and the like, especially the continuous development and popularization of automatic driving in the future, and various inductive radars are distributed around the new energy automobile body, which also necessarily puts forward higher requirements on the electromagnetic shielding performance of materials. The mutual interference between signals is avoided, and the new energy vehicle, especially the new energy vehicle with the automatic driving function, is the most important requirement and the premise and the guarantee of driving safety. The polymer material with electromagnetic shielding function needs to have conductive function, and the current main realization method comprises adding conductive metal powder or carbon material into the polymer, and coating conductive coating on the surface of the material, but the polymer material has the defects of uneven dispersion, poor conductive effect, easy oxidation, high price and the like.
The prior art discloses an electromagnetic shielding polyamide material which is prepared from the following raw materials in parts by weight: 75-85 parts of polyamide resin; 3-5 parts of PEDOT-g-MAH (polyether-styrene-ethylene-butylene-styrene) conductive powder; 10-15 parts of carbon fiber; 0.5-2 parts of silane coupling agent; 0.1-0.5 part of antioxidant; 2-3 parts of other auxiliary agents, wherein conductive powder and a large amount of carbon fibers are added, so that the dispersion uniformity in the system is poor, the improvement of the conductive effect is affected, and the improvement of the water absorption and the warping performance is not facilitated.
Disclosure of Invention
The invention aims to overcome the defect and the defect that the conductivity of the material is limited due to poor dispersibility of conductive components in the conventional electromagnetic shielding material, and provides a conductive master batch, which is obtained by the cooperation of a specific conductive filler and PP resin.
Another object of the present invention is to provide an electromagnetic shielding reinforced polyamide composition, wherein the conductive masterbatch is applied to the polyamide composition, so as to further improve the conductive performance of the polyamide composition, reduce the water absorption of the polyamide composition, and solve the problem of warp deformation of the polyamide composition.
It is still another object of the present invention to provide an electromagnetic shielding reinforced polyamide composition for use in the manufacture of new energy automobile electronic devices.
It is still another object of the present invention to provide a new energy automobile electronic device.
The above object of the present invention is achieved by the following technical scheme:
the conductive master batch comprises the following components in parts by weight:
79-89 parts of PP resin, 30-50 parts of conductive filler and 0-2 parts of auxiliary agent,
wherein the conductive filler is solid glass microsphere with silver plating treatment on the surface, the particle diameter D90 of the solid glass microsphere is 20-45 mu m, and the mass content of the plating silver relative to the solid glass microsphere is 8-20%.
In particular embodiments, the adjuvants of the present invention may be antioxidants and lubricants.
The following description is needed:
the conductive material is solid glass microsphere with silver plated surface, and has high conductivity.
The conductive material is obtained by silver plating treatment of solid glass microspheres, the hollow glass microspheres can be sheared by a screw rod in the production process and cannot be processed, and the solid glass microspheres are more beneficial to maintaining the processability and mechanical properties. The conductive performance of the solid glass microspheres is obviously improved by the silver plating of the conductive filler, the silver plating content is affected by the particle size of the microspheres, and the conductivity is improved by the lower upper limit of the maximum silver plating content as the particle size is larger.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method can be referred as follows:
according to the weight portions, PP resin, conductive filler and compatilizer are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
In order to better improve the conductivity and application properties of the conductive master batch, in a specific embodiment, the solid glass microspheres preferably have a particle size D90 of 25 to 30 μm.
In order to better improve the conductivity and application performance of the conductive master batch, in a specific embodiment, preferably, the silver plating mass content of the solid glass microsphere is 10-12%.
In a specific embodiment, in order to better ensure the dispersibility of the conductive filler in the master batch, so that the compatibility of the conductive filler and the PP resin is better, preferably, the PP is copolymerized PP, the melt index is 10-30 g/10min, and the detection conditions are as follows: 230 ℃,2.16kg, test standard: ISO 1133-2011.
The conductive master batch has good conductive performance, does not have the problem of uneven dispersion, can be widely applied to the improvement of the conductive performance of plastic materials and the enhancement of electromagnetic shielding performance, and also specifically protects the application of the conductive master batch in the preparation of the electromagnetic shielding enhanced polyamide composition.
An electromagnetic shielding reinforced polyamide composition comprises the following components in parts by weight:
28-69 parts of polyamide, 20-50 parts of glass fiber, 10-20 parts of conductive master batch, 5-15 parts of compatilizer and 0-2 parts of processing aid.
