JPH0341469Y2 - - Google Patents

Info

Publication number
JPH0341469Y2
JPH0341469Y2 JP17544086U JP17544086U JPH0341469Y2 JP H0341469 Y2 JPH0341469 Y2 JP H0341469Y2 JP 17544086 U JP17544086 U JP 17544086U JP 17544086 U JP17544086 U JP 17544086U JP H0341469 Y2 JPH0341469 Y2 JP H0341469Y2
Authority
JP
Japan
Prior art keywords
suction
wafer
heads
semiconductor
nozzles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17544086U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6380846U (me
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17544086U priority Critical patent/JPH0341469Y2/ja
Publication of JPS6380846U publication Critical patent/JPS6380846U/ja
Application granted granted Critical
Publication of JPH0341469Y2 publication Critical patent/JPH0341469Y2/ja
Expired legal-status Critical Current

Links

JP17544086U 1986-11-14 1986-11-14 Expired JPH0341469Y2 (me)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17544086U JPH0341469Y2 (me) 1986-11-14 1986-11-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17544086U JPH0341469Y2 (me) 1986-11-14 1986-11-14

Publications (2)

Publication Number Publication Date
JPS6380846U JPS6380846U (me) 1988-05-27
JPH0341469Y2 true JPH0341469Y2 (me) 1991-08-30

Family

ID=31114764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17544086U Expired JPH0341469Y2 (me) 1986-11-14 1986-11-14

Country Status (1)

Country Link
JP (1) JPH0341469Y2 (me)

Also Published As

Publication number Publication date
JPS6380846U (me) 1988-05-27

Similar Documents

Publication Publication Date Title
KR100766512B1 (ko) 반도체 칩의 박리 방법 및 장치
US9355882B2 (en) Transfer module for bowed wafers
US6109677A (en) Apparatus for handling and transporting plate like substrates
JP4652177B2 (ja) 半導体装置の製造方法およびその製造方法の実施に用いられる製造装置
JPH0341469Y2 (me)
JP2003229469A (ja) 半導体チップピックアップ装置
KR102401361B1 (ko) 다이 본딩 장치
TW202025275A (zh) 晶片退出裝置
CN215771081U (zh) 晶圆去边设备及去边晶圆
JPS61208234A (ja) 真空チヤツク
TWI784259B (zh) 晶圓片承載裝置
JPH0697215A (ja) 小物品群付貼着シートおよびそれが使用される小物品のピックアップ方法
JPH0376139A (ja) 半導体素子突上げ方法
CN108074848B (zh) 垫片、晶圆堆叠结构、吸附式移动装置与晶圆移动方法
JP2606890B2 (ja) 半導体チップのピックアップ方法
US7241099B2 (en) Center ball O-ring
KR102284150B1 (ko) 다이 본딩 방법 및 다이 본딩 장치
JP2619443B2 (ja) ペレットのピックアップ方法
KR100551353B1 (ko) 웨이퍼 핸들링 완드
JPH0624481A (ja) 電子部品収納用トレイ
JPH0128682Y2 (me)
JPH0717149Y2 (ja) コレツト
JP3202495B2 (ja) ダイボンディング装置
JPH10313045A (ja) 半導体チップの保持具
JPS63164236A (ja) 板状物保持装置