JPH0341475Y2 - - Google Patents
Info
- Publication number
- JPH0341475Y2 JPH0341475Y2 JP1985192324U JP19232485U JPH0341475Y2 JP H0341475 Y2 JPH0341475 Y2 JP H0341475Y2 JP 1985192324 U JP1985192324 U JP 1985192324U JP 19232485 U JP19232485 U JP 19232485U JP H0341475 Y2 JPH0341475 Y2 JP H0341475Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- solder
- thick film
- dielectric
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 41
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 10
- 238000007789 sealing Methods 0.000 description 8
- 239000003989 dielectric material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985192324U JPH0341475Y2 (US20030204162A1-20031030-M00001.png) | 1985-12-16 | 1985-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985192324U JPH0341475Y2 (US20030204162A1-20031030-M00001.png) | 1985-12-16 | 1985-12-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62101234U JPS62101234U (US20030204162A1-20031030-M00001.png) | 1987-06-27 |
| JPH0341475Y2 true JPH0341475Y2 (US20030204162A1-20031030-M00001.png) | 1991-08-30 |
Family
ID=31147295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985192324U Expired JPH0341475Y2 (US20030204162A1-20031030-M00001.png) | 1985-12-16 | 1985-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341475Y2 (US20030204162A1-20031030-M00001.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2591999Y2 (ja) * | 1990-01-22 | 1999-03-10 | 日本電気株式会社 | 集積回路のパッケージの構造 |
-
1985
- 1985-12-16 JP JP1985192324U patent/JPH0341475Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62101234U (US20030204162A1-20031030-M00001.png) | 1987-06-27 |
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