In a specific embodiment, the polyamide of the present invention may be a nylon resin, including PA610 and PA612.
In a specific embodiment, the processing aid comprises an antioxidant and a lubricant, wherein the antioxidant can be one or more of phosphite antioxidants and hindered phenol antioxidants; the lubricant can be one or more of amides, esters or polyethylene waxes.
The preparation method of the electromagnetic shielding reinforced polyamide composition can adopt conventional melt blending granulation, and the specific preparation method can be referred as follows:
the conductive master batch, the glass fiber, the compatilizer and the processing aid are added into the polyamide resin according to the weight parts, and the reinforced polyamide material with good conductive performance and capable of being used for electromagnetic shielding is prepared through double-screw extrusion-level melt blending.
The polyamide is nylon resin, the water absorption of the nylon is higher, and the existing glass fiber reinforced nylon has the problem of warping due to glass fiber orientation.
The addition of the conductive master batch in the electromagnetic shielding reinforced polyamide composition not only can realize the conductivity of the polyamide material, but also can obviously improve the defect that the polyamide material is easy to warp and deform, and the polyamide composition has the characteristic that the shrinkage rate in the flowing direction is close to that in the vertical flowing direction, so that the problem of warping caused by inconsistent shrinkage rates is further avoided.
For common glass fiber reinforced nylon, the introduction of PP can further reduce the water absorption of the composition.
In particular embodiments, to further enhance the compatibility between nylon and PP and microbeads, preferably, the compatibilizer is an ethylene vinyl alcohol copolymer.
The invention also specifically protects application of the electromagnetic shielding reinforced polyamide composition in preparation of electronic devices of new energy automobiles, and the electromagnetic shielding reinforced polyamide composition can be a radar bracket, a signal sensor, a radar wave cover cap and the like.
The invention also provides a new energy automobile electronic device, which is prepared from the raw materials of the electromagnetic shielding reinforced polyamide composition.
Compared with the prior art, the invention has the beneficial effects that:
according to the conductive master batch disclosed by the invention, the solid glass microspheres with the surfaces subjected to silver plating treatment are added to serve as conductive fillers, so that a uniform conductive layer is formed on the surfaces of the solid glass microspheres, and the conductive master batch has higher conductivity.
The conductive master batch disclosed by the invention is applied to the polyamide composition, so that the conductivity of the polyamide material can be realized, the defect that the polyamide material is easy to warp and deform can be obviously improved, the polyamide composition has the characteristic that the shrinkage rate in the flowing direction is close to that in the vertical flowing direction, the problem of warp caused by inconsistent shrinkage rates is further avoided, the PP in the conductive master batch does not absorb water, and the water absorption rate of the electromagnetic shielding reinforced polyamide composition can be further reduced.
Detailed Description
The invention will be further described with reference to the following specific embodiments, but the examples are not intended to limit the invention in any way. Raw materials reagents used in the examples of the present invention are conventionally purchased raw materials reagents unless otherwise specified.
Among them, the raw materials of the examples and comparative examples of the present invention are described below:
the PP resin-1 is copolymerized PP, the melt index is 10g/10min, the brand K9010 is petrochemical in China;
PP resin-2 is copolymerized PP, the melt index is 30g/10min, the brand BH3800, and the manufacturer, korea SK;
PP resin-3 is copolymerized PP, the melt index is 8g/10min, the brand 7033N, and the manufacturer EkkenMobil;
PP resin-4 is copolymerized PP, the melt index is 60g/10min, the brand BX3900, and the manufacturer is petrochemical in Korea;
conductive filler-1: solid glass microspheres with silver plating on the surfaces, wherein the particle diameter D90 of the solid glass microspheres is 20 mu m, the mass content of the silver plating is 20%, and the manufacturer: beijing special security antistatic equipment factory;
conductive filler-2: solid glass microspheres with silver plating on the surfaces, wherein the particle diameter D90 of the solid glass microspheres is 45 mu m, the mass content of the plating silver is 8%, and the brand is: SG-230P16, manufacturer: beijing special security antistatic equipment factory;
conductive filler-3: solid glass microspheres with silver plating on the surfaces, wherein the particle diameter D90 of the solid glass microspheres is 25 mu m, the mass content of silver plating is 12%, and the mark is: SG-300P12, manufacturer: beijing special security antistatic equipment factory;
conductive filler-4: solid glass microspheres with silver plating on the surfaces, wherein the particle diameter D90 of the solid glass microspheres is 60 mu m, the mass content of silver plating is 4%, and the manufacturer: the preparation method of the Beijing special security antistatic equipment factory is as follows:
silver plating glass microspheres are prepared by adopting a chemical plating technology, forming silver plating layers with different thicknesses on the surfaces of hollow glass microspheres through a forming and surface treatment process, and adjusting the mass fraction of silver of the plating layers by controlling the thickness of the plating layers;
the conductive filler-5 is solid glass microsphere with silver plating on the surface, the particle diameter D90 of the solid glass microsphere is 10 mu m, the mass content of the plating silver is 20%, and the manufacturer: the Beijing special security antistatic equipment factory,
wherein, the brand SG-300P20 product provided by the Beijing special protection antistatic equipment factory contains different conductive fillers with the particle diameters of the solid glass microspheres of 20 mu m and 10 mu m, and the conductive fillers-1 and the conductive fillers-5 are obtained by screening the brand SG-300P20 product provided by the Beijing special protection antistatic equipment factory through screens with different meshes;
conventional conductive master batch, trade mark 6900, manufacturer: uranium on Dongguan;
glass fiber: ECS13-03-510, china's megaphone;
polyamide: PA612, brand: a150, shandong Guangdong boundary;
and (3) a compatilizer: ethylene-vinyl alcohol copolymer, trade name E105B, manufacturer: japanese colali;
an antioxidant: hindered phenolic antioxidants, commercially available, and other parallel examples and comparative examples of the present invention are the same commercially available products;
and (3) a lubricant: amide lubricants, commercially available, and other parallel examples and comparative examples of the present invention are the same commercially available products.
Example 1
The conductive master batch comprises the following components in parts by weight: 79 parts of PP resin, 50 parts of conductive filler, 0.5 part of antioxidant and 0.5 part of lubricant.
Wherein the PP resin is PP resin-1, and the conductive filler is conductive filler-1.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method is as follows:
according to the parts by weight, the components are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
Example 2
The conductive master batch comprises the following components in parts by weight: 89 parts of PP resin, 30 parts of conductive filler, 0.5 part of antioxidant and 0.5 part of lubricant as auxiliary agents.
Wherein the PP resin is PP resin-1, and the conductive filler is conductive filler-1.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method is as follows:
according to the parts by weight, the components are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
Example 3
The conductive master batch comprises the following components in parts by weight: 85 parts of PP resin, 40 parts of conductive filler, 0.5 part of antioxidant and 0.5 part of lubricant.
Wherein the PP resin is PP resin-1, and the conductive filler is conductive filler-1.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method is as follows:
according to the parts by weight, the components are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
Example 4
The conductive master batch comprises the following components in parts by weight: 85 parts of PP resin and 40 parts of conductive filler.
Wherein the PP resin is PP resin-1, and the conductive filler is conductive filler-1.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method is as follows:
according to the parts by weight, the components are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
Example 5
The conductive master batch comprises the following components in parts by weight: 85 parts of PP resin, 40 parts of conductive filler and 1 part of auxiliary agent.
Wherein the PP resin is PP resin-2, the conductive filler is conductive filler-1, and the auxiliary agent is 0.5 part of antioxidant and 0.5 part of lubricant.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method is as follows:
according to the parts by weight, the components are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
Example 6
The conductive master batch comprises the following components in parts by weight: 85 parts of PP resin, 40 parts of conductive filler and 1 part of auxiliary agent.
Wherein the PP resin is PP resin-3, the conductive filler is conductive filler-1, and the auxiliary agent is 0.5 part of antioxidant and 0.5 part of lubricant.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method is as follows:
according to the parts by weight, the components are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
Example 7
The conductive master batch comprises the following components in parts by weight: 85 parts of PP resin, 40 parts of conductive filler and 1 part of auxiliary agent.
Wherein the PP resin is PP resin-4, the conductive filler is conductive filler-1, and the auxiliary agent is 0.5 part of antioxidant and 0.5 part of lubricant.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method is as follows:
according to the parts by weight, the components are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
Example 8
The conductive master batch comprises the following components in parts by weight: 85 parts of PP resin, 40 parts of conductive filler and 1 part of auxiliary agent.
Wherein the PP resin is PP resin-1, the conductive filler is conductive filler-2, and the auxiliary agent is 0.5 part of antioxidant and 0.5 part of lubricant.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method is as follows:
according to the parts by weight, the components are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
Example 9
The conductive master batch comprises the following components in parts by weight: 85 parts of PP resin, 40 parts of conductive filler and 1 part of auxiliary agent.
Wherein the PP resin is PP resin-1, the conductive filler is conductive filler-3, and the auxiliary agent is 0.5 part of antioxidant and 0.5 part of lubricant.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method is as follows:
according to the parts by weight, the components are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
Examples 10 to 12
An electromagnetic shielding reinforced polyamide composition comprises the components shown in the following table 1 in parts by weight.
TABLE 1
Wherein the conductive masterbatch is the conductive masterbatch of example 4.
The electromagnetic shielding reinforced polyamide compositions of examples 10 to 12 were prepared by melt blending granulation, and the specific preparation method is as follows:
the conductive master batch, the glass fiber, the compatilizer and the processing aid are added into the polyamide resin according to the weight parts, and the reinforced polyamide material with good conductive performance and capable of being used for electromagnetic shielding is prepared through double-screw extrusion-level melt blending.
Example 13
An electromagnetic shielding reinforced polyamide composition comprises the same components and contents as in example 12 in parts by weight, except that the conductive masterbatch is the conductive masterbatch of example 1.
The preparation method of the electromagnetic shielding reinforced polyamide composition is the same as that of example 12.
Example 14
An electromagnetic shielding reinforced polyamide composition comprises the same components and contents as in example 12 in parts by weight, except that the conductive masterbatch is the conductive masterbatch of example 2.
The preparation method of the electromagnetic shielding reinforced polyamide composition is the same as that of example 12.
Example 15
An electromagnetic shielding reinforced polyamide composition comprises the same components and contents as in example 12 in parts by weight, except that the conductive masterbatch is the conductive masterbatch of example 3.
The preparation method of the electromagnetic shielding reinforced polyamide composition is the same as that of example 12.
Example 16
An electromagnetic shielding reinforced polyamide composition comprises the same components and contents as in example 12 in parts by weight, except that the conductive masterbatch is the conductive masterbatch of example 5.
The preparation method of the electromagnetic shielding reinforced polyamide composition is the same as that of example 12.
Example 17
An electromagnetic shielding reinforced polyamide composition comprises the same components and contents as in example 12 in parts by weight, except that the conductive masterbatch is the conductive masterbatch of example 6.
The preparation method of the electromagnetic shielding reinforced polyamide composition is the same as that of example 12.
Example 18
An electromagnetic shielding reinforced polyamide composition comprises the same components and contents as in example 12 in parts by weight, except that the conductive masterbatch is the conductive masterbatch of example 7.
The preparation method of the electromagnetic shielding reinforced polyamide composition is the same as that of example 12.
Example 19
An electromagnetic shielding reinforced polyamide composition comprises the same components and contents as in example 12 in parts by weight, except that the conductive masterbatch is the conductive masterbatch of example 8.
The preparation method of the electromagnetic shielding reinforced polyamide composition is the same as that of example 12.
Example 20
An electromagnetic shielding reinforced polyamide composition comprises the same components and contents as in example 12 in parts by weight, except that the conductive masterbatch is the conductive masterbatch of example 9.
The preparation method of the electromagnetic shielding reinforced polyamide composition is the same as that of example 12.
Comparative example 1
The conductive master batch comprises the following components in parts by weight: 85 parts of PP resin, 40 parts of conductive filler and 1 part of auxiliary agent.
Wherein the PP resin is PP resin-1, the conductive filler is conductive filler-4, and the auxiliary agent is 0.5 part of antioxidant and 0.5 part of lubricant.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method is as follows:
according to the weight portions, PP resin, conductive filler and compatilizer are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
Comparative example 2
The conductive master batch comprises the following components in parts by weight: 85 parts of PP resin, 40 parts of conductive filler and 1 part of auxiliary agent.
Wherein the PP resin is PP resin-1, the conductive filler is conductive filler-5, and the auxiliary agent is 0.5 part of antioxidant and 0.5 part of lubricant.
The preparation method of the conductive master batch can adopt conventional melt blending granulation, and the specific preparation method is as follows:
according to the weight portions, PP resin, conductive filler and compatilizer are mixed, added into a double-screw extruder for melt blending, and the conductive master batch is prepared through shearing and granulating.
Comparative example 3
The conductive master batch comprises the following components in parts by weight: 79 parts of PP resin, 60 parts of conductive filler, 0.5 part of antioxidant and 0.5 part of lubricant.
Wherein the PP resin is PP resin-1, and the conductive filler is conductive filler-1.
Comparative example 4
The conductive master batch comprises the following components in parts by weight: 89 parts of PP resin, 20 parts of conductive filler, 0.5 part of antioxidant and 0.5 part of lubricant.
Wherein the PP resin is PP resin-1, and the conductive filler is conductive filler-1.
Comparative example 5
A polyamide composition comprising the same components and contents as in example 12 in parts by weight, except that the conductive masterbatch was not contained.
Comparative example 6
The polyamide composition comprises the following components in parts by weight:
612 parts of polyamide PA, 20 parts of glass fiber, 8 parts of conductive masterbatch of example 4, 5 parts of compatilizer, 1 part of antioxidant and 1 part of lubricant.
Comparative example 7
The polyamide composition comprises the following components in parts by weight:
28 parts of polyamide PA612, 50 parts of glass fiber, 25 parts of conductive masterbatch of example 4, 15 parts of compatilizer, 0.5 part of antioxidant and 0.5 part of lubricant.
Comparative examples 8 to 11
The polyamide composition comprises the following components in parts by weight:
polyamide PA612 50 parts, glass fiber 30 parts, conductive masterbatch 15 parts, compatilizer 10 parts, antioxidant 0.8 parts, and lubricant 0.8 parts.
Wherein the conductive master batches are the conductive master batches of comparative examples 1 to 4, respectively.
Comparative example 12
The polyamide composition comprises the following components in parts by weight:
polyamide PA612 50 parts, glass fiber 30 parts, conductive masterbatch 15 parts, compatilizer 10 parts, antioxidant 0.8 parts, and lubricant 0.8 parts.
Wherein the conductive master batch is a commercial conductive master batch.
Result detection
The related resistivity tests of the conductive master batches of the embodiment and the comparative example specifically comprise: the specific detection method comprises the following steps of:
volume resistivity: the test was carried out according to IEC 62631-2016,
surface resistivity: the test was performed according to IEC 62631-2016.
The volume resistivity and the surface resistivity can be used for representing the electric conductivity of the polyamide composition, and the smaller the resistivity value is, the better the electric conductivity of the material is.
The electromagnetic shielding reinforced polyamide compositions of the above examples and comparative examples were subjected to the following detection methods for conductivity, shrinkage and water absorption:
shrinkage ratio: the shrinkage board dimensions were tested according to ISO 294-4-2018 for a water absorption of 220 x 50 x 2 mm: ISO 62-2008 and ISO 1110-2019, the water absorption is calculated by testing the weight change before and after water absorption.
Specific test results are shown in tables 2 and 3 below.
TABLE 2
Sequence number Volume resistivity/Ω. cm Surface resistivity/Ω
Example 1 10 5 10 4
Example 2 10 7 10 6
Example 3 10 4 10 3
Example 4 10 4 10 3
Example 5 10 4 10 3
Example 6 10 5 10 5
Example 7 10 6 10 5
Example 8 10 5 10 4
Example 9 10 3 10 3
Comparative example 1 10 9 10 8
Comparative example 2 10 8 10 7
Comparative example 3 10 5 10 4
Comparative example 4 10 11 10 10
Comparative example 5 10 15 10 14
Comparative example 6 10 11 10 10
Comparative example 7 10 7 10 6
TABLE 3 Table 3
As can be seen from the data of tables 2 and 3 above, the electromagnetic shielding reinforced polyamide composition of the present invention has good conductivity, can significantly improve the conductivity of the polyamide composition by the addition of the conductive masterbatch, and also effectively improve the shrinkage of the polyamide composition, the shrinkage (perpendicular flow direction) of the polyamide composition being 0.6 or less, the shrinkage (flow direction) being 0.35 or less, the equilibrium water absorption being 1.30 or less, has good equilibrium water absorption and shrinkage, and avoids the warpage problem caused by inconsistent shrinkage.
The conductive fillers outside the protection range of the present invention are adopted in comparative examples 1 and 2, the conductive properties are obviously unable to achieve the effects of the examples of the present invention, and the shrinkage of the polyamide compositions (comparative examples 8 and 9) used therein is also affected to some extent, which is not able to solve the warpage problem well.
The conductive filler of comparative example 3 was excessively added, and the conductive property was not significantly improved as compared with that of the examples, indicating that the increase in the amount thereof had no improving effect on the improvement of the conductive property. The conductive filler of comparative example 4 was added too little, and the conductive performance was remarkably insufficient to achieve the effects of the examples of the present invention. And the shrinkage of comparative examples 3 and 4 are affected to some extent, and the warpage problem is not solved well.
Comparative example 5 was poor in conductivity without addition of conductive masterbatch, and also poor in balanced water absorption and shrinkage properties, failing to solve the water absorption problem and warpage problem.
The polyamide composition of comparative example 6 has too little conductive masterbatch added and the conductive properties are significantly less than those of the examples of the present invention. The conductive master batch of the polyamide composition of comparative example 7 is excessively added, and the conductive performance of the polyamide composition is not obviously improved relative to that of the embodiment, which indicates that the increase of the use amount of the polyamide composition has no improvement effect on the improvement of the conductive performance.
It is to be understood that the above examples of the present invention are provided by way of illustration only and not by way of limitation of the embodiments of the present invention. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.

Claims (8)

1. An electromagnetic shielding reinforced polyamide composition is characterized by comprising the following components in parts by weight:
28 to 69 parts of polyamide, 20 to 50 parts of glass fiber, 10 to 20 parts of conductive master batch, 5 to 15 parts of compatilizer and 0 to 2 parts of processing aid,
the conductive master batch comprises the following components in parts by weight:
79-89 parts of PP resin, 30-50 parts of conductive filler and 0-2 parts of auxiliary agent,
the conductive filler is solid glass microspheres with surfaces subjected to silver plating treatment, the particle size D90 of the solid glass microspheres is 25-45 mu m, and the mass content of the plating silver relative to the solid glass microspheres is 8-20%.
2. The electromagnetic shielding reinforced polyamide composition of claim 1, wherein the solid glass microspheres have a particle size D90 of 25 to 30 μιη.
3. The electromagnetic shielding reinforced polyamide composition according to claim 1, wherein the silver content of the coating of the solid glass microspheres is 10-12% by mass.
4. The electromagnetic shielding reinforced polyamide composition of claim 1, wherein the PP is copolymerized PP, the melt index is 10-30 g/10min, and the detection conditions are: 230 ℃,2.16kg, test standard: ISO 1133-2011.
5. The electromagnetic shielding reinforced polyamide composition of claim 1, wherein the compatibilizing agent is an ethylene vinyl alcohol copolymer.
6. The electromagnetic shielding enhanced polyamide composition of claim 1 wherein said processing aid comprises at least one of an antioxidant and a lubricant.
7. Use of the electromagnetic shielding reinforced polyamide composition according to claims 1-6 in the preparation of new energy automobile electronic devices.
8. An electronic device for a new energy automobile, which is characterized in that the electronic device is prepared from a raw material comprising the electromagnetic shielding reinforced polyamide composition according to any one of claims 1 to 6.
CN202210325760.4A 2022-03-30 2022-03-30 Conductive master batch, electromagnetic shielding reinforced polyamide composition and application thereof Active CN114656724B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210325760.4A CN114656724B (en) 2022-03-30 2022-03-30 Conductive master batch, electromagnetic shielding reinforced polyamide composition and application thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210325760.4A CN114656724B (en) 2022-03-30 2022-03-30 Conductive master batch, electromagnetic shielding reinforced polyamide composition and application thereof

Publications (2)

Publication Number Publication Date
CN114656724A CN114656724A (en) 2022-06-24
CN114656724B true CN114656724B (en) 2023-09-26

Family

ID=82033558

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210325760.4A Active CN114656724B (en) 2022-03-30 2022-03-30 Conductive master batch, electromagnetic shielding reinforced polyamide composition and application thereof

Country Status (1)

Country Link
CN (1) CN114656724B (en)

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8301248D0 (en) * 1982-02-08 1983-02-16 Potters Industries Inc Electroconductive element
CN101410456A (en) * 2006-04-04 2009-04-15 罗地亚管理公司 Electrically conductive composition based on polyamide matrix
CN102108209A (en) * 2009-12-28 2011-06-29 上海日之升新技术发展有限公司 Warpage-resistant antistatic reinforced nylon 66 composite and preparation method thereof
CN102311233A (en) * 2011-06-02 2012-01-11 中国科学院理化技术研究所 Surface chemical plating treatment process for hollow glass beads, plated metal hollow glass beads and application thereof
CN102585493A (en) * 2010-12-28 2012-07-18 上海杰事杰新材料(集团)股份有限公司 Nano particle/polyamide composite material, preparation method and application thereof
CN103242616A (en) * 2013-04-27 2013-08-14 上海锦湖日丽塑料有限公司 Aesthetics resin composition with fantasy colors and preparation method thereof
CN103788634A (en) * 2014-01-27 2014-05-14 上海日之升新技术发展有限公司 Low-shrinkage glass fiber reinforced PP/PA (Polypropylene/Polyamide) composite material composition and preparation method thereof
CN105086419A (en) * 2015-08-11 2015-11-25 东华大学 Fluorine-contained polyimide modified engineering plastic alloy capable of being electroplated and preparation method thereof
CN105176078A (en) * 2015-08-11 2015-12-23 东华大学 Electroplating biphenyl type maleimido polyimide modified engineering plastic alloy and preparation method thereof
CN106928678A (en) * 2015-12-30 2017-07-07 上海杰事杰新材料(集团)股份有限公司 A kind of lightweight electromagnetic shielding makrolon material and preparation method thereof
WO2018220083A1 (en) * 2017-06-01 2018-12-06 Albis Plastic Gmbh Compound
CN109957144A (en) * 2017-12-25 2019-07-02 北京化工大学 A kind of preparation method of electroplate conductive filler
CN111205512A (en) * 2020-01-08 2020-05-29 江苏科麦特科技发展有限公司 Conductive filler and preparation method of semiconductive shielding material thereof
CN111748202A (en) * 2020-06-09 2020-10-09 上海金山锦湖日丽塑料有限公司 High-performance wear-resistant conductive polyamide composite material and preparation method thereof
CN113278219A (en) * 2021-05-07 2021-08-20 广东力王新材料有限公司 Self-temperature-control heating sheet and preparation method thereof
CN114196107A (en) * 2021-12-02 2022-03-18 深圳市绚图新材科技有限公司 Conductive master batch containing silver composite conductive filler for 3D printing and preparation method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE428751T1 (en) * 2007-02-07 2009-05-15 Ems Chemie Ag FILLED POLYAMIDE MOLDING COMPOUNDS WITH REDUCED WATER ABSORPTION
KR101399920B1 (en) * 2007-09-13 2014-05-28 헨켈 아게 운트 코. 카게아아 Electrically conductive composition
EP3182417A1 (en) * 2014-08-14 2017-06-21 Alteco Korea Co. Ltd. Conductive complex and preparing method therefor

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8301248D0 (en) * 1982-02-08 1983-02-16 Potters Industries Inc Electroconductive element
CN101410456A (en) * 2006-04-04 2009-04-15 罗地亚管理公司 Electrically conductive composition based on polyamide matrix
CN102108209A (en) * 2009-12-28 2011-06-29 上海日之升新技术发展有限公司 Warpage-resistant antistatic reinforced nylon 66 composite and preparation method thereof
CN102585493A (en) * 2010-12-28 2012-07-18 上海杰事杰新材料(集团)股份有限公司 Nano particle/polyamide composite material, preparation method and application thereof
CN102311233A (en) * 2011-06-02 2012-01-11 中国科学院理化技术研究所 Surface chemical plating treatment process for hollow glass beads, plated metal hollow glass beads and application thereof
CN103242616A (en) * 2013-04-27 2013-08-14 上海锦湖日丽塑料有限公司 Aesthetics resin composition with fantasy colors and preparation method thereof
CN103788634A (en) * 2014-01-27 2014-05-14 上海日之升新技术发展有限公司 Low-shrinkage glass fiber reinforced PP/PA (Polypropylene/Polyamide) composite material composition and preparation method thereof
CN105176078A (en) * 2015-08-11 2015-12-23 东华大学 Electroplating biphenyl type maleimido polyimide modified engineering plastic alloy and preparation method thereof
CN105086419A (en) * 2015-08-11 2015-11-25 东华大学 Fluorine-contained polyimide modified engineering plastic alloy capable of being electroplated and preparation method thereof
CN106928678A (en) * 2015-12-30 2017-07-07 上海杰事杰新材料(集团)股份有限公司 A kind of lightweight electromagnetic shielding makrolon material and preparation method thereof
WO2018220083A1 (en) * 2017-06-01 2018-12-06 Albis Plastic Gmbh Compound
CN109957144A (en) * 2017-12-25 2019-07-02 北京化工大学 A kind of preparation method of electroplate conductive filler
CN111205512A (en) * 2020-01-08 2020-05-29 江苏科麦特科技发展有限公司 Conductive filler and preparation method of semiconductive shielding material thereof
CN111748202A (en) * 2020-06-09 2020-10-09 上海金山锦湖日丽塑料有限公司 High-performance wear-resistant conductive polyamide composite material and preparation method thereof
CN113278219A (en) * 2021-05-07 2021-08-20 广东力王新材料有限公司 Self-temperature-control heating sheet and preparation method thereof
CN114196107A (en) * 2021-12-02 2022-03-18 深圳市绚图新材科技有限公司 Conductive master batch containing silver composite conductive filler for 3D printing and preparation method thereof

Also Published As

Publication number Publication date
CN114656724A (en) 2022-06-24

Similar Documents

Publication Publication Date Title
CN109456538B (en) Polypropylene composite material with low density, low shrinkage and silver metal texture and preparation method thereof
CN112500644B (en) Conductive polypropylene composition and preparation method thereof
CN108264749A (en) A kind of high good surface carbon fiber reinforced polycarbonate composite material of flowing and preparation method thereof
KR101740275B1 (en) Resin composition for electromagnetic interference shielding
CN111391305B (en) Preparation method of polymer-based 3D printing electromagnetic shielding product
CN112778762B (en) Conductive PPS composite material and preparation method thereof
CN109749327A (en) A kind of lightweight, wear-resisting, automobile low noise ASA composite material and preparation method thereof
CN105566839A (en) High-performance anti-aging ABS/GF composite material and preparation method thereof
CN114656724B (en) Conductive master batch, electromagnetic shielding reinforced polyamide composition and application thereof
CN113667218A (en) Spraying-free polypropylene material and preparation method thereof
CN115558269B (en) Polycarbonate alloy and preparation method and application thereof
CN111040433A (en) Low-moisture-absorption wear-resistant flame-retardant conductive PA6 composite material and preparation method thereof
CN116751462A (en) High-elasticity TPV degradable material containing coffee grounds and preparation method and application thereof
CN112759924B (en) Ultrahigh-flow high-CTI halogen-containing flame-retardant nylon material and preparation method thereof
CN106700263A (en) Special polypropylene composite material with low after-shrinkage rate for automobile bumper and preparation method thereof
CN112708193B (en) Polypropylene composite material applied to waterway plate reinforcement and preparation method thereof
CN114736405B (en) Polyphenyl ether conductive master batch, low-CLTE nylon alloy and application thereof
CN114316434A (en) Low-warpage scratch-resistant soft-touch modified polypropylene composite material and preparation method thereof
CN107501748A (en) A kind of special low after-contraction PP composite material of car insurance bar and preparation method thereof
CN113773576A (en) Low-density low-dielectric-constant high-weather-resistance polypropylene material and preparation method thereof
CN113512303A (en) Liquid crystal polymer composite material and application thereof
CN115895142B (en) PVC cable material for 5G photoelectric integrated cable and preparation method and application thereof
CN114716750B (en) Polyolefin master batch and preparation method and application thereof
CN114736453B (en) Low-halogen flame-retardant PP material and preparation method and application thereof
KR101411021B1 (en) High modulus and impact composite for emi shielding

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